260TC Search Results

LM3999Z

Abstract: LM3999 9V-to-40V Scans-00100106
Contextual Info: LM3999 «W EB» — 455 N S I r 20mA I f 0.1mA V t s - 4 36V T em p. Stabilizer T 0pt 0 — 7 o r Tstg —55 -¡-150‘C Tpin 260TC • lOsec as P la s tic P a c k a g e B O TT O M VIEW O rd e r N u m b e r L M 3 9 9 9 Z (0 -c a m Taa 70 c > Æ &

LM3999Z

Abstract: slma LM3999 TAG 695
Contextual Info: LM3999 «W EB» — 455 N S I r 20mA I f 0.1mA V t s - 4 36V T em p. Stabilizer T 0pt 0 — 7 o r Tstg —55 -¡-150‘C Tpin 260TC • lOsec as Pla stic P a c ka ge BOTTOM VIEW O rd e r N u m b e r L M 3 9 9 9 Z (0 -c a m Taa 70 c > Æ & ft- 0.6m A â//fS10m A

Contextual Info: B D C E NOTES: 1. MATERIAL 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP., U L94V -Q ;C 0L0R IS BLACK. 1.2 CONTACT: COPPER ALLOY Circuit N0.2 2. FINISH: 2.1 CONTACT: GOLD FLASH OVER ALL 50u “ MIN. NICKEL UNDERPLATING OVERALL 3. IR REFLOW CAPABLE TO 260TC PER A CES SPEC.

RPCF

Abstract: 260TC 023U
Contextual Info: June 1998 PRELIMINARY M icro Linear ML6696 10OBASE-X Fiber Physical Layer GENERAL DESCRIPTION FEATURES The M L6696 implements the complete physical layer o f the Fast Ethernet 100BASE-X standard for fiber media. The device provides the M il Media Independent Interface for

260TC

Abstract: CCD311
Contextual Info: CCD311 130/260 BIT ANALOG SHIFT REGISTER GENERAL DESCRIPTION - The CCD311 is a buried channel charge coupled device intended to be uiad in analog signal processing systems that include delay and temporary storage of analog information. CONNECTION! WPCTOPV

Contextual Info: 1. M e c h a n ic a l D im e n sio n s: 2 . S ch em atic: o 0 .2 6 0 Max 6 .6 0 Max X a LD CO un Q in o o 3. E l e c t r i c a l S p e c ific a tio n : o OCL: 10uH ±20% @ 1 0 0 K H z 0 .1 V DCR: 0 .0 7 5 Ohm s Max Q: 4 0 Min @ 20 0K H z 5RF: 3 8M H z Typ

Contextual Info: NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC. HIGH TEMP., UL94V-0; COLOR:NATURE IVORY . 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL: COPPER ALLOY 2. FINISH: 2.1 CONTACT: GOLD FLASH PLATING OVERALL 50u" MIN. NICKEL UNDERPLATING OVERALL. 2.2 FITTING NAIL: 100u” MIN. TIN PLATING ON SOLDER TAILS.