32 JEDEC TRAY Search Results

240-pin

Abstract: LA-3522A-1
Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3522A-1 MQFP 32x32 3.2mm 240 pin QFP 32 × 32 Terminal Spacing Linear = 0.5 A B 180 181 121 120 detail of lead end S C D R Q 240 1 F G 61 60 H I J M P K M N S L NOTE ITEM 1. Controlling dimention millimeter.

0038 tsop

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 1 P E F detail of lead end 16 A H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 F P E detail of lead end 1 16 A D M M C L B G K N I H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 E 5°±5° F detail of lead end 1 16 A H J K G I N C D M B L M S32G5-50-7JD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

TSOP 54 tray

Abstract: tsop 0038
Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 F E 5°±5° detail of lead end 1 16 A D M M C L B G K N I J H S32G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

SOP 812

Contextual Info: Packing Magazine Name MM525-02A LB-066 Mounting Pad JEDEC Tray 32P SOP 32 pin SOP 525 mil 32 17 +7° 1 3° –3° detail of lead end 16 A J E K F G H I N C D L B M M P32GW-50-525A NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at

Contextual Info: 128K x 32 EEPROM Module PUMA 68E4001/A-12/15/20 Issue 4.3 : May 2001 Elm Road, West Chirton, NORTH SHIELDS, Tyne & Wear NE29 8SE, England Tel. +44 0 191 2930500 Fax. +44 (0) 191 2590997 Description The PUMA 68E4001/A is a 4Mbit CMOS EEPROM module in a JEDEC 68 pin surface

Contextual Info: SIEM ENS 3.3 V DRAM Modules HYM 64Vx005GCD L -60 144 pin SO-DIMM EDO-DRAM Modules 8 MB, 16 MB, 32 MB & 64 MB density Preliminary Information • 144 Pin JEDEC Standard, 8 Byte Small Outline Dual In-line Memory Modules for PC notebook applications • Chip-on Board (COB) Assembly Technique

JEDEC TQFP 10*10 1.0 MM

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A73B-1 TQFP 10x10 1.0T 64 pin TQFP 10 × 10 Terminal Spacing Linear = 0.5 A B 48 33 32 49 F 64 R Q S D C detail of lead end 17 16 1 G H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

S64GF

Contextual Info: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 33 32 detail of lead end C D S R Q 64 1 20 19 F J G H I M P K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of

NEC 2701

Abstract: NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M
Contextual Info: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 detail of lead end 33 32 C D S R Q 64 1 20 19 F G H I M P J K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of

JEDEC Matrix Tray outlines

Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
Contextual Info: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also

tsop tray matrix outline

Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
Contextual Info: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also

QFP JEDEC tray

Contextual Info: HEAT PROOF PPE 36 A' 26.57 A MQFP 32x32 3.2mm 41.38 7 82.76 135.9 UNIT : mm 36 37.82 25.13 264.74 315 322.6 SECTION A – A' 36 3.82 7.62 6.35 31.3 Applied Package Quantity pcs 240-pin plastic QFP (Fine Pitch) (3.2mm thick) MAX. 24 Tray Material Heat Proof Temp.

ATMEL 234

Abstract: ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC
Contextual Info: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer's needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three

28 TSSOP JEDEC Thin Matrix Tray outlines

Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
Contextual Info: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three

pd0008

Abstract: tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST
Contextual Info: PD0008 Packing information Tray for TSOP packages type 1 Introduction TSOP type-1 packages can be supplied in tray packing. Refer to Table 1 for the list of TSOP type-1 packages supplied in trays. The objective of this document is provide a detailed description of the tray. It applies to all

Contextual Info: PLCC 1.27mm SMT Sockets IC160 Series ORDERING INFORMATION P/N: IC160-0*4-*0* * Blank: Tray I 1: Tape & Reel 2: Tube 1: With Locator Pin _ 0: Without Locator Pin 1. 2: SMT Terminals See "Contact Area" Drawing Below Pin Count CHARACTERISTICS Insulation Resistance

JEDEC tray standard 13

Abstract: c 129 transistor JEDEC FBGA 144PIN JEDEC TRAY DIMENSIONS FBGA
Contextual Info: TRAY CONTAINER UNIT : mm 13 x 32=416 118.2 135° C MAX. NEC FBGA7 × 7ESP 7.35 8.85 9.85 A' 7.35 9.60 297.6 315.0 322.6 8.70 7.35 Section A – A' (5.62) (5.77) 7.00 7.62 135.9 PPE A Applied Package Quantity (pcs) 48-pin Plastic FBGA (7×7) 109-pin Tape FBGA (7×7)

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages

HT 1200-4

Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional

MIL-STD-81705

Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Contextual Info: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes

LD 337

Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Contextual Info: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material