21X21MM Search Results

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

net eN8

Abstract: TDN01 crpa 8B10B P802 TLK3118 XGXS quad video processor
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)

K297

Abstract: net eN8 TDN01
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)

8B10B

Abstract: P802 TLK3118 RXD17
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

prbs parity checker and generator

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

TDN01

Abstract: TDP01/TDN01 net eN8 acq2 RDN01 130nm CMOS
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

TDP01/TDN01

Abstract: TDN21 XAUI 8B10B P802 TLK3118 c20d10
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

SERDES 10G

Abstract: TDN01
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

8B10B

Abstract: P802 TLK3118
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

HBM W10

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)

net eN8

Abstract: 8B10B P802 TLK3118 10gb TX drive K283
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)

250 mhz IBM PowerPC Processor

Abstract: EMPPC740 interface 740 IBM PowerPC 740 reference manual emppc750 IBM PowerPC 250 EMPPC750L
Contextual Info: PowerPC 740TM and PowerPC 750TM Embedded Microprocessor Datasheet IBM CMOS 0.20 µm Copper Technology EMPPC740L and EMPPC750L Version 1.51 7/15/99 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the

PPC750L

Abstract: IBM PPC750L PPC740L PowerPC 740 reference manual 500C interface 740 IBM
Contextual Info: PowerPC 740 and PowerPC 750 Microprocessor Datasheet CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2 Version 1.1 10/9/2001 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the

PowerPC603r

Abstract: 21x21mm
Contextual Info: Tuesday, July 24, 2001 603r Reliability Data 603r Reliability & Qualification Data This is the reliability & qualification data for the PowerPC 603r microprocessor. The FIT and MTBF graphs for this device are located at the bottom of this page. Stress Results

intel DMA controller Unit

Abstract: 82545EM 1000BASE-X 82546EB Gigabit Ethernet MAC phy
Contextual Info: NP2104_Kenai64_PB.qxd 1/8/03 2:05 PM Page 1 Intel 82545EM Gigabit Ethernet Controller High-Performance Gigabit Connectivity for Servers and Workstations Product Brief The Intelligent Way to Connect • Footprint compatibility with Intel’s latest Gigabit connections allows for flexible designs

SiI7172

Abstract: sil5744 SII9233 SII9125 SiI9233A SII9013 SIL5723 SiI7189 SiI9022A sil9002
Contextual Info: DTV Products Enabling the secure delivery and presentation of high-quality HD content everywhere. PORT PROCESSORS Target Applications Input/Output Input Resolution HDCP TMDS EDID CEC Package Size Starter Kit SiI9181A Front panel of DTVs, A/V receivers,

130nm CMOS

Abstract: P802 TLK3118 MDIO clause 45 MDIO clause 45 specification
Contextual Info: TLK3118 REDUNDANT XAUI TRANSCEIVER SLLS609 − JANUARY 2004 D D D D D D D D D TLK3118 TDP/N[3:0]0 TCLK RDP/N[3:0]0 4 4 TD 31.0 TC(3.0) RCLK RD(31.0) TDP/N[3:0]1 RC(3.0) RDP/N[3:0]1 4 4 description The TLK3118 is a flexible, redundant XAUI serial transceiver that is compliant to 10-Gbps Ethernet XAUI

F81801U

Abstract: F81801U-I HDMI to VGA Cable pin diagram F81801 VT202 VT2021 HDMI to VGA Cable diagram 1-ch LVDS to vga ICS9UM709B H.264 codec
Contextual Info: Pico-ITX Series Board Placement DC-in LPC/SMBus/GPIO pin connector NEW VIA Eden X2 processor VIA EPIA-P900 Pico-ITX Eden™ X2 Board with Full HD Video Support, SATA, GigaLAN, USB, and VGA/HDMI /LVDS Front panel/PS2 pin connector VGA/USB pin connector

IBM25PPC750FX

Abstract: IBM25PPC750FXGB 750fx DH16 IBM 750L layout diagram of microprocessor RISCwatch 5K34 PowerPC 750FX
Contextual Info: IBM PowerPC® 750FX RISC Microprocessor Datasheet Support for 750FX Design Revision Level DD 2.X Version: 2.0 Preliminary June 9, 2003 ® Copyright and Disclaimer Copyright International Business Machines Corporation 2003 All Rights Reserved Printed in the United States of America June 2003

IBM25PPC750Fl

Abstract: 750FL
Contextual Info: IBM PowerPC® 750FL RISC Microprocessor Datasheet Support for 750FL Design Revision Level DD 2.X Version: SA14-2768-01 Preliminary May 10, 2005 ® Copyright and Disclaimer Copyright International Business Machines Corporation 2005 All Rights Reserved