1X39 Search Results

Contextual Info: IB M 1 3 T 1 6 4 9 N C Preliminary 1M x 64 1 Bank SDRAM SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-line Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: I 10 CAS Latency 3 ! 12 j Units ! 3 jfcK I Clock Frequency

Contextual Info: IBM11T1645LP IBM11T1645NP 1M x 64 144 PIN SO DIMM Features • 144 Pin JEDEC Standard, 8 Byte Small Outline Dual In-line Memory Module with 8 Byte busses • Optimized for byte-write non-parity applications • System Performance Benefits: - Reduced noise 18 VSs/18VCc pins

Contextual Info: IBM11M1640L 1M X 64 DRAM MODULE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • Optimized for byte-write non-parity applications • System Performance Benefits: -Buffered inputs except RAS, Data -Reduced noise (32 VSsA /cc P^s)

Contextual Info: IB M 1 1 M 1 6 7 3 5 B IB M 1 1 M 1 6 7 3 5 C 16M x 72 DRAM MODULE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • Optimized for ECC applications • 16Mx72 Extended Data Out EDO Mode DIMMs • System Performance Benefits: - Buffered inputs (except RAS, Data)

Contextual Info: IB M 1 1 T 1 6 4 0 L P 1M x 64 144 PIN SO DIMM Features • 144 Pin JEDEC Standard, 8 Byte Small Outline Dual In-line Memory Module with 8 Byte busses • Optimized for byte-write non-parity applications • Performance: -60 ! -70 ! i^RAC ! R A S Access Tim e

Contextual Info: 10 3 \ + ( ~ ' 1 A CKT DIM, ' A" DIM." B ' C-+00 .4 5 SCKT S IZE IZE -.018 IX / (2.54) . too 1X21 IX 2 (2.54> . 100 ( 5 . 0 8 ) . 200 1X22 IX 3 ( 5 . 0 8 ) ,200 ( 7 . 6 2 ) . 300 1X23 IX 4 ( 7 . 6 2 ) , 300 (10, 16 ) ,400 EX24 IX 5 ( 1 0 ,1 6 ) .400 ( 1 2 ,7 0 )

G17 amphenol

Abstract: box header 2x10 right angle 1x2 pin header 2.54mm pitch G55H 2.54mm HEADER 2X7 2.54MM 1x5 pin header 2.54mm pitch G800 amphenol Post 2.54mm dual row straight pin header 2x40 G89011030020 AMPHENOL G821
Contextual Info: Amphenol Miniature Box Interconnects G800/1 2.54mm Pin Headers PCB Mount This series was designed to offer both Board to Board B2B and Board to Wire (B2W) solutions. The headers can be cut to size and are modular. Materials Contact Finish/Durability Housing

8735C

Contextual Info: IBM11N8645B IBM11N8735B IBM11N8645C IBM11N8735C 8M x 64/72 DRAM MODULE Features • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module • System Performance Benefits: -Non buffered for increased performance • 8Mx64, 8Mx72 Dual Bank Extended Data Out

1X359

Contextual Info: IBM11M1645L 1M X 64 DRAM MODULE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • 1 Mx64 Extended Data Out Page Mode DIMM • Performance: -60 -70 tRAC ; RAS Access Tim e 60ns ; 70ns tcAC ! CAS Access Tim e 20ns ! 25ns W | Access Tim e From Address

4*36 berg

Abstract: PM 9246
Contextual Info: r All rights strictly reserved. Reproduction or issue to third parties in any form whatever is not permitted without written authority from the proprietor. Property of B E R G ELECTRONICS Copyright BERG ELECTRONICS INC. BERG I L IC T R O N I C S Tous droits strictement reserves.

Contextual Info: Astronics Test Systems Inc. Racal Instruments 1260-75A/B OBSOLETE 100 MHz RF Multiplexer The Racal Instruments™ 1260-75 is ideal for switching wide-band signals up to 200 MHz. It is intended for use with function/pulse generators, universal counter/ timers, oscilloscopes and other instruments where high frequency or fast pulse

Contextual Info: Amphenol Miniature Box Interconnects G800/1 2.54mm Pin Headers PCB Mount This series was designed to offer both Board to Board B2B and Board to Wire (B2W) solutions. The headers can be cut to size and are modular. Materials Contact Finish/Durability Housing

Contextual Info: Amphenol Miniature Box Interconnects G800A 2.54mm Board Spacer Pin Headers PCB Mount This series was designed to offer both Board to Board B2B and Board to Wire (B2W) solutions. The headers can be cut to size and are modular. Materials Contact Finish/Durability

Contextual Info: Data sheet. QL KTB QL 403020 S4E0 Weidmüller Interface GmbH & Co. KG Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com Stainless steel enclosures for the use within explosion-risk zones

CMPZ4124

Abstract: CMZ5930B CMZ5945B CMZ5947B Transistor 1602c BC327/transistor bc547 bk 045 CMPZ4618 CMPZ4614 CMZ5948B CMZ5936B
Contextual Info: Small Signal Transistors U.S Specifications Preferred Series SOT-23 Case, 350mW (Continued on next page) b v Ce o b v ebo •SVcES 'CBO VCB *'CEV ® VCE (V) (V) (V) (V) (nA) j MIN M.N MIN MAX 1 hFE @ IC ® VCE (mA) MIN 1 General Purpose Amplifiers/Switches

80121

Abstract: 1X16
Contextual Info: 10 i 5 CKT S IZE IX 1 IX 2 IX 3 IX 4 IX 5 IX 6 IX 7 IX a IX 9 I X 10 IX I1 1X12 1X13 IXM 1X15 1X16 1X17 1X18 1X19 1X20 COLOUR •■ B L A C K . P I N S ' 0 . 6 3 5 / . 0 2 5 SO . B R A S S W IR E . PLATED AS PER D I M . " A" (2.54) (5.08) (7.62) (10.16)

1V100RK

Abstract: 1T330 1Z56 N2400 1C39RK N5600 1p39 1V75RK N220 N3300
Contextual Info: 1002 Reader's 6/21/99 11:36 AM Page 29 Leaded Temperature Compensating Capacitors • ■ ■ Available in NPO through N5600 dielectrics Specifically designed temperature coefficient characteristic curve Used in high shock and cross over applications Specifications

ci 9933 b

Abstract: Ic 9148 1X27 1X34 SDES-99000-0003 SDA-90120
Contextual Info: 10 t. 5 = - = h - - h CKT S IZ E |o I x — : O jO O j Q 0.10J/.004 (g Y (2.54 ±S:Vo ) WAFER- I 57. GLASS F I L L E D POLYESTER TO UL 9 4 v - 0 . COLOUR • BLACK. -$-10 (0.25)/.010 IX 1 IX 2 IX 3 IX 4 IX 5 IX 6 IX 7 IX 8 IX 9 I X 10 I X 11 1X12 1X13

quicktronic multiwatt qt-fh 2x14-35 230 240

Abstract: OSRAM quicktronic qt 2 FQ 2X80 OSRAM quicktronic de luxe wago 251 circuit diagram electronic ballast for 40W tube 1838 b infrared OSRAM halogen lamp H4 1838 ir receiver Osram qt 5 2x14-35 quicktronic qt-fh dim
Contextual Info: ECG for T5 fluorescent lamps Technical Guideline Electronic Control Gear to operate T5/Ø 16 mm fluorescent lamps ECG to operate T5-fluorescent lamps Features Product Overview Technical Details Instruction Manual Tender Documents FAQ May 2005 Contents 1. Introduction. 6

Contextual Info: IBM11M4735C IBM11M4735CB 4M x 72 D RAM M O D U LE Features • Optimized for ECC applications • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • System Performance Benefits: - • 4Mx72 Extended Data Out Page Mode DIMM • Performance: -50 !

Contextual Info: IBM13N2649JC IBM13N2739JC Preliminary 2M X 64/72 1 Bank Unbuffered SDRAM Module Features • 168 Pin emerging JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module • 2Mx64/72 Synchronous DRAM DIMM • Performance: CAS Latency jfcK I Clock Frequency

G800 amphenol

Abstract: 8636 infrared 3302
Contextual Info: G800/G804 series Amphenol Pin Headers Straight PCB Mount, 2.54mm Pitch Product Specification: Ordering Information: Materials and Finish Insulator: G800: Glass-reinforce thermoplastic, UL94V-0 rated, color-black G804: Glass-filled thermoplastic, UL-94V0 rated, resist to short term temperature in

1x5 berg connector

Contextual Info: r All rights strictly reserved. Reproduction or issue to third parties ir» ony form whatever is not permitted without written authority from the proprietor. Property of B E R G ELECTRONICS BERG ILICTRONICS ic Tous droits strictement reserves. Propriété de © B E R G ELECTRONICS.

Wavetek rms 225 manual

Abstract: dow-key 62 relay piezoelectric actuator plate vibration machining 3152b asea ri 5A relay relay ECCN
Contextual Info: EADS North America Test and Services COTS Product Guide v2 September, 2013 EADS North America Test and Services September 2013 Product Guide v2 Because we offer over 100 Commercial-Off-The-Shelf COTS products as well as the ability to modify these products, you can reduce the time and money it takes to get