21X25 Search Results

WED3C750A8M-200BX

Contextual Info: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight

TOSHIBA 2SA1213Y

Abstract: S-8520F50MC-BOJ-T2 AXS SOT IRF7606 MA737 S-8520E33MC-BJS-T2 S-8520E30MC-BJP-T2 S-8521F50MC-BQJ-T2 TM6201 S-8521F33MC-BPS-T2
Contextual Info: Contents Features . 1 Applications. 1 Block Diagram. 2 Selection Guide.

7410 frequency divider

Abstract: 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX
Contextual Info: White Electronic Designs WED3C7410E16M-XBX RISC Microprocessor Multichip Package The WED3C7410E16M-XBX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace,

MPC755

Abstract: WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8M-XBX
Contextual Info: White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:

Contextual Info: WED3C7410E16M-400BX HI-RELIABILITY PRODUCT RISC Microprocessor Multichip Package OVERVIEW *ADVANCED The WED3C7410E16M-400BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles,

2sa1213-y

Abstract: MARKING 1AB S-8520 S-8520A25MC-AVK-T2 S-8520A30MC-AVP-T2 S-8520A33MC-AVS-T2 S-8520A50MC-AWJ-T2 S-8521 S-8521A25MC-AXK-T2 TOSHIBA 2SA1213Y
Contextual Info: Contents Features. 1 Applications . 1 Block Diagram . 1 Selection Guide.

PowerPC603r

Abstract: 21x21mm
Contextual Info: Tuesday, July 24, 2001 603r Reliability Data 603r Reliability & Qualification Data This is the reliability & qualification data for the PowerPC 603r microprocessor. The FIT and MTBF graphs for this device are located at the bottom of this page. Stress Results

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

n713

Contextual Info: I dt Integrated Device Technology, Inc C M O S DUAL-PORT RAMS 16K 2K x 8-BIT) W ITH INTERRUPTS IDT 71321 SA/LA IDT 71421 SA/LA FEATURES: DESCRIPTION: • T h e ID T 7 1 3 2 1 /ID T 7 1 4 2 1 a re h ig h - s p e e d 2 K x 8 d u a l-p o rt s ta tic R A M s w ith in te rn a l in te rru p t lo g ic fo r In te rp ro c e s s o r c o m m u n ic a ­

Modified Coffin-Manson Equation Calculations

Abstract: Coffin-Manson Equation The PowerPC Microprocessor Family laptop pcb circuits MPC105 dram memory module 1993 IPC-SM-785
Contextual Info: Freescale Semiconductor, Inc. The Effect of Solder-Joint Temperature Rise on Ceramic-Ball-Grid Array to Board Interconnection Reliability: The Motorola PowerPC 603 and PowerPC 604™ Microprocessors and MPC105 Bridge/Memory Controller R. David Gerke Freescale Semiconductor, Inc.

Contextual Info: White Electronic Designs WED3C7410E16M-400BX RISC Microprocessor Multichip Package *PRELIMINARY OVERVIEW The WED3C7410E16M-400BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight

Contextual Info: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:

BGA-169

Abstract: TQFP112 BGA169 PQFP144 BGA-421 BQFP-84 qfp132 BGA196 PLCC18 BGA-256
Contextual Info: НАКОНЕЧНИКИ Изображения наконечников Наименование/размер A/B/C/D Наконечники для монтажа (для паяльника PS90) PS, 0.4 мм, конический PS, 0.8 мм, конический

Contextual Info: White Electronic Designs WED3C7558M-XBX RISC Microprocessor Multichip Package OVERVIEW The WED3C7558M-XBX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight computers, fire control systems and rugged critical systems.

Contextual Info: WED3C7558M-300BX HI-RELIABILITY PRODUCT RISC Microprocessor Module ADVANCED* OVERVIEW The WED3C7558M-300BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles,

Contextual Info: WED3C7558M-300BX HI-RELIABILITY PRODUCT RISC Microprocessor Module ADVANCED* OVERVIEW The WED3C7558M-300BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles,

Contextual Info: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight

WED3C755E8MF

Abstract: 90Pb WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8MF-XBX WED3C755E8M-XBX
Contextual Info: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:

WED3C7410E16M-400BX

Abstract: WED3C750A8M-200BX WED3C7558M-XBX 7410E
Contextual Info: White Electronic Designs WED3C7410E16M-400BX RISC Microprocessor Multichip Package *PRELIMINARY OVERVIEW The WED3C7410E16M-400BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight

Contextual Info: WED3C755E8M-XBX RISC Microprocessor Multichip Package OVERVIEW The WED3C755E8M-XBX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight computers, fire control systems and rugged critical systems.

toyota IC regulator built

Abstract: pin diagram ic 7420
Contextual Info: Rev.7.4_20 PWM CONTROL, PWM/PFM SWITCHING CONTROL STEP-DOWN SWITCHING REGULATOR CONTROLLERS S-8520/8521 Series The S-8520/8521 Series consists of CMOS step-down switching regulator-controllers with PWM control S-8520 Series and PWM/PFM switching control (S-8521 Series).

16X16 BIT RISC PROCESSOR

Contextual Info: White Electronic Designs RISC Microprocessor Multichip Package OVERVIEW WED3C7410E16M-400BX *PRELIMINARY The WED3C7410E16M-400BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight

Contextual Info: WED3C7558M-300BX HI-RELIABILITY PRODUCT RISC Microprocessor Multichip Package OVERVIEW The WED3C7558M-300BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles,

Contextual Info: WED3C7558M-300BX HI-RELIABILITY PRODUCT RISC Microprocessor Multichip Package OVERVIEW The WED3C7558M-300BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles,