300RJ Search Results

Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

panasonic inverter dv 707 manual

Abstract: 018T A423 Mosfet FTR 03-E Arcotronics 1.27.6 nsl 7053 mkp DX 3500 manual Honeywell DBM 01A Polyester capacitors 823k 250V SPRAGUE powerlytic 36Dx sprague 68D
Contextual Info: PASSIVE COMPONENTS Resistors Networks and Arrays Bourns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 590, 591, 592 Caddock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593 CTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594

LAD1 12v 8 pin relay

Abstract: 23a1ad relay lad1 lad1 12v relay CJD1 lm 5532 Intel i960J Conversion from PCI 9054 AB to AC
Contextual Info: / y y Jr iiillIK^ PCI 9054 PCI I/O Accelerator November 1998 Version 1.0 l20 Compatible, CompactPCI Hot Swap Friendly PCI Bus Master Interface Chip _ for Adapters and Embedded Systems FEATURES • 3.3V, 5V tolerant PCI and Local signaling supports

Contextual Info: SPECIFICATIONS Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling

transistor SMD 352a

Abstract: capacitor 33j 6kv 12w SOT 23 package marking code smd transistor marking 12W 33J 6KV smd 352A 25 ohm 3 watt rheostat United Chemi-Con SME series United Chemi-Con KMC capacitor 6kv 22j
Contextual Info: POWER RESISTORS CURRENT SENSE HIGH VOLTAGE HIGH ENERGY HEAT SINKABLE SURFACE MOUNT COMPONENT SELECTOR 4000G Revised July 16, 2010 1600 Golf Road, Suite 850 | Rolling Meadows, IL 60008 Phone: 866-964-6483 Fax: 847-574-7522 ohmite.com email: sales@ohmite.com

Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling

5R00J

Abstract: TA810 TA203 TA205 TA207 TA303 TA310
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

5R00J

Abstract: ta207 100rj 50w 100rj TA303 50000 ohm 55 watt
Contextual Info: Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling

Contextual Info: TA Series Power Chip Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is

ta303pa

Abstract: TA810PW TA310P TA205P
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: PRELIMINARY May 1999 C H IL D S E M I C O N D U C T O R TM ACE1101 Arithmetic Controller Engine ACEx for Low Power Applications • 16-bit multifunction timer General Description ■ On-chip oscillator — No external components — 1p.s instruction cycle time

LTA810

Abstract: TA025 TA303PA ta207 TA305 L1085
Contextual Info: Thick Film Alumina TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is

5R00J

Abstract: 1K50J 300RJ 470RJ 75K0J
Contextual Info: O hm ite Power Chip Resistors are thick film on alum ina oxide substrates w ith copper plated silver conductors, Ruthenium oxide resistance m aterial, and a glass passivation layer. T hese resistors offer very low inductance 50nh m easured at 1MHz and outstanding power

300RJ

Abstract: TA203 TA205 TA207 TA303 TA310 TA810
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

transistor SMD 352a

Abstract: smd 352A capacitor 6kv 22j ge 205a 0201 footprint RW67V 12w SOT 23 package marking code SPECIFICATION OF SCR 207A CC21AA-D22W-OFA 353A
Contextual Info: POWER RESISTORS CURRENT SENSE HIGH VOLTAGE HIGH ENERGY HEAT SINKABLE SURFACE MOUNT COMPONENT SELECTOR 4000G Revised January 8, 2009 1600 Golf Road, Suite 850 | Rolling Meadows, IL 60008 Phone: 866-964-6483 Fax: 847-574-7522 ohmite.com email: sales@ohmite.com

300RJ

Abstract: TA203 TA205 TA207 TA303 TA310 TA810
Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

4K50

Contextual Info: Ohmite Power Chip Resistors are thick film on alumina oxide substrates with copper plated silver conductors, Ruthenium oxide resistance material, and a glass passivation layer. These resistors offer very low inductance 50nh measured at 1MHz and outstanding power

Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Power Chip Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is

Contextual Info: Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling