53230 Search Results

Contextual Info: | | | Search Products Documentation Resources My Account Home > Products > By Type > RF & Coax > Product Feature Selector Customer Support > Product Details 53230 - 3 Product Details Coax Shielded Wire Crimp TERMASHIELD Not EU RoHS or ELV Compliant Alternates )

Contextual Info: Molex 53230 Series 2.54 Board-to-Board Connector Right Angle Header Assembly Dual Row View 53316 Series Drawing Click To View >>> xxxx

Contextual Info: JWÊSS^ 53230 SPST SOLID-STATE RELAYS MILITARY, DC SOLID STATE RELAYS WITH INTEGRAL SHORT CIRCUIT PROTECTION FEATURES • • • • Short Circuit Protection SCP 1000 VAC RMS Isolation Power FET Output - Low On-state Resistance Full Military Temperature Operation:

Contextual Info: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53230D-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to

Contextual Info: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53230R-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to

ATS1166-ND

Contextual Info: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1166-ND ATS PART # ATS-53230K-C2-R0 D Features & Benefits High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments C maxiGRIP™ attachment applies steady, even pressure to

ATS1150-ND

Contextual Info: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1150-ND ATS PART # ATS-53230D-C2-R0 D Features & Benefits High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments C maxiGRIP™ attachment applies steady, even pressure to

ATS1182-ND

Contextual Info: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1182-ND ATS PART # ATS-53230R-C2-R0 D Features & Benefits High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments C maxiGRIP™ attachment applies steady, even pressure to

Contextual Info: Agilent 53200A Series RF/Universal Frequency Counter/Timers Data Sheet 53210A 350 MHz RF Frequency Counter, 10 digits/sec 53220A 350 MHz Universal Frequency Counter/Timer, 12 digits/sec, 100 ps 53230A 350 MHz Universal Frequency Counter/Timer, 12 digits/sec, 20 ps

Contextual Info: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53230K-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to

TTL 494

Abstract: 53230
Contextual Info: 53230 SPST SOLID-STATE RELAYS M • È È Ê = * ^ MILITARY, DC SOLID STATE RELAYS WITH INTEGRAL SHORT CIRCUIT PROTECTION FEATURES • • • • È Short Circuit Protection SCP 1000 VAC RMS Isolation Power FET Output - Low On-state Resistance Full Military Temperature Operation:

Contextual Info: ~ J |f S S L 53230 SPST SOLID-STATE RELAYS MILITARY, DC SOLID STATE RELAYS WITH INTEGRAL SHORT CIRCUIT PROTECTION FEATURES • Short Circuit Protection SCP • 1000 VAC RMS Isolation • Power FET Output - Low On-state Resistance • Full Military Temperature Operation:

Contextual Info: Agilent 53200A Series RF/Universal Frequency Counter/Timers Data Sheet 53210A 350 MHz RF Frequency Counter, 10 digits/sec 53220A 350 MHz Universal Frequency Counter/Timer, 12 digits/sec, 100 ps 53230A 350 MHz Universal Frequency Counter/Timer, 12 digits/sec, 20 ps

E4407S-E57

Abstract: mso6054a
Contextual Info: 2011 GSA Schedule Contract Products Government & Military Test Equipment Savings Field Testing Just Got Easier 20 GHz Handheld Spectrum Analyzer N9344C HSA The features you need in a field-ready instrument • Rugged and fanless design for tough field environments

TA73G8P

Abstract: T6668 mioz3 T70 No3 T6668-3 T6668-16 256KD T6668-6 F/TA73G8P dSMC
Contextual Info: b4E » • 00EMTM2 TOSHIBA 1. S i b WÊTQS3 UC/UP GENERAL The T6668 is a single chip CMOS LSI for voice recording and reproducing using the ADM (Adaptive Delta Modulation) system. When a dynamic RAM is used as a voice data memory and an audio circuit including a microphone, speaker, amplifier, etc. is externally connected, a voice

PT15D

Abstract: OR2T40A-6PS208I R4C18
Contextual Info: Data Sheet August 2002 ORCA Series 2 Field-Programmable Gate Arrays Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance, cost-effective, low-power 0.35 µm CMOS technology OR2CxxA , 0.3 µm CMOS technology (OR2TxxA), and 0.25 µm CMOS technology

SKIIP 33 nec 125 t2

Abstract: skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302
Contextual Info: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.

Molex 52482-0100

Contextual Info: 2.54mm .100" Pitch DIN 41612 Receptacle FEATURES AND SPECIFICATIONS Features and Benefits Electrical Voltage: 300V Current: 2.0A Contact Resistance: 20mΩ max. Dielectric Withstanding Voltage: 1000V AC Insulation Resistance: 106 MΩ min. • Sizes 16 to 64 circuits

DIN41612 molex

Abstract: LR19980 DIN41612
Contextual Info: Backplane Connectors E m o le x 2.54mm .100" Pitch DIN 41612 Header FEATURES AND SPECIFICATIONS Features and Benefits • Sizes 16 to 64 circuits Electrical Voltage: 300V Current: 2.0A Contact Resistance: 20mQ max. Dielectric Withstanding Voltage: 1000V AC

ATT ORCA fpga

Abstract: ATT ORCA fpga architecture
Contextual Info: Data Sheet May 1995 f^ A D s T Microelectronics Optimized Reconfigurable Cell Array {ORCA 1C Series Field-Programmable Gate Arrays ATT1C03, ATT1C05, ATT1C07, and ATT1C09) Features • High density: to 11,400 usable gates ■ High I/O: up to 256 usable I/O (for ATT1C09)

Contextual Info: Datasheet microelectronics group June 1999 Lucent Technologies Bell Labs Innovations ORCA Series 2 Field-Programmable Gate Arrays Features • High-performance, cost-effective, low-power 0.35 pm CMOS technology OR2CxxA , 0.3 pm CMOS technology (OR2TxxA), and 0.25 pm CMOS technology

EXO 32K

Abstract: OR2C06A OR2C12A OR2T15B OR2T40B
Contextual Info: Data Sheet November 2006 ORCA Series 2 Field-Programmable Gate Arrays Features • ■ ■ ■ ■ ■ ■ ■ ■ High-performance, cost-effective, low-power 0.35 µm CMOS technology OR2CxxA , 0.3 µm CMOS technology (OR2TxxA), and 0.25 µm CMOS technology

R14C17

Abstract: R16C17
Contextual Info: September 1995 j-s #*•«*■ Microelectronics Optimized Reconfigurable Cell Array ORCA ATT2T15 (3.3 V) Field-Programmable Gate Array Features Description ■ High-performance, cost-effective 0.5 jam technology optimized for 3.3 V operation The ATT2T15 is the first device in this family opti­

fe 5527

Abstract: 9611 D3512 NM5010-CS01
Contextual Info: SAW Bandpass Filter 240801B 1. Features z IF Bandpass Filter z High Attenuation z Single-Ended Operation z DIP Package z Maximum Storage Temperature Range : -40℃ ~ 85℃ z Electrostatics Sensitive Device ESD Package : D3512 Dimensions shown are nominal in millimeters