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    50UM SILICON DIE ATTACH Search Results

    50UM SILICON DIE ATTACH Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SN75LVCP600SDSKR
    Texas Instruments 1.5/3.0/6.0 Gbps Single Channel SATA/SAS Redriver 10-SON -40 to 85 Visit Texas Instruments Buy
    SN75LVCP600SDSKT
    Texas Instruments 1.5/3.0/6.0 Gbps Single Channel SATA/SAS Redriver 10-SON -40 to 85 Visit Texas Instruments Buy
    TMP6131DECR
    Texas Instruments Silicon-based linear thermistor with a positive temperature coefficient (PTC) 2-X1SON -65 to 150 Visit Texas Instruments Buy
    TMP6131LPGM
    Texas Instruments Silicon-based linear thermistor with a positive temperature coefficient (PTC) 2-TO-92 -65 to 150 Visit Texas Instruments Buy
    TMP6131ELPGMQ1
    Texas Instruments Automotive grade, silicon-based linear thermistor with a positive temperature coefficient (PTC) Visit Texas Instruments Buy

    50UM SILICON DIE ATTACH Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    signetics

    Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics Stacked CSP Signetics Stacked Chip Scale Package Stacked CSP is a laminate-based, nearly chip-scale package containing at least two die that are stacked vertically. This package solution provides a very high silicon content


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    696hr, 192hr, C/-65 C/100% 15PSIG, 168hrs signetics PDF

    Contextual Info: 2SB065040MT 2SB065040MT SCHOTTKY BARRIER DIODE CHIPS DESCRIPTION ¾ 2SB065040MT is a schottky barrier diode chips fabricated in silicon epitaxial planar technology; ¾ Low power losses, high efficiency; ¾ Low VF; ¾ Guard ring construction for transient protection.


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    2SB065040MT 2SB065040MT 2SB065040MTJL-180 828dies/wafer PDF

    Contextual Info: 2SB065030MT 2SB065030MT SCHOTTKY BARRIER DIODE CHIPS DESCRIPTION ¾ 2SB065030MT is a schottky barrier diode chips fabricated in silicon epitaxial planar technology; ¾ Low power losses, high efficiency; ¾ Low VF ¾ Guard ring construction for transient protection;


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    2SB065030MT 2SB065030MT 2SB065030MTJL-180 828dies/wafer PDF

    FANUC POWER SUPPLY

    Abstract: AC200 B360 C360 PV20 air bearing convex lens
    Contextual Info: ナノの世界を開拓する超精密ナノ加工機 Super nano machine exploring nano field 加工事例 Samples mROBONANO α-0iBによる多彩な加工事例をご紹介します。 (ここに紹介するサンプルの精度は加工条件、材質、工具等に依存しますので、保証するものではありません。)


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    0500mm/min 500mgf R41mm R45mm FANUC POWER SUPPLY AC200 B360 C360 PV20 air bearing convex lens PDF

    INCOMING PACKAGING MATERIAL INSPECTION form

    Abstract: MIL-STD-105C underfill 45X45mm motherboard major problems & solutions Low viscosity underfill for flip chip
    Contextual Info: FUJITSU/SUN MICROSYSTEMS ULTRASPARC-IIi MCM: MINIATURIZATION TO THE EXTREME Michelle Hou Fujitsu San Jose, CA USA Takashi Ozawa Fujitsu Kawasaki, JAPAN Dev Malladi, Chris Furman, Mary Krebser, Steve Boyle, Mohsen Saneinejad Sun Microsystems Palo Alto, CA USA


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    300MHz 45mmx45mems) 0-100C) INCOMING PACKAGING MATERIAL INSPECTION form MIL-STD-105C underfill 45X45mm motherboard major problems & solutions Low viscosity underfill for flip chip PDF

    d 526 0 6J

    Contextual Info: Æ T SGS-THOMSON * 7/. APPLICATION NOTE PLASTIC PACKAGES FOR POWER DISCRETES AND ICs 1.BRIEF OVERVIEW OF TECHNOLOGY The plastic package of a power chip serves four main functions: i Electrical interconnection between the silicon chip and the external circuit;


    OCR Scan
    PowerSO-10 d 526 0 6J PDF

    eh 11757

    Abstract: 0.3mm pitch BGA JEDEC FBGA Coffin-Manson Equation thermal cycling data weibull 0.4mm pitch BGA BGA Solder Ball 0.35mm FBGA 63 PCB design for very fine pitch csp package bt resin
    Contextual Info: Daisy Chain Samples Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


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    PDF

    "0.4mm" bga "ball collapse" height

    Abstract: cga 624 ibm semi reflow temperature bga
    Contextual Info: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier D. J. Alcoe, T. E. Kindl, J. S. Kresge, J. P. Libous, C. L. Tytran-Palomaki, R. J. Stutzman IBM Corporation Endicott, New York Biography Dr. David J. Alcoe joined IBM in 1982 and is the


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    w/2116 "0.4mm" bga "ball collapse" height cga 624 ibm semi reflow temperature bga PDF

    porte logique

    Abstract: TS8387 b511 Current Output Temperature 81102G0 B511 transistor porte logique and CQFP68 TS81102G0 TS8388B TSEV83102G0F
    Contextual Info: MAIN FEATURES § Programmable DMUX ratio : 1:4 : Data rate max = 1 Gsps, PD 8b/10b < 3.8 / 4.1 W (ECL 50Ω output) 1:8 : Data Rate max = 2GSPS, PD (8b/10b)< 5.0 / 5.7 W (ECL 50Ω output) 1:16 with 1 TS8388B and 2 DMUX. § Parallel output mode. § 8/10 bit.


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    8b/10b TS8388B porte logique TS8387 b511 Current Output Temperature 81102G0 B511 transistor porte logique and CQFP68 TS81102G0 TSEV83102G0F PDF

    porte logique

    Abstract: porte logique and TS83084G0 circuit logique Transistor 8c4 TS83084G TS81102G0 TS83102G0 TS8388B TSEV8388G
    Contextual Info: MAIN FEATURES ! Programmable DMUX ratio : 1:4 : Data rate max = 1 Gsps, PD 8b/10b < 4.3 / 4.7 W (ECL 50Ω output) 1:8 : Data Rate max = 2GSPS, PD (8b/10b)< 6 / 6.9 W (ECL 50Ω output) 1:16 with 1 TS8388B or 1 TS83102G0 and 2 DMUX. ! Parallel output mode.


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    8b/10b TS8388B TS83102G0 porte logique porte logique and TS83084G0 circuit logique Transistor 8c4 TS83084G TS81102G0 TSEV8388G PDF

    atmel 1042

    Abstract: 16a8 FR4 epoxy dielectric 17vee IEC C13 pinout Radiall R125 Radiall R125 620 Transistor 8c4 Radiall R112 665 TS81102G0
    Contextual Info: MAIN FEATURES ! ! ! ! ! ! ! ! 50Ω input clock and data differential ECL through 2.54mm pitch connectors. Demultiplexed outputs (single-ended ECL) 50Ω adapted on up to 8 x 2.54mm pitch connectors. DMUX functions adjusted by jumpers and potentiometers.


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    200mm 190mm. TS81102G0 TSEV81102G0TPZR3 atmel 1042 16a8 FR4 epoxy dielectric 17vee IEC C13 pinout Radiall R125 Radiall R125 620 Transistor 8c4 Radiall R112 665 PDF

    Dow Corning DC 896

    Abstract: b511 Current Output Temperature DIODE g8 porte logique
    Contextual Info: TS81102G0 8/10 bit – 2 GSPS 1:8/1:4 DEMUX DESCRIPTION The DEMUX is designed to fit with TCS high speed ADC TS8387 and TS8388B and further G’core ADC 2 and 4GSPS family. This DEMUX allows users to process the high speed output data stream down to processor speed. It uses the very


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    TS81102G0 TS8387 TS8388B 8b/10b Dow Corning DC 896 b511 Current Output Temperature DIODE g8 porte logique PDF

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


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    N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm PDF

    car speed control using bluetooth advantages and

    Abstract: gps 5350 CIRCUIT SCHEMATIC CAR ECU "General Catalog" TV SOC 3D MEMS camera module SiP EMI
    Contextual Info: 2010.01 ルネサス システムインパッケージ 総合カタログ System in Packages General Catalog www.renesas.com Creating Future you imagine ルネサスの先端技術が お客様の未来を広げていきます。


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    RJJ01N0001-1300 car speed control using bluetooth advantages and gps 5350 CIRCUIT SCHEMATIC CAR ECU "General Catalog" TV SOC 3D MEMS camera module SiP EMI PDF

    pru 10.64

    Contextual Info: TMS320C6743 www.ti.com SPRS565C – APRIL 2009 – REVISED MARCH 2013 TMS320C6743 Fixed/Floating-Point Digital Signal Processor Check for Samples: TMS320C6743 1 TMS320C6743 Fixed/Floating-Point Digital Signal Processor 1.1 Features 12 • Highlights – Up to 375-MHz FIxed/Floating-Point VLIW


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    TMS320C6743 SPRS565C TMS320C6743 375-MHz pru 10.64 PDF

    Contextual Info: TMS320C6743 www.ti.com SPRS565C – APRIL 2009 – REVISED MARCH 2013 TMS320C6743 Fixed/Floating-Point Digital Signal Processor Check for Samples: TMS320C6743 1 TMS320C6743 Fixed/Floating-Point Digital Signal Processor 1.1 Features 12 • Highlights – Up to 375-MHz FIxed/Floating-Point VLIW


