51XXX Search Results

Contextual Info: DUAL R e m a rk : D IG ! I LED D IS P L A Y S • T h e a v e ra g e lu m in o u s in^teiuiit;, if ob tained b_, s u im m i.g tlu' la in .n o u s in te n sity u i each se g m e n t an d d e v id in g by to tal n um ber of se g m e n ts. • A b o v e p art n u m b ers a re a ll w ith black > u ;r a«.v a :i.! a tn te : .>;i:i<-ht. Kor part 'm m b e rs w ith other s u rfa c e an d se g m e n t co lo r c o m b in a tio n s, please check

xmxx

Abstract: YAGEO CHIP RESISTORS MARKING RC1206 RC1206
Contextual Info: 1100 DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1%, 0.5% Product specification – February 6, 2013 V.5Supersedes Date of Mar. 06, 2003 RoHS compliant Product specification Chip Resistor Surface Mount RC 2 9 1206 RoHS Compliant SERIES SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC

Contextual Info: Order this document by MCM516165B/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA 1M x 16 Advance Information 16M CMOS Wide DRAM Family EDO, 1M x 16,1K, and 4K Refresh The family of 16M Dynamic RAMs is fabricated using 0.50p. C M O S high-speed silicon-gate process technology. It includes devices organized as 1,048,576 six­

Pulse capability

Abstract: 54XXX 24XXX Wire wound resistor 5W Pilkor Resistor
Contextual Info: PILKOR components Wire wound resistors WWR FEATURES • High power dissipation in small volume  High pulse load handling capabilities. APPLICATIONS  Ballast switching  Shunt in small electric motors  Power supplies. Dimensions mm DESCRIPTION

Pulse capability

Abstract: RESISTOR AMMO PACKING power resistor 3w Pilkor Resistor
Contextual Info: PILKOR components Wire wound resistors WWR 1W/2W/3W/5Ws FEATURES • High power dissipation in small volume  High pulse load handling capabilities. APPLICATIONS  Ballast switching  Shunt in small electric motors  Power supplies. Dimensions mm

73001AB

Abstract: rtt 10 foxboro foxboro 931 foxboro control valve drum ic cxa 2165 sis 486 LK15 75XXX-XX cdb 4121 e
Contextual Info: 73001BA-02 FOX 1 Hardware System Overview and Reference Manual VOLUME 2 COMPUTER REFERENCE MANUAL tOXBORO FOX 1 USER DOCUMENTATION 73001AA 73001AB 73001EA 73001EB 73001EC 73001 BA-02 Hardware System Overview and Reference Manual VOLUME 2 COMPUTER REFERENCE MANUAL

Yageo RC1206

Abstract: RC yageo YAGEO 2322 yageo 1206 smd 2322 YAGEO RC01 1206 33 YAGEO DATE CODE 2322711 rc YAGEO CHIP RESISTORS YAGEO CHIP RESISTORS MARKING
Contextual Info: Product specification – Jul 15, 2008 V.3 Supersedes Date of Mar. 06, 2003 100 DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 RoHS compliant 5%, 1% Product specification Chip Resistor Surface Mount RC SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC

YAGEO RC1206

Abstract: Phycomp 2322 724 RC01 1206 33 "material declaration sheet" for chip resistor RC1206 2322 711 91032 Resistor dimensions 1206 to mm RC01 RC02 RC1206FR-0756RL
Contextual Info: Product specification – Sep 03, 2004 V.2 Supersedes Date of Mar. 06, 2003 DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 Pb Free 5%, 1% Product specification Chip Resistor Surface Mount RC SERIES 2 10 1206 (Pb Free) SCOPE This specification describes RC1206 series chip resistors with lead-free terminations made by thick film process.

Phycomp 2322 724

Abstract: 1206 footprint IPC smd marking code 711 Yageo RC1206 xmxx IEC60115-1 MP 1008 es smd marking mp 1K20 RC01
Contextual Info: Product specification – Jul 15, 2008 V.3 Supersedes Date of Mar. 06, 2003 100 DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 RoHS compliant 5%, 1% Product specification Chip Resistor Surface Mount RC SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC

rc1206 chip

Abstract: Phycomp 2322 724 Yageo RC1206 xmxx 1206 footprint IPC smd marking code 711 1K Ohm resistor 1/4W phycomp 2322 series resistors phycomp 2322 resistors 2322 711 91032
Contextual Info: Product specification – Jul 02, 2009 V.4 Supersedes Date of Mar. 06, 2003 1100 DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1% RoHS compliant Product specification Chip Resistor Surface Mount RC SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 4M x 4 MCM516400 Advance Information Fast Page Mode 16M CMOS Dynamic RAM Family Fast Page Mode, x4 and x1, 2K and 4K Refresh 4096 Cycle Refresh MCM517400 T h e fa m ily o f 1 6 M d y n a m ic R A M s is fa b ric a te d u s in g 0 .6 ^ C M O S h ig h -s p e e d s ilic o n -

sp8560

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 1M x 16 Advance Information 16M CMOS Wide DRAM Family Fast Page Mode, x16 The family of 16M Dynamic RAMs is fabricated using 0.55^ CMOS high-speed sili­ con—gate process technology. It includes devices organized as 1,048,576 sixteen-bit

xmxx

Abstract: yageo Phycomp 2322 711
Contextual Info: Product specification – Jul 02, 2009 V.4 Supersedes Date of Mar. 06, 2003 1100 DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1% RoHS compliant Product specification Chip Resistor Surface Mount RC SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC

SMD resistors 750 1206

Abstract: 3216 footprint IPC xmxx
Contextual Info: Product specification – Jul 15, 2008 V.3 Supersedes Date of Mar. 06, 2003 100 DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 RoHS compliant 5%, 1% Product specification Chip Resistor Surface Mount RC SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC

YAGEO CHIP RESISTORS Mounting

Abstract: Yageo RT series rc YAGEO CHIP RESISTORS YAGEO DATE CODE
Contextual Info: Product specification – Jul 15, 2008 V.3 Supersedes Date of Mar. 06, 2003 100 DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 RoHS compliant 5%, 1% Product specification Chip Resistor Surface Mount RC SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC

M512RD

Abstract: M516RD
Contextual Info: THREE-DIGIT DISPLAYS Digit Em itted C o m m on Size C a th o d e BT-A511RD BT-C511RD Red A515RD C515RD Bright Red A512RD A513RD Drawing W ave Length Color A node A514RD u.oo C o m m on E lectro-O ptical Absolute M axim um Peak Part No. Xp nm Ah Pd Max. Iv Typ,

BD-A514RD

Abstract: BD-A544RD BD-C514RD D2116 BGA503 ISO100
Contextual Info: D I S P L A Y DU A L DIGIT LED DISPLAYS Chip Part No. Digit Size y y 0.50“ IT 3 m 0.52" fn H y y 0.56" 0 Ü Common Anode Common Cathode E m itte d Color BG-A501RD BG-C501RD Red BG-A505RD BG-C505RD BG-A505RE BG-C505RE BG-A502RD BG-C502RD BG-A503RD BG-C503RD

bt51

Abstract: BT-M406RD BTM403
Contextual Info: D I S P L A Y THREE DIGIT LED DISPLAYS Chip Part No. Digit Size y f□=S N 0.40" 03car y m y F=fi □ 00 L Rem ark: 0.40" nw —p Common Anode BT-M401RD BT-M405RD Common Cathode BT-N401RD BT-N405RD BT-M405RE BT-N405RE BT-M402RD BT-M403RD BT-N402RD BT-N403RD

BS-A534RD

Abstract: bsa533
Contextual Info: «¡•BIBI SINGLE DIGIT'' DISPLAYS Chip Fari No. Digit Size Uni L rr. i 11 r. t Common Anode Commoi. BS-A531RD BS-C531RD BS-A535RD BS-C535RD BS-A535RE BS-C535RE BS-A532RD W ave Length Electro-optical Data(At 10mA) Iv Typ. Peak A A Pd Per Seg. lilm A ) T

stk 412 750

Abstract: stk 412 -410 stk 442 -130 IC stk 412 410 stk 412 -420 ic stk 432 050 stk 432 050 StK 412 230 stk 407 090 datasheet 51-131-022
Contextual Info: Befehls- und Meldegeräte 51 51 Befehls- und Meldegeräte Inhaltsübersicht Baureihe 51 Beschreibung Seite 99 Geräteaufbau Seite 100 Sortiment - Geräte Standard Einbau - Zubehör / Einzelteile 98 03.2000 Seite 101 Seite 107 Technische Daten Seite 114 Massbilder / Lochbilder / Bauteilelayouts

MO-143

Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22

433 M

Contextual Info: M OTOROLA SEMICONDUCTOR TECHNICAL DATA 1M 16M CMOS Wide DRAM Family Fast Page Mode, x16 and x18 The fa m ily of 16M D ynam ic RAM s is fab rica ted using 0.55 1 C M O S high-speed silico n-gate process technology. It includes devices organized as 1,048,576 sixteen- and

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 1M x 16 Advance Information 16M CMOS Wide DRAM Family EDO,1M x 1 6 ,1K, and 4K Refresh The family of 16M Dynamic RAMs is fabricated using 0.50ji CMOS high-speed silicon-gate process technology. It includes devices organized as 1,048,576 six­

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 1M Advance Information 16M CMOS Wide DRAM Family Fast Page Mode, x16 The family of 16M Dynamic RAMs is fabricated using 0.50|i CMOS high-speed sili­ con—gate process technology. It includes devices organized as 1,048,576 sixteen-bit