275T41S Search Results

KA3213

Abstract: KA32 KS5112 30A10 3A29
Contextual Info: DENSE-PAC 32 Megabit CMOS DRAM DPD2MX16M2H3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: The DPD2MX16M2H3 "STA C K" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for

32 pin eprom cdi

Contextual Info: DENSE-PAC MICROSYSTEMS 4 M EGABIT FLASH EEPROM DPZ128X32VI/DPZ128X32VIP DESCRIPTION: T he D P Z 128X32V I/V IP is a 4 m egabit C M O S FLA SH Electrically Erasable and Programmable nonvolatile memory module. The module is built with four 128K x 8 FLASH m em ory devices. The D P Z 1 2 8 X 3 2 V I/V IP can be user

Contextual Info: DENSE-PAC 4 Megabit CMOS SRAM DPS128X32V3 M I C R O S Y S T E M S DESCRIPTION: The DPS128X32V3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: DENSE-PAC 4 MEGABIT FLASH EEPROM M ICROSYSTEM S D P Z 1 2 8 X 3 2 V I/D P Z 1 2 8 X 3 2 V IP DESCRIPTION: The D P Z 128X32VI/VIP is a 4 megabit CMOS FLASH Electrically Erasable and Programmable nonvolatile memory module. The module is built with four 128K x 8 FLASH

Contextual Info: DENSE PAC 4 Megabit High Speed CMOS SRAM DPS256X16Cn3/DPS256X16Bn3 MICROSYSTEMS DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: DENSE-PAC 8 MEGABIT FLASH EEPROM DPZ256X32IV3 M I C R O S Y S T E M S D E S C R IP T IO N : The D P Z 2 5 6 X 3 2 IV 3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadiess Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

Contextual Info: 16 Megabit High Speed CMOS SRAM D E N S E - P A C M I C R O S Y S T E MS DPS512X32MFn3 ADVANCED INFORMATION D E S C R IP T IO N : SLCC Stack T he DPS512X32M Fn3 High Speed SRA M " S T A C K " modules are a re vo lu tio n a ry n e w m em ory subsystem using D ense-Pac

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CM OS SRAM D P S 5 1 2 S8 B N DESCRIPTIO N: T he DPS512S8BN is a high speed m ilita ry 512K X 8 high-density, static RAM m od ule comprised o f four high speed ceram ic 128K X 8 m o n o lith ic SRAM's, an advanced high-speed CMOS decoder and de cou pling

Supply Control LAF 0001

Abstract: laf 0001 power laf 0001 61YL RT1L 28X1 050I
Contextual Info: DENSE-PAC 2 M EGABIT FLASH EEPROM M I C R O S Y S T E M S DPZ128X161Y/l IY/IJY/l H Y/lA3 D ESCRIPTIO N : T he DPZ1 2 8 X 1 6 1Y/l IY/IJ Y/l H Y/l A3 d evice s are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers

Contextual Info: DENSE-PAC 4 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S _ DPS512X8MKN3 PRELIMINARY D E S C R IP T IO N : The DPS512X8MKN3 High Speed SRAM "STAC K " devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable

1431 T

Abstract: 56TAL
Contextual Info: DENSE-PAC 16 Megabit CM O S SRAM M I C R O S Y S T E M S D P S 5 1 2 X 3 2 M L /D P S 5 12 X 3 2 M W PR ELIM IN A R Y D ESCRIPTIO N : P IN -O U T DIAGRAM The DPS512X32M L/DPS512X 32M W is a 512K x 32 high density, high-speed Static Random Access M em ory SRAM module, intended

30A10

Abstract: H1163
Contextual Info: DENSE-PAC 8 Megabit CMOS DRAM MICROSYSTEMS DPD512X16M2H3 PRELIMINARY D E S C R IP T IO N : The D PD 5 1 2X16M2H3 "S T A C K " module is a re vo lu tio n ary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for surface

30A10

Abstract: ME17 Dense-Pac Microsystems
Contextual Info: DENSE-PAC 16 Megabit CMOS DRAM MICROSYSTEMS DPD1MX16M2H3 PRELIMINARY D E S C R IP T IO N : T he D P D 1 M X 1 6 M 2 H 3 " S T A C K " m odule is a r e v o lu tio n a ry n e w m em o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLC Q stacked and leaded for surface

Contextual Info: 8 Megabit CMOS SRAM D E N S E - P A C MICROSYSTEMS DPS1MS8U D E S C R IP T IO N : The DPS1M S8U is a 1Meg X 8 high-density, low-power static RAM module comprised of eight 128K X 8 monolithic SRAM's, an advanced high-speed C M O S decoder and decoupling capacitors surface mounted