56-LEAD TSOP PACKAGE Search Results

TSOP 56 Package

Abstract: 56-Pin
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 56 PIN PLASTIC FPT-56P-M02 56-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-56P-M02) 56-pin plastic TSOP (I)

9806

Abstract: diode 9806 FPT-56P-M01
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 56 PIN PLASTIC FPT-56P-M01 56-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-56P-M01) 56-pin plastic TSOP (I)

9809

Abstract: TSOP 56 Package FPT-56P-M04
Contextual Info: THIN SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 56 PIN PLASTIC FPT-56P-M04 56-pin plastic TSOP I Lead pitch 0.40 mm Package width x package length 12.00 × 12.40 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.20 mm MAX

48pin flash programmer circuit

Abstract: intel manual PLCC 68 intel INTEL 56BALL
Contextual Info: PROM PROGRAMMERS INTEL Intel Flash Memory Programmer • ■ ■ ■ ■ Advanced-capability engineering programmer – Support capability below 5V logic levels – Extremely fast programming performance – 56-lead TSOP socket module supports all lead counts

PLCC 68 intel

Abstract: intel manual 48pin flash programmer circuit
Contextual Info: PROM PROGRAMMERS INTEL FlashPRO-II: Advanced Flash Memory Engineering Programmer • ■ ■ ■ ■ Advanced-capability engineering programmer – Support capability below 5V logic levels – Extremely fast programming performance – 56-lead TSOP socket module

28F016XS

Contextual Info: INTEL PRODUCTS INTEL 28F016XS Fast Flash Memory • ■ ■ ■ ■ ■ ■ ■ Synchronous burst interface SmartVoltage technology Nonvolatile, updatable and low power 56-lead TSOP and SSOP packages 2 Mbyte of code storage space 16 symmetrical 128-Kbyte blocks

29057

Contextual Info: irrte! AEMÄM ! OMiFOKlifflATO ^ 28F016XD 16-MBIT 1 MBIT x 16 DRAM-INTERFACE FLASH MEMORY 85 ns Access Time Orac ) — Supports both Standard and FastPage-Mode Accesses 56-Lead TSOP Type I Package Backwards-Compatible with 28F008SA Command Set Multiplexed Address Bus

Intel 56 TSOP

Abstract: 28F016XS
Contextual Info: MEMORY & STORAGE INTEL CORPORATION Intel 28F016XS Fast Flash Memory • ■ ■ ■ ■ ■ ■ ■ Synchronous Burst Interface Nonvolatile, Updatable and Low Power 2 MB of Code Storage Space X16 or X8 Output Configuration SmartVoltage Technology 56-Lead TSOP and SSOP

Contextual Info: in te i 28F016XD 16-MBIT 1 MBIT X 16 DRAM-INTERFACE FLASH MEMORY 85 ns Access Time (tRAc) — Supports both Standard and FastPage-Mode Accesses 56-Lead TSOP Type I Package Multiplexed Address Bus — RAS# and CAS# Control Inputs 2 ix A Typical Deep Power-Down

Contextual Info: in te l ADVANCE INFORMATION 28F016XD 16-MBIT 1 MBIT x 16 DRAM-INTERFACE FLASH MEMORY 85 ns Access Time (tRAC) — Supports both Standard and FastPage-Mode Accesses 56-Lead TSOP Type I Package Multiplexed Address Bus — RAS# and CAS# Control Inputs 2 pA Typical Deep Power-Down Current

Contextual Info: STT3403P -4 A, -30 V, RDS ON 56 m P-Channel Enhancement Mode MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free DESCRIPTION TSOP-6 These miniature surface mount MOSFETs utilize a high cell density trench process to provide Low RDS(on)

STT3405P

Abstract: MosFET
Contextual Info: STT3405P -4.9 A, -20 V, RDS ON 56 m P-Channel Enhancement Mode MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free DESCRIPTION TSOP-6 These miniature surface mount MOSFETs utilize a high cell density process. Low RDS(on) assures minimal

648-0482211

Abstract: 648-0482211-A01 648A0322211-A01 648-0562211-A01 dead bug 648-1282211-A01 648-0482211SA01 wells 648-0482211 648A0402211-A01 Wells-CTI 648
Contextual Info: Burn-In Test Sockets 648 Series TSOP-I Socket • Available dead bug or live bug with adaptor • Open top, Zero Insertion Force design for automatic loading • Highly reliable, pre-loaded contacts e Lead Count 28 32 32 32 40 40 48 48 56 Pitch e mm 0.55

SO14E

Abstract: so8b so6a SO24C so8e so48 SO34A SO16E Package SO8C SO36B
Contextual Info: Ironwood Electronics Appendix D AP-D.1 APPENDIX D SOIC Chip Package Specifications: • SOIC with Gull Wing Leads . . . . . . . . . . . . . .page AP-D.2 thru AP-D.5 • SOIC with J-Leads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .page AP-D.6

Contextual Info: Thin Small Outline Package TSOP DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

Contextual Info: 52 Pin to 56 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 52 Pin to 56 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

TSOP 48 thermal resistance

Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Contextual Info: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate

pioneer PAL 007 A

Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Contextual Info: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions

PAL 007 pioneer

Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Contextual Info: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions

TSOP-48 pcb LAYOUT

Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

48P4B

Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P

Meritec 980020-56

Abstract: IC179-44600-500 IC197-4807-2000 980020-48 IC197-5606-2000 980020 IC191-0482-004 Enplas OTS 648-0482211 wells 648-0482211
Contextual Info: The Complete Socket Solution 3 PCB land-pad layout similar close to that of device PRODUCTION PROTOTYPING AND TEST SOCKETS TO HELP YOU DESIGN IN INTEL FLASH MEMORY Socket vendors are actively working on solutions for Small Outline Packages This work includes robust