25MAR99 Search Results

Contextual Info: 5 THIS DRAW ING IS U N PU BLISH ED. RELEASED FOR ALL COPYRIGHT BY TYCO ELECTRON ICS PU BLICATIO N RIGHTS - 4 2 3 REV ISI ONS ,- RESERVED. AG C O R PO R A T IO N. 53 LTR DESCRIPTIO N G2 /K ECO —07 —0 05 547 MATERIAL: HOUSING - THERMOPLASTIC U L 9 4 CENT ACT - PHESPHER BRENZE,

Contextual Info: Temic TST0922 S e m i c o n d u c t o r s SiGe-Power Amplifier for GSM 900 Flipchip Version Description The TST0922 is a monolithic integrated power amplifier IC in flipchip technology. The device is manufactured using TEMIC Semiconductors’ Silicon-Germanium

max 9694 e

Abstract: JIS-C-0021 EIA-364-29 S9 357 max 9694 Q 4615 VAC s4 DIMENSIONS so 44 s4 357 1-822473-4
Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - By - 6 5 RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. B1 -XPOSIOTION INDICATOR D 1 £ 2.54 TYP 0.25 TYP 0.15 X T o o o o o o o o o 0.45 TYP £ 0.15 X o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o

Contextual Info: 4 DRA WI N G THIS MADE IN THIRD DRAWI NG ANGL E IS UNPUBLISHED COPYRIGHT 19 2 3 PROJECTION RELEASED BY ANP FOR PUBLICATION INCORPORATED. ALL INTERNATIONAL LOC 19 RIGHTS AF RESERVED. DI 5T REV I 5 I ONS 50 ZONE LTR DESCRIPTION REL DATE PER 0 G 1 A - 0 0 7 8 - 9 9

Contextual Info: r n RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBUSHED. @ COPYRIGHT 19 BY AMP INCORPORATED. .19 ALL RIGHTS RESERVED. — Bl - ► 2.54 TYP - x - 1.27 TYP D — - Bl ► A A LOC DIST AG 53 REVISIONS TTTT “ BBCRiPTiöFT" REVISED PER EC 0 G3 C - 2 3 8 - 9 9

Contextual Info: DRAWING TH IS C MAD E IN DRAWING COPYRIGHT RE5ERVED. AMP THIRD 15 ANGLE PRO JECTIO N UNPUB L I 5 H E D . 19 BY PR0DUCT5 MAY AMP BE RELEASED F OR COVERED BY U.S. , 19 LOG DI ST R IG H T5 AF 50 PUBLICATION IN C O R P O R A TE D ,H A R R I 5BURG , PA. AND FOREIGN

3-822472-6

Abstract: 3-822472-4 822472-3 amp 822472 822472-2 822472-4 822472-6 MS-016 MS-018 Tube BY 127
Contextual Info: THIS DRAWING IS UNPUBUSHED. @ COPYRIGHT 19 RELEASED FOR PUBLICATION BY AMP INCORPORATED. .19 LOC ALL RIGHTS RESERVED. DIST AG REVISIONS TTTT SUPERSEDED - 3 2 TSffiT W T3ÄTT “ BBCRiPTiOFT" AH KK PER 0 S 1 D - 0 0 0 9 - 0 0 16FEB00 TOP VIEW A 1 \M A T E R IA L :

Contextual Info: 5 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. B 1 -X POSIOTION 1 INDICATOR D £ T 0 .2 5 TYP 0 .1 5 X 0 .4 5 TYP 0.1 5 X £ 2 .5 4 TYP o o o o o o o o o o o o o o o o o o o o o o o o o o o o

tyco pull force chart

Abstract: MTA-100 108-1050
Contextual Info: tljc a — - Electronics oa P ro d u c t 108 1050-1 - . 01Aug01 Rev B Specification ec 0990-0991-01 MTA-100 Wire-To-Wire Posted Connector System 1. SCOPE 1.1. Content This specification covers the performance, tests and quality requirements for the Tyco Electronics

787780-1

Contextual Info: 4 THIS DRAWI NG 7 3 IS UNPUBLI SHED. COPYRIGHT RELEASED BY 19 AMP I N C OR P O R A T E D . FOR P U B L I C A T I O N ALL RIGHTS 2 L OC ,19 RESERVED. BD DIST R E V IS IO N S 39 DESCRIPTION LTR REVISED PER EC 0S1A-0156-00 0.92 ± 0.08 X X - ► B X 4 /3\

Contextual Info: r 8 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 7 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST AG 53 REVISIONS LTR DESCRIPTION DATE REV PER 0G3C—0 7 6 2 —04 05 A PR 05 DWN APVD RB KW / K MATERIAL: HOUSING - THERMOPLASTIC U L9 4 V-O.

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. CW COPYRIGHT - By - 5 6 RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. D RECO M M ENDED D I FO O T P R IN T 6.40 1.00 REF 8.10 p n 3.20 J TYP 0.25 TYP 0.15 X C PCD -X- 0.45 TYP 0.15 X 2.54 TYP B Y Y r Y 8s8e 18482 8 9 8 0 8 1

Contextual Info: 4 THIS DRAWI NG 7 3 IS UNPUBLI SHED. COPYRIGHT RELEASED BY AMP 19 I NC OR P O R A T E D . FOR P U B L I C A T I O N ALL RIGHTS 2 LOC ,19 RESERVED. DIST revision 00 J DESCRIPTION LTR F 0.92 ± 0.08 4 REVI SED DATE PER EC 0 5 1 3 - 0 4 2 6 - 0 3 DWN APVD 1JAN04

107E

Abstract: MS-016 MS-018 822473-4 822473-5
Contextual Info: THIS DRAWING IS UNPUBUSHED. @ RELEASED FDR PUBLICATION COPYRIGHT 19 .19 ALL RIGHTS RESERVED. BY AMP INCORPORATED. A Bl •2 . 5 4 TYP A l - B 0 . 2 5 A _L Ì j ij im m j ij . 1 5 X Ç o o o 0 0 o c p o o o o - I - o o o o o o o o o I o m n n n n n m ip n n n n n n n E }

50LD5R

Abstract: 99005
Contextual Info: 4 THIS DRAWI NG IS COPYRIGHT 2 3 UNPUBLISHED. RELEASED 19 BY AMP I NC OR P O R A T E D . FOR ALL PUBLICATION RIGHTS , 19 LOC RESERVED. AG DI ST REVI SI ONS 53 LTR DESCRIPTION F D 1. OG50-0005-99 25 MAR 99 APVD LM CF COPPER 0 0 - 0 - 5 7 6 B E R Y L L I U M COP P E R

Contextual Info: LM6125/LM6225/LM6325 High Speed Buffer General Description The LM6125 family of high speed unity gain buffers slew at 800 V/µs and have a small signal bandwidth of 50 MHz while driving a 50Ω load. These buffers drive ± 300 mA peak and do not oscillate while driving large capacitive loads. The

Contextual Info: Tem ic TST0922 Semiconductors SiGe-Power Amplifier for GSM 900 Flipchip Version Description The TST0922 is a monolithic integrated power amplifier IC in flipchip technology. The device is manufactured using TEMIC Semiconductors’ Silicon-Germanium (SiGe) technology and has been designed for use in GSM