209MM Search Results

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

JST 9FLH-SM1-GB-TB

Abstract: 9FLH-SM1-GB-TB JST Manufacturing 9FLH-SM1-GB-TB FH12A-50S-0.5SH gunze touch screen LQ035Q7DH06 FH12A-50S-0.5SH FH12A-50S-0.5SH
Contextual Info: RECORDS OF REVISION ＭＯＤＥＬ ＳＰＥＣ Ｎｏ：ＬＱ０３５Ｑ７ＤＨ０６ Ｎｏ 2005.06.17 2005.06.29 2005.07.15 2005.10.13 ：ＬＣＰ－０５０２０ NO. ＬＣＰ－０５０２０ PAGE 14 ＬＣＰ－０５０２０Ａ 20,21 2 ＬＣＰ－０５０２０Ｂ

W3H32M72E-XSBX

Abstract: calibration definition
Contextual Info: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm

Contextual Info: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4, 5, or 6 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm

Contextual Info: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: CENB1130 Universal Input 130 Watt Series ITE Switch-Mode Power Supply 3 Year Warranty •100-240VAC Universal Input •Meets EISA2007, CEC Efficiency Level V, EU EC No 278/2009 Phase II •Desktop Style •12V to 24V Single Output Models, up to 130W •Modified and Custom Designs Available

GT12-55AG

Abstract: 20hR lead gel battery Gaston Battery- GT12-55C
Contextual Info: GT -AG Range GT12-55AG 12V55AH/C20 AGM and Gel Range batteries uses the advanced GEL design which combines the best features of AGM and GEL construction into one battery line, and the purity fumed silica to form sulfuric acid thixotropic Gel and fills to the

ACPI BIOS 1.0b specification

Abstract: IT8512E ALC861 PR8800 OZ128 ITE IT8512e 3S2p bq Azalia Audio 945GM self lock BUTTON SWITCH 6 pin
Contextual Info: Chapter 1 Page 1 of 13 General System Description Chapter 1 General System Description 1 Hardware Specifications……………………………………………… 6 2 Software Specifications……….……………………………….……… 13 Page 2 of 13

Contextual Info: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges „ Organized as 32M x 64, user configurable as 2 x

W3H32M72E

Abstract: BA0BA12
Contextual Info: White Electronic Designs W3H32M72E-XSBX 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Programmable CAS latency: 3, 4, 5, or 6  Package:  Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm

Contextual Info: White Electronic Designs W3H64M72E-XSBX PRELIMINARY* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667*, 533, 400 „ Programmable CAS latency: 3, 4 or 5 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

W3H32M72E

Contextual Info: White Electronic Designs W3H32M72E-XSB2X Preliminary 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Programmable CAS latency: 3, 4, 5, or 6  Package:  Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: White Electronic Designs W3H32M72E-XSBX * 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4, 5, or 6 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm

W3H64M64E

Contextual Info: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch „

Contextual Info: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Write latency = Read latency - 1* tCK  Package:  Commercial, Industrial and Military Temperature Ranges  Organized as 32M x 64, user configurable as 2 x

LQ035Q7DH06

Abstract: FH12A-50S-0.5SH
Contextual Info: PRODUCT SPECIFICATIONS Liquid Crystal Displays Group LQ035Q7DH06 Advanced TFT TFT-LCD Module 240 x RGB × 320 pixels Spec. No.: LCP-05020B Spec. Issue Date: July 15, 2005 RECORDS OF REVISION ＭＯＤＥＬ ＳＰＥＣ Ｎｏ：ＬＱ０３５Ｑ７ＤＨ０６

Contextual Info: CENB1121 Universal Input 120 Watt Series ITE Switch-Mode Power Supply 3 Year Warranty •100-240VAC Universal Input •Meets EISA2007, CEC Efficiency Level V, EU EC No 278/2009 Phase II •Desktop Style •12V to 48V Single Output Models, up to 120W •Modified and Custom Designs Available

LQ035Q7DH02F

Abstract: LQ035Q7DH02 gunze touch screen FH12A-50S-0.5SH FH12A-50S-0.5SH GS21 GS42 GS63 LINE320 LCP-04049-2 C0040
Contextual Info: RECORDS OF REVISION ＭＯＤＥＬ ＳＰＥＣ Ｎｏ：ＬＱ０３５Ｑ７ＤＨ０２Ｆ Ｎｏ 2004.12 .2 ：ＬＣＰ−０４０４９ NO. ＬＣＰ−０４０４９ PAGE - SUMMARY - NOTE 1 st Issue LCP-04049−1 NOTICE This publication is the proprietary of SHARP and is copyrighted, with all rights reserved. Under the copyright

Contextual Info: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667*, 533, 400 „ Programmable CAS latency: 3, 4 or 5 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: AMIS-52150 Low-Power Transceiver with Clock and Data Recovery Data Sheet 1.0 Introduction The AMIS-52150 is a low-cost, ultra-low power single chip transceiver. It combines the proven amplitude shift key/on-off key ASK/OOK modulation technology of the AMIS-52000 with data clock recovery. The AMIS-52150 is targeted at narrow band

Contextual Info: W3H32M64E-XSBX 256MB – 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  42% I/O reduction vs FBGA

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: W3H32M64EA-XSBX ADVANCED* 256MB – 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm