506AG Search Results

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN6 3*3 MM, 0.95 PITCH CASE 506AG−01 ISSUE O 1 SCALE 2:1 DATE 18 NOV 2004 NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMESNION b APPLIES TO PLATED TERMINAL

hk-001 94v-0

Abstract: sec d 5072 transistor D 5038 Transistor Horizontal equivalent of transistor sec 5027 8011-8G7 LSG-1DG17-14 508-AG10D augat 510AG92D20ES Catalog 1307612 augat 8136
Contextual Info: Catalog 1307612 Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: 650 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com Sockets Revised 7-01 Table of Contents DIP Sockets Solder Tail Dual Leaf (DL) Contact …………………………………………5002-5007

NTLGF3501NT1G

Abstract: NTLGF3501NT2G
Contextual Info: NTLGF3501N Power MOSFET and Schottky Diode 20 V, 4.6 A FETKY , N−Channel, 2.0 A Schottky Barrier Diode, DFN6 http://onsemi.com Features • • • • MOSFET Flat Lead 6 Terminal Package 3x3x1 mm Reduced Gate Charge to Improve Switching Response Enhanced Thermal Characteristics

Contextual Info: NTLGD3502N Power MOSFET 20 V, 5.8 A/4.6 A Dual N-Channel, DFN6 3x3 mm Package Features •ăExposed Drain Package •ăExcellent Thermal Resistance for Superior Heat Dissipation •ăLow Threshold Levels •ăLow Profile < 1 mm Allows It to Fit Easily into Extremely Thin

524-AG10D

Contextual Info: Catalog 1307612 DIP Sockets Revised 7-01 F o u r-F in g ered C o n tact & S o lid In sulator Wide tapered entry Low profile " X " & "Y " Precision four-finger inner contact stackable insulator Non-wicking closed bottom 528-AG1 ID-ES Solderless wrap or PC termination

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. IF F COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 6 5 4 3 2 - ALL RIGHTS RESERVED. LOC DIST AD 00 REVISIONS P LTR A1 A2 DESCRIPTION DATE DWN APVD ECO—08 —0261 91 230CT08 MB MM REVISED PER ECO-10- 0 0 0 4 4 4

1820AG111D

Abstract: AG47 824-AG50D-ESL 1806-AG11 2-1437537-1 2-1437537-4 2-1437538-1 2-1437538-2 2-1437538-9 2-1437539-9
Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. - 5 4 3 2 RELEASED FOR PUBLICATION ALL COPYRIGHT 6 RIG HTS LOC R E S ER V ED . AD BY TYCO ELECTRONICS CORPORATION. R EV IS IO N S D IS T 00 A1 A2 1 FIG. 2 FIG, DWN EC O —0 8 —0 2 6 1 91 230 C T 0 8 MB REVISED 20JA N 10 KK HMR

708-AG2D

Abstract: LSG-1AG14-1 328-AG19DC 224-AG30D 94v0 ds2 LSG-1AG14 720-AG2D-ES Augat 824-AG11D Augat lsg ag40d
Contextual Info: DIP Sockets A1 - A25 A SIP Sockets B1 - B7 B PLCC/SOJ Sockets C1 - C9 C PGA Sockets D1 - D51 D Pressfit Sockets E1 - E11 E Adapters F1 - F9 F Display Sockets G1 - G5 G Specialty Sockets H1 - H27 H Surface Mount Sockets I1 - I11 I IC Removal Tools J1 - J4 J

Contextual Info: My Account C hange Tyco Electronics Se a rch by Ke yword or Pa rt # Products Documentation Resources My Account Customer Support Home > Products > By Type > Socket/C ard Products > Product Feature Selector > Product Details 506-AG11D-ES Product Details Live Product Chat

2.54 mm pitch BERG stick

Abstract: concept 2114s STANDARD 2.54 PITCH BERG STICK STANDARD 2.54 PITCH BERG STICK 4 pin connector 2 mm pitch BERG stick 1251SM-02 13002 and 13003 power transistor 50 pin 2x25, 2mm pitch berg connectors PIN 11375-1 OZ 9902
Contextual Info: ND3% BASE1 XXXX5115-0708-1-P 708 TSQ: 3001 CMS: CMS-USM TS host OP: NN COMP: 18-07-11 Hour: 16:45 TS:TS date TS time CONNECTORS & ACCESSORIES Find Datasheets Online SOCKETS – DIP/SIP AMP DIPLOMATE DUAL LEAF DL SIP SOCKETS (CONT.) SIP SOCKETS PHOSPHOR BRONZE WITH TIN PLATING

NTLGD3502N

Abstract: NTLGD3502NT1G NTLGD3502NT2G
Contextual Info: NTLGD3502N Power MOSFET 20 V, 5.8 A/4.6 A Dual N−Channel, DFN6 3x3 mm Package Features • • • • • Exposed Drain Package Excellent Thermal Resistance for Superior Heat Dissipation Low Threshold Levels Low Profile < 1 mm Allows It to Fit Easily into Extremely Thin

Contextual Info: 8 7 THIS DRAWING IS UNPUBLISHED. IFF COPYRIGHT - RELEASED FOR PUBLICATION BYTYCOELECTRONICS CORPORATION. ALL RIGHTS RESERVED. 6 5 4 3 2 - LOC DIST AD 00 REVISIONS P LTR A3 DESCRIPTION DATE 16FEB11 REVISED PER ECO-10-01 9941 DW N APVD HMR MM MATERIALS: INSULATOR: POLYESTER, UL RATED 9 4 V - 0

Augat 824-AG11D

Abstract: 1816-AG111D LRD-04 1820AG111D 842-AG11D 1024-AG ag52 1024-AG11D Augat lsg 814-AG11D 2-1437537-4
Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. - 5 4 3 2 RELEASED FOR PUBLICATION ALL COPYRIGHT 6 RIG HTS LOC R E S ER V ED . AD BY TYCO ELECTRONICS CORPORATION. R EV IS IO N S D IS T 00 LTR A3 F IG . 2 F IG . REVISED PER DATE DWN HMR I 6FEB1 E C O - 10 - 0 1 9941 APVD MATERIALS:

thyristor TAG 8506

Abstract: nais inverter vf 7f operation manual 922AA1Y-A4P optek A400 817 Sprague 513D sprague 926c Sprague 195P Rapa relay 12vdc triac tag 8948 Mascot 719
Contextual Info: TABLE OF CONTENTS Catalog Number 11Q New For 1989! • Over 7,900 New Products • 13 New M anufacturers PRODUCT INDICES tiamp*,'fminei forskSockets ' Solder Equipment endTtfob ] vriHp\< lint Equipment, Panel Meters, Aejulpmant, i A P R E M IE R C o m p an y

NTLGD3502N

Abstract: NTLGD3502NT1G NTLGD3502NT2G
Contextual Info: NTLGD3502N Power MOSFET 20 V, 5.8 A/4.6 A Dual N-Channel, DFN6 3x3 mm Package Features •ăExposed Drain Package •ăExcellent Thermal Resistance for Superior Heat Dissipation •ăLow Threshold Levels •ăLow Profile < 1 mm Allows It to Fit Easily into Extremely Thin

5XX-AG33D

Abstract: AUGAT 200 DIP SOCKETS 524-AG11D-ESL 5XX-AG138D 506-ag12d-es 508-AG10D augat MIL-STD-1344 METHOD 2005.1 528-AG11D 514-ag12 508-ag12d-es
Contextual Info: 500 Series DIP Socket with Four-Fingered Contact & Solid Insulator A Wide tapered entry Low profile “X” & “Y” stackable insulator Precision four-finger inner contact Non-wicking closed bottom 528-AG11D-ES Solderless wrap or PC termination FEATURES:

IGBT 60A spice model

Abstract: 8 pin ic 3842 motorola an569 thermal IR 948P 0.65mm pitch BGA socket bt 2323 DFN 3.3X3.3 HTC Korea SPICE thyristor model 527 MOSFET TRANSISTOR motorola
Contextual Info: Semiconductor Packages and Case Outlines Reference Manual CASERM/D Rev. 2, September−2006 SCILLC, 2006 Previous Edition © 2003 “All Rights Reserved’’ CASERM ChipFET is a trademark of Vishay Siliconix. POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.

Contextual Info: My Account C hange Tyco Electronics Se arch by Ke yword or Part # Products Documentation Resources My Account Customer Support Home > Products > By Type > Socket/C ard Products > Product Feature Selector > Product Details 506-AG10D-ES Product Details Live Product Chat