312 BGA Search Results

Contextual Info: SIEMENS BGA 312 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 Q-gain block • 11 dB typical gain at 1.0 GHz • 9 dBm typical P.\ ¿b at 1 0 Gl• 3 dB-bandwidth: DC to 2.0 Gl RFINoCircuit Diagram EHA07312 Type Marking Ordering Code BGA 312 BMs

mmic-amplifier

Abstract: VPS05178 337 BGA
Contextual Info: BGA 312 Silicon Bipolar MMIC-Amplifier 3
Cascadable 50 -gain block
11 dB typical gain at 1.0 GHz 4
9 dBm typical P -1dB at 1.0 GHz
3 dB-bandwidth: DC to 2.0 GHz 2 1 RF IN RF OUT/Bias 1 VPS05178 3 Circuit Diagram 2, 4 GND EHA07312 Type Marking BGA 312

BU-64843X

Abstract: BU-64843H MN-6186X-002 MILSTD-1773 BU-64843T Mini-ACE Users Guide J-11-J1 MIL-STD-1773 MN-6186X-001 BU-64843
Contextual Info: Make sure the next Card you purchase has. BU-64843X/64863X TOTAL-ACE COMPLETE MIL-STD-1553 SOLUTION DATA SHEET FEATURES • World's First, Fully Integrated, MIL-STD-1553 Terminal & Transformer Solution • Small Package 312 Ball BGA 1.1 in x 0.6 in or 1.1 in x 0.7 in

BU-64843T8-E02

Abstract: MN-6186X-001 DDC TOTAL-ACE BU-64843T BU64843T8 MIL-STD-1773 DS-BU-648X3X-D BU-64843T8-600 MN-6186X-002 MILSTD-1773
Contextual Info: Make sure the next Card you purchase has. BU-64843X TOTAL-ACE COMPLETE MIL-STD-1553 SOLUTION DATA SHEET FEATURES • World's First, Fully Integrated, MIL- STD-1553 Terminal & Transformer Solution • Small Package 312 Ball BGA 1.1 in x 0.6 in • Fully Compatible with Enhanced Mini-

657-10ABP

Abstract: 667-10ABPP TO220 HEATSINK 637-15ABPE 651b deltabond 152 XX1371 XX1703 657-25ABPNE 657-15ABPE
Contextual Info: 797-2012.qxp:QuarkCatalogTempNew 9/5/12 7:08 AM Page 797 7 Extrusions, Heat Sinks and Accessories XX1024 XX1371 ᭤ Aluminum Mfr.’s Type Extrusion Type Dimensions WxH×T Inches Nat. Conv. Qsa (°C/W) (1.312) (312) (1.335) (.090) (.190) (.375) (1.000)

PT80

Abstract: OG516
Contextual Info: ispLSI 8840V 3.3V In-System Programmable SuperBIG High Density PLD Features Functional Block Diagram • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 3.3V Power Supply — 45,000 PLD Gates/840 Macrocells — 192-312 I/O Pins Supporting 3.3V/2.5V I/O

s11 stopping compound

Abstract: as15 4804B
Contextual Info: LT4420 LT4420 DEVICES INCORPORATED DEVICES INCORPORATED FEATURES ❑ ❑ ❑ ❑ 155 MHz Max Data Rate 312 MHz Max Core Clock Rate 16-bit Data and Coefficients Paths 64-Tap FIR Filter, Cascadable for More Filter Taps Dual 32-Tap Transversal FIR Filter DESCRIPTION

BFM 17

Abstract: AC30 AG30 PT80
Contextual Info: ispLSI 8840 In-System Programmable SuperBIG High Density PLD Features Functional Block Diagram • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 5V Power Supply — 45,000 PLD Gates/840 Macrocells — Up to 312 I/O Pins Supporting 3.3V/5V I/O

MMIC SOT 89 marking CODE

Abstract: Q62702-G0042 VPS05178 BMS 13-58 Type 1
Contextual Info: BGA 312 Silicon Bipolar MMIC-Amplifier Preliminary data 3 • Cascadable 50 Ω-gain block • 11 dB typical gain at 1.0 GHz 4 • 9 dBm typical P -1dB at 1.0 GHz • 3 dB-bandwidth: DC to 2.0 GHz 2 1 RF OUT/Bias 1 RF IN VPS05178 3 Circuit Diagram 2, 4 GND

PT80

Contextual Info: ispLSI 8840V Features Functional Block Diagram • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 3.3V Power Supply — 45,000 PLD Gates/840 Macrocells — 192-312 I/O Pins Supporting 3.3V/2.5V I/O — 1152 Registers — High-Speed Global and Big Fast Megablock BFM

AC30

Abstract: AG30 PT80 G-218
Contextual Info: ispLSI 8840 Features Functional Block Diagram • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 5V Power Supply — 45,000 PLD Gates/840 Macrocells — Up to 312 I/O Pins Supporting 3.3V/5V I/O — 1152 Registers — High-Speed Global and Big Fast Megablock BFM

Contextual Info: ISPLSI 8840 In-System Programmable SuperBIG High Density PLD • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC 5V Power Supply 45,000 PLD Gates/840 Macrocells Up to 312 I/O Pins Supporting 3.3V/5V I/O 1152 Registers High-Speed Global and Big Fast Megablock BFM Interconnect

492-Ball

Abstract: e2cmos technology
Contextual Info: Introduction to ispLSI 8000 and 8000V Families ❑ Deterministic Performance ❑ Up to 1440 Total Registers – the Industry’s Largest CPLD! ❑ High Density 32,000 - 60,000 PLD Gates ❑ 3.3V I/O and 2.5V Outputs ❑ State-of-the-Art BGA Packaging

tba 480

Abstract: e2cmos technology 492-Ball
Contextual Info: Introduction to ispLSI 8000 and 8000V Families ❑ Deterministic Performance ❑ Up to 1440 Total Registers – the Industry’s Largest CPLD! ❑ High Density 32,000 - 60,000 PLD Gates ❑ 3.3V I/O and 2.5V Outputs ❑ State-of-the-Art BGA Packaging

BGA 256 PACKAGE power dissipation

Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Contextual Info: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced

MN-6186X-001

Abstract: BU-69092 BU-64843T BU648 MN-69092SX-002 BU-648 BU-65863 DS-BU-64843T STANAG 3838 MIL-STD-1553 ACE manual
Contextual Info: Total-ACE Complete MIL-STD-1553 Solution Product Brief Model: BU-6X8X3T/U/H/i8 Save board space and simplify your 1553 design and layout with the world's first fully integrated MIL-STD-1553 terminal, complete with 1553 protocol, memory, transceivers, and isolation transformers—all in one small plastic BGA package

ispMACH M4A3

Abstract: ISPGDX160A ispGAL22V10
Contextual Info: 208-Ball fpBGA 256-Ball fpBGA 100-Ball caBGA 144-Ball fpBGA 49-Ball caBGA Fine Pitch BGA 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch 23.00 x 23.00 mm 1.0 mm pitch BGA 27.00 x 27.00 mm

Contextual Info: SIEMENS BGA312 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 i2-gain block • 11 dB typical gain at 1.0 GHz • 9 dBm typical P.-idB at 1 0 Gl• 3 dB-bandwidth: DC to 2.0 Gl RF IN o- Circuit Diagram EHA07312 Type Marking Ordering Code

NF 841

Abstract: BGA312 Q62702-G0042 IS21K 2400 siemens
Contextual Info: SIE M E N S BGA312 Silicon Bipolar MMIC-Amplifier Preliminary Data Cascadable 50 i2-Gain Block 11 dB typical Gain at 1.0 GHz 9 dBm typical at 1.0 GHz 3 dB-Bandwidth: DC to 2.0 GHz Plastic Package T ype M arking BGA312 BMs O rde rin g c o d e 8-mm taped Q62702-G0042

smd transistor 312

Abstract: rf amplifier siemens 10 ghz SIEMENS MICROWAVE RADIO 8 GHz BGA310 BGA312 BGA318 Siemens MMIC Polytechnic diagram radar circuit SMX-1
Contextual Info: APPLICATIONS MMICs Gerhard Lohninger ● Knut Brenndörfer Jakob Huber ● Thomas Pollakowski Monolithic broadband amplifiers go mobile In wireless communications, there is a distinct trend toward more compact and lighter terminals. This means that the components used

DSP56300

Abstract: gui56300 DSP56000 DSP56600 DSP563XXEVME
Contextual Info: Freescale Semiconductor, Inc. DSP56300 Assembly Code Development Using the Freescale Toolsets by Ralph Lansford Freescale Semiconductor, Inc., 2004. All rights reserved. For More Information On This Product, Go to: www.freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently

Contextual Info: SA50-0001 M/A-COM Preliminary Specifications BGA Digital Attenuator Amplifier 1500 - 2000 MHz Features • Ball Grid Array Outline • Surface Mount Package • Integrated Attenuator, Amplifier & TTL Driver • + 3 0 dBm Output Power • Attenuation 0.5 dB Steps to 31.5 dB

Amkor SBGA

Abstract: JEDEC Matrix Tray outlines MO-192 copper bond wire amkor CO-029 jedec bga tray MO192 192 BGA PACKAGE thermal resistance
Contextual Info: LAMINATE data sheet SuperBGA Features: SuperBGA® SBGA Packages: The SuperBGA® (SBGA) technology provides a cavity down, high-power BGA package. The IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated,

MACH4A

Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size