275MIL Search Results

SSOP44J

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 44Pin Plastic SSOP44J 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the names

TSSOP30

Contextual Info: SANYO Semiconductor Thin Shrink Small Outline Package 30Pin Plastic TSSOP30 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SSOP24J

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 24Pin Plastic SSOP24J 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

HSSOP16

Contextual Info: SANYO Semiconductor Shrink Small Outline Package with Heat Sink 16Pin Plastic HSSOP16 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SSOP44

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 44Pin Plastic SSOP44 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SSOP36

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic SSOP36 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SSOP30

Abstract: SSOP30 package
Contextual Info: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic SSOP30 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 44Pin Plastic SSOP44JR 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic SSOP36J 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

SSOP24

Abstract: SSOP-24
Contextual Info: SANYO Semiconductor Shrink Small Outline Package 24Pin Plastic SSOP24 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

24P2E-A

Abstract: 24P2-E SSOP24-P-275-0 24P2E
Contextual Info: 24P2E-A Plastic 24pin 275mil SSOP EIAJ Package Code SSOP24-P-275-0.65 JEDEC Code – Weight g 0.12 Lead Material Alloy 42 e 13 E Recommended Mount Pad F Symbol 1 12 A A2 A1 D L L1 HE e1 I2 24 b2 e y c b Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

SSOP24J

Abstract: SSOP-24J
Contextual Info: SANYO Semiconductor Shrink Small Outline Package 24Pin Plastic SSOP24J 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

HSOP28

Contextual Info: SANYO Semiconductor Small Outline Package with Heat Sink 28Pin Plastic HSOP28 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

TSSOP30

Contextual Info: SANYO Semiconductor Thin Shrink Small Outline Package 30Pin Plastic TSSOP30 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

SSOP36

Abstract: SSOP-36
Contextual Info: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic SSOP36 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

SSOP44K

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 44Pin Plastic SSOP44K 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

SSOP24

Abstract: SSOP-24
Contextual Info: SANYO Semiconductor Shrink Small Outline Package 24Pin Plastic SSOP24 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

TSSOP-36

Abstract: TSSOP36
Contextual Info: SANYO Semiconductor Thin Shrink Small Outline Package 36Pin Plastic TSSOP36 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic SSOP36J 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SSOP44

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 44Pin Plastic SSOP44JR 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SSOP44K

Abstract: 44PIN
Contextual Info: SANYO Semiconductor Shrink Small Outline Package 44Pin Plastic SSOP44K 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SSOP44J

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 44Pin Plastic SSOP44J 275mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

SSOP30-P-275-0

Abstract: SSOP30-P
Contextual Info: 30P2E-A Plastic 30pin 275mil SSOP EIAJ Package Code SSOP30-P-275-0.65 JEDEC Code – Weight g 0.15 Lead Material Alloy 42 e 16 E F Recommended Mount Pad Symbol 1 15 A A2 D y b L e A1 L1 HE e1 I2 30 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters

HSOP28

Contextual Info: SANYO Semiconductor Small Outline Package with Heat Sink 28Pin Plastic HSOP28 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the