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    TMS320C6743 SPRS565C TMS320C6743 375-MHz PDF

    Contextual Info: Product Folder Sample & Buy Technical Documents Support & Community Tools & Software TMS320C6743 www.ti.com SPRS565C – APRIL 2009 – REVISED MARCH 2013 TMS320C6743 Fixed/Floating-Point Digital Signal Processor Check for Samples: TMS320C6743 1 TMS320C6743 Fixed/Floating-Point Digital Signal Processor


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    TMS320C6743 SPRS565C TMS320C6743 375-MHz PDF

    Contextual Info: Product Folder Sample & Buy Technical Documents Support & Community Tools & Software TMS320C6743 www.ti.com SPRS565C – APRIL 2009 – REVISED MARCH 2013 TMS320C6743 Fixed/Floating-Point Digital Signal Processor Check for Samples: TMS320C6743 1 TMS320C6743 Fixed/Floating-Point Digital Signal Processor


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    TMS320C6743 SPRS565C TMS320C6743 32-Bit 16-Bit PDF

    CP/2014

    Contextual Info: Product Folder Sample & Buy Tools & Software Technical Documents Support & Community AM1802 SPRS710E – NOVEMBER 2010 – REVISED MARCH 2014 AM1802 ARM Microprocessor 1 AM1802 ARM Microprocessor 1.1 Features 1 • 300-MHz ARM926EJ-S RISC MPU • ARM926EJ-S Core


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    AM1802 SPRS710E AM1802 300-MHz ARM926EJ-Sâ ARM926EJ-S 32-Bit 16-Bit CP/2014 PDF

    CP/2014

    Contextual Info: Product Folder Sample & Buy Tools & Software Technical Documents Support & Community AM1802 SPRS710E – NOVEMBER 2010 – REVISED MARCH 2014 AM1802 ARM Microprocessor 1 AM1802 ARM Microprocessor 1.1 Features 1 • 300-MHz ARM926EJ-S RISC MPU • ARM926EJ-S Core


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    AM1802 SPRS710E AM1802 300-MHz ARM926EJ-Sâ ARM926EJ-S 32-Bit 16-Bit CP/2014 PDF

    raychem catalog termination kit and splicing kit

    Abstract: FLUKE 79 3 series DALLAS 2501 220V AC 12V DC regulated switching raychem JOINT procedure KIT BR 8050 D raychem high voltage cable termination kit FLUKE 79 manual APC back UPS RS 800 oz 8602 gn
    Contextual Info: EQUIPMENT RENTALS RENT FROM FIS FIS EQUIPMENT RENTALS Our Rental Program has been expanded to include more products, great pricing, and new ways to save! Rent for as little as one week, from the day of shipment until day of return. Needed accessories are included at NO extra charge:


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    MT9083A 18AWG S-RG59ZIP500B S-RG591KB S-RG595000B S-RG59ZIP1KB RG59/U 75ohm raychem catalog termination kit and splicing kit FLUKE 79 3 series DALLAS 2501 220V AC 12V DC regulated switching raychem JOINT procedure KIT BR 8050 D raychem high voltage cable termination kit FLUKE 79 manual APC back UPS RS 800 oz 8602 gn PDF

    ic 7824

    Contextual Info: AM1802 www.ti.com SPRS710C – NOVEMBER 2010 – REVISED MARCH 2012 AM1802 ARM Microprocessor Check for Samples: AM1802 1 Device Summary 1.1 Features 12 • Highlights – 300-MHz ARM926EJ-S RISC Core – ARM9 Memory Architecture – Enhanced Direct-Memory-Access Controller


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    AM1802 SPRS710C AM1802 8-/16-Bit-Wide 16-Bit 16-byte ic 7824 PDF

    Contextual Info: Product Folder Sample & Buy Tools & Software Technical Documents Support & Community AM1707 www.ti.com SPRS637D – FEBRUARY 2010 – REVISED MARCH 2013 AM1707 ARM Microprocessor Check for Samples: AM1707 1 AM1707 ARM Microprocessor 1.1 Features 123 • Highlights


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    AM1707 SPRS637D AM1707 375/456-MHz ARM926EJ-Sâ PDF

    Contextual Info: Product Folder Sample & Buy Tools & Software Technical Documents Support & Community AM1707 www.ti.com SPRS637D – FEBRUARY 2010 – REVISED MARCH 2013 AM1707 ARM Microprocessor Check for Samples: AM1707 1 AM1707 ARM Microprocessor 1.1 Features 123 • Highlights


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    AM1707 SPRS637D AM1707 375/456-MHz ARM926EJ-Sâ PDF