Coffin-Manson Equation
Abstract: s-n curve igbt thermal characterization and simulation using ansys Coffin-Manson exponent copper bond wire
Text: Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi-physics simulations Jeroen Bielen, Jan-Joris Gommans, Frank Theunis Philips Semiconductors –Innovation Centre for RF Gerstweg 2, 6534AE Nijmegen, The Netherlands
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6534AE
Coffin-Manson Equation
s-n curve
igbt thermal characterization and simulation using ansys
Coffin-Manson exponent
copper bond wire
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Untitled
Abstract: No abstract text available
Text: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 60, NO. 6, JUNE 2012 1755 LDMOS Technology for RF Power Amplifiers S. J. C. H. Theeuwen and J. H. Qureshi Invited Paper Abstract—We show the status of laterally diffused metal–oxide–semiconductor (LDMOS) technology, which has
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