30U70 Search Results

Contextual Info: 87693 10 28.93 MAX. — I i P.0.25 T 1. CARD SLOT ACCEPTS 1.27i0.10 MODULE THICKNESS. [MEASURED OVER P.C.PADS 2. RECOMMENDED MODULE LAYOUT SHALL BE PER SHEET 2. THIS DESIGN IS BASED ON DESIGN OBJECTIVES 3. RECOMMENDED PLATING ON MODULE PADS: 30u70.76uM AND IS STRICTLY TEN TA TIVE. IT MAY CHANGE

Contextual Info: 87693 10 28.93 MAX. — I P .0.25 T NOTES: 1. CARD SLOT ACCEPTS 1.27i0.10 MODULE THICKNESS. [MEASURED OVER P.C.PADS 2. RECOMMENDED MODULE LAYOUT SHALL BE PER SHEET 2. THIS DESIGN IS BASED ON DESIGN OBJECTIVES 3. RECOMMENDED PLATING ON MODULE PADS: 30u70.76uM

Contextual Info: 12 11 10 7 8 74320 NOTES: 1.MATERIALS: FRONT SHIELD — DEEP DRAW STEEL. BACK SHIELD — STAINLESS STEEL. HOUSING —GLASS FILLED POLYMER,WHITE/NATURE.UL 94V-0. TAIL ALIGNER — GLASS FILLED POLYMER.WHITE/NATURE.UL 94V -0. CONTACT — COPPER ALLOY. MICROCROSS GROUND — COPPER ALLOY.

A7910

Contextual Info: 10 2.00 ± 0 .0 8 NON-ACCUM 0 0 .7 1 1 0 .0 8 ROW A RECOMMENDED PCB LAYOUT ROW B NOTES: 1 HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK 2) TERMINAL MATERIAL: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PART NUMBERS AND OVERALL DIMENSIONS, SEE SHT 3 FOR VOIDS.

SD-87693-202

Contextual Info: 10 •141.00 ■ I- 7.50 | 2:.6V .6 v j|[ ianonooononononnnnnononononoD onooononoon i ODOQOQDQOQOQOQODODOQOQOQOQOQDQOQDOOQOQDDm PIN 1- ■165.0 MAX. ■148.0 MAX.

Contextual Info: 10 2.00 ±0.08 NON-ACCUM. 0 0.71 ±0.08 2.00 ±0.08 ROW 4.19 A RECOMMENDED PCB LA Y O U T 2.00 NOTES: 1 HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK 2) TERMINAL MATERIAL: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PART NUMBERS AND OVERALL DIMENSIONS, SEE SHT 3 FOR VOIDS.

Contextual Info: 10 •141.00 ■ I- 7.50 l » n n 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D G D 0 D 0 D 0 D B D D D D D D D D D Iin 2 .6 V linODODODODODODODODODODODODODODODODOaODnni i DGDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDGG

Contextual Info: 10 •B - 2.0 0 ±0.08 NON-ACCUM. -A 0 0.71 ±0.08 ROW A 4.19 2.00 mm RECOMMENDED PCB LAYOUT ROW B 25 NOTES: 1 HOUSING M ATER IAL: G LA S S FILLED HIGH TEMP THERM OPLASTIC, COLOR: BLACK 2) TERM IN AL M ATER IAL: PHOSPHOR BRONZE SEE TAB LE 7) 3) S E E S H T 2 & 3 FOR CKT SIZE, P A R T NUMBERS

79107-7024

Abstract: 79107-7012 79107-0054
Contextual Info: 10 2.0 0 ± 0.08 0 0 .7 1 1 0 .0 8 NON-ACCUM a 1/ NJ Tr + i| ¡I I f / n •4 I ROW A I ROW B / I RECOMMENDED PCB LAYOUT f a SECTION B-B NOTES: 1) HOUSING M ATE R IA L: G LA S S FILLED HIGH TEMP THERM OPLASTIC, COLOR: BLACK 2) TERM IN AL M ATER IAL: PHOSPHOR BRONZE

Contextual Info: 10 2 .0 0 ± 0.08 N O N -A C C U M . t0 .0 8 2.0 0 ±0.08 ROW A R E C O M M E N D E D PCB L A Y O U T NOTES: 1 HODSING NATERIAD: GDASS FIDDED HIGH TENP THERNOPDASTIC, CODOR: BDACK 2) TERMINAD MATERIAD: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PA R T NDNBERS

Contextual Info: 12 10 11 8 74320 NOTES: - 3 6 .8 3 - f I 18 62 7 FRONT SHIELD — DEEP DRAW STEEL. 9 w •Jrt 18 33 1.MATERIALS: - BACK SHIELD — STAIN LES S STEEL. HOUSING — G LASS FILLED POLYMER,W HITE/NATURE,UL 9 4 V -0 .

Contextual Info: 10 2.0 0 ± 0.08 NON-ACCUM. R OW 0O.7UO.O8 A RECOMMENDED PCB LAYOUT ROW B NOTES: 1 HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK 2) TERMINAL MATERIAL: PHOSPHOR BRONZE 3) SEE SHT 2 8, 3 FOR CKT SIZE, PART NUMBERS AND OVERALL DIMENSIONS, SEE SHT 4 FOR VOIDS.

Contextual Info: 12 11 10 7 8 74320 NOTES: 1. MATERIALS: FRONT SHIELD — DEEP DRAW STEEL. BACK SHIELD — STA IN LESS STEEL. HOUSING — G LASS FILLED POLYMER.WHITE/NATURE.UL 94V-0. TAIL ALIGNER — G LASS FILLED POLYMER,WHITE/NATURE.UL 94V-0. CONTACT — COPPER ALLOY. MICROCROSS GROUND — COPPER ALLOY.

cd 1619

Contextual Info: 10 2.0 0 ± 0.08 0 0 .7 1 1 0 .0 8 NON-ACCUM / 1/ n / NJ Tr + i| ¡I I f a •4 I ROW A I ROW B I RECOMMENDED PCB LAYOUT f a SECTION B-B SEE TAB LE 7) ■(2.00) PLATING OPTION: 0.38 "O " NOTES: 1) HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK