4416J Search Results

4604

Abstract: dynamic memory control 4114R-1-RC 4116R-1-RC Capacitive Guidelines 4416j
Contextual Info: DRAM Applications ADDRESS ADDRESS DYNAMIC MEMORY CONTROL CPU RAS CAS WE DATA TIMING REFERENCE MEMORY CONTROL DATA DYNAMIC MEMORY ARRAY TIMING CONTROLLERS SYSTEM DATA BUS BLOCK DIAGRAM OF DRAM SYSTEM Use Bourns Networks To: • Match impedance between memory driver and the DRAM

Contextual Info: •PUBIS_ SURFACE MOUNTED ORDERING GUIDE ‘ C irc u it C o d e s E lectrical C o n fig u ratio n T a p e & Reel T ub es Isolated Bussed Dual Terminated Adj. Isolated 001 002 003 004 T01 T02 T03 T04 Exam ples 4816P-001-101 Isolated Circuit in Tape & Reel Package

10k resistor network SIP

Abstract: transistor SMD t04 10k resistor array SIP 10k resistor network SIP 9 pin 8-pin resistor 10k smd 103 rp bus r2r resistor ladder networks smd smd diode marking code T03 8 pin ic 4606 transistor SMD t04 51 ic resistor 331/471
Contextual Info: w w w . b o u r n s . c o m Resistor Networks I. Product Selection II. Popular Resistance III. Thick Film Products Through-hole Packages

Contextual Info: DRAM Applications ADDRESS ADDRESS DYNAMIC MEMORY CONTROL CPU RAS CAS WE DATA TIMING REFERENCE MEMORY CONTROL DATA DYNAMIC MEMORY ARRAY TIMING CONTROLLERS SYSTEM DATA BUS BLOCK DIAGRAM OF DRAM SYSTEM Use Bourns Networks To: • Match impedance between memory driver and the DRAM

M8340109K

Abstract: 4816P-001 M83401
Contextual Info: BO—M S_ PRODUCT SELECTION GUIDE Molded Resistor Networks Package Type Series Number 4100R Molded DIP Low Profile Pin Ct. — M83401-01 ' 4108R-001-RC 4108R-002-RC 4108R-003-RC/RC 4114R-001-RC 4114R-002-RC 4114R-003-RC/RC 16 4116R-001 -RC 4116R-002-RC

Contextual Info: DRAM APPLICATIONS USE BOURNS NETWORKS TO: EFFECT OF DAMPING RESISTOR • Match impedance between memory driver and the DRAM array. WITHOUT DAMPING RESISTOR • Minimize reflections and ringing in DRAM inputs. • Prevent undershoot of RAS, CAS, and WE signals which

4816P-001

Abstract: 4116R-001 4420J-001
Contextual Info: For technical assistance call the Networks Products number on the back cover. DRAM Applications POURNS BLOCK DIAGRAM OF DRAM SYSTEM Use Bourns Networks Tor • M atch im pedance between m em ory driver and the D RAM array. • M inim ize reflections and ringing in DR AM inputs.

Contextual Info: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL-J STYLE / 16 AND 20 PINS • Board footprint identical to medium body (.220 wide) SOM gull wing ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques