50NH100NH Search Results

Contextual Info: TP Series High Energy Thick Film on Alumina Substrate F e at u r e s • High-Temp Terminal Construction • Wide Resistance Range • Low Inductance 50nH100nH • High Power Density • Easy to install. PC-mountable TP Series high energy resistors offer the user the

100uF capacitor

Contextual Info: Thick film Radial High Energy/ Surge TP Series High Energy Thick Film on Alumina Substrate F e at u r e s • High-Temp Terminal Construction • Wide Resistance Range • Low Inductance 50nH100nH • High Power Density • Easy to install. PC-mountable

Contextual Info: TP Series High Energy Thick Film on Alumina Substrate F e at u r e s • High-Temp Terminal Construction • Wide Resistance Range • Low Inductance 50nH100nH • High Power Density • Easy to install. PC-mountable TP Series high energy resistors offer the user the

Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: SPECIFICATIONS Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling

transistor SMD 352a

Abstract: capacitor 33j 6kv 12w SOT 23 package marking code smd transistor marking 12W 33J 6KV smd 352A 25 ohm 3 watt rheostat United Chemi-Con SME series United Chemi-Con KMC capacitor 6kv 22j
Contextual Info: POWER RESISTORS CURRENT SENSE HIGH VOLTAGE HIGH ENERGY HEAT SINKABLE SURFACE MOUNT COMPONENT SELECTOR 4000G Revised July 16, 2010 1600 Golf Road, Suite 850 | Rolling Meadows, IL 60008 Phone: 866-964-6483 Fax: 847-574-7522 ohmite.com email: sales@ohmite.com

Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling

5R00J

Abstract: TA810 TA203 TA205 TA207 TA303 TA310
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

5R00J

Abstract: ta207 100rj 50w 100rj TA303 50000 ohm 55 watt
Contextual Info: Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling

Contextual Info: TA Series Power Chip Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is

ta303pa

Abstract: TA810PW TA310P TA205P
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

LTA810

Abstract: TA025 TA303PA ta207 TA305 L1085
Contextual Info: Thick Film Alumina TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is

Contextual Info: TP Series High Energy Thick Film on Alumina Substrate F e at u r e s TP Series high energy resistors offer the user the benefits of non-inductive performance and high power density. As an added feature, they provide the impulse energy capability normally associated

300RJ

Abstract: TA203 TA205 TA207 TA303 TA310 TA810
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

transistor SMD 352a

Abstract: smd 352A capacitor 6kv 22j ge 205a 0201 footprint RW67V 12w SOT 23 package marking code SPECIFICATION OF SCR 207A CC21AA-D22W-OFA 353A
Contextual Info: POWER RESISTORS CURRENT SENSE HIGH VOLTAGE HIGH ENERGY HEAT SINKABLE SURFACE MOUNT COMPONENT SELECTOR 4000G Revised January 8, 2009 1600 Golf Road, Suite 850 | Rolling Meadows, IL 60008 Phone: 866-964-6483 Fax: 847-574-7522 ohmite.com email: sales@ohmite.com

300RJ

Abstract: TA203 TA205 TA207 TA303 TA310 TA810
Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Power Chip Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is

Contextual Info: Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling