320X260 Search Results

LPS200

Abstract: MIL-HDBK-263 LPS-200
Contextual Info: LPS200 HIGH PERFORMANCE LOW NOISE PHEMT • FEATURES ♦ 1.0 dB Noise Figure at 18 GHz ♦ 10 dB Associated Gain at 18 GHz ♦ Low DC Power Consumption GATE BOND PAD 2X DRAIN BOND PAD (2X) SOURCE BOND PAD (2x) DIE SIZE: 12.6X10.2mils (320x260 µm) DIE THICKNESS: 3.9 mils (100 µm)

bond wire gold

Abstract: LPD200 MIL-HDBK-263
Contextual Info: LPD200 HIGH PERFORMANCE PHEMT • FEATURES ♦ 21 dBm Output Power at 1-dB Compression at 18 GHz ♦ 12 dB Power Gain at 18 GHz ♦ 1.0 dB Noise Figure at 18 GHz ♦ 55% Power-Added Efficiency DRAIN BOND PAD 2X GATE BOND PAD (2X) SOURCE BOND PAD (2x) DIE SIZE: 12.6X10.2mils (320x260 µm)

Contextual Info: LCD/Touchscreen Interface Boards for StackableUSB USB3201, USB3202, USB3203 Features The USB3200 series provides OEMs with a small, simple, cost-effective graphical user interface for rugged embedded systems. The LCD/Touchscreen and interface board can operate as a standalone controller with