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    6X6 TRAY TQFP Search Results

    6X6 TRAY TQFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ELANSC300-33VC Rochester Electronics LLC Microcontroller, 32-Bit, 33MHz, CMOS, PQFP208, TQFP-208 Visit Rochester Electronics LLC Buy
    CY7C4285-15ASC Rochester Electronics LLC FIFO, 64KX18, 10ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 Visit Rochester Electronics LLC Buy
    ML6431CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    ML6430CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    RAA230403GFT Renesas Electronics Corporation ICs for Microcontroller Power Supply System, TQFP-32, /Tray Visit Renesas Electronics Corporation

    6X6 TRAY TQFP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tray qfn 6x6

    Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
    Text: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA


    Original     		PDF O-236AB OT-23) OT-23 O-220 O-252 OT-223 QFN00/Reel 490/Tray tray qfn 6x6 tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5

    tray 20 x 14

    Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
    Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type


    Original     		PDF E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    Full Bridge N-Channel FET driver IC

    Abstract: No abstract text available
    Text: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o


    Original     		PDF MLX81100 16-bit CPU90 30kbyte 100-kBaud 100Hz 100kHz 16-channel 10-bit Full Bridge N-Channel FET driver IC

    peak tray qfn 6x6

    Abstract: tqfp 6X6 tray 6x6 TRAY tqfp
    Text: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o


    Original     		PDF MLX81100 16-bit CPU90 30kbyte 100-kBaud 100Hz 100kHz 16-channel 10-bit peak tray qfn 6x6 tqfp 6X6 tray 6x6 TRAY tqfp

    AD5820

    Abstract: ad6548
    Text: Tape and Reel Packaging Introduction Specifications The electronics industry is making a tremendous investment in surfacemount technology. The reasons for this investment include cost savings resulting from automated component placement and increased density


    Original     		PDF T03762-0-1/13 AD5820 ad6548

    "0.4mm" bga "ball collapse" height

    Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
    Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and


    Original     		PDF SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST

    PGA68

    Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
    Text: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PDF GS-150T 102x51x19 GS-100T GS-R1005 PGA68 clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight

    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


    Original     		PDF S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


    Original     		PDF manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4

    projected capacitive touch controller

    Abstract: mtouch sensor map MTCH6301 capacitive touch projected capacitive touch mutual touch and gestures control table top multitouch 4x4 matrix keypad dspic
    Text: MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER MTCH6301 Projected Capacitive Touch Controller Description Touch Features The MTCH6301 is a turnkey projected capacitive controller that allows easy integration of multi-touch and gestures to create a rich user interface in your design.


    Original     		PDF MTCH6301 DS41663A-page projected capacitive touch controller mtouch sensor map capacitive touch projected capacitive touch mutual touch and gestures control table top multitouch 4x4 matrix keypad dspic

    Untitled

    Abstract: No abstract text available
    Text: MTCH6301 MTCH6301 Projected Capacitive Touch Controller Description: Touch Features: MTCH6301 is a turnkey projected capacitive controller that allows easy integration of multi-touch and gestures to create a rich user interface in your design. Through a sophisticated combination of Self and Mutual


    Original     		PDF MTCH6301 MTCH6301 Co60-4-227-8870

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    R5F21347

    Abstract: R5F21256SDFP r5f64165 M30622F8PGP R5F64166 R5F2134A NEC 180NM CMOS r5f64169 R5F21348 R5F64189
    Text: M16C Family of Microcontrollers R8C • M16C • R32C 2008.9 TABLE OF CONTENTS Family Overview . . . . . . . . . . . 2 Top Reasons to Select M16C . . . . . . . . . . . . . . 4 On-chip Peripherals . . . . . . . 12 Highly Functional Timers . . .12 A/D Converter . . . . . . . . . . .12


    Original     		PDF M16CTM 0908/10K/JP/PF/SP REU01B0032-0101 R5F21347 R5F21256SDFP r5f64165 M30622F8PGP R5F64166 R5F2134A NEC 180NM CMOS r5f64169 R5F21348 R5F64189

    u18 202 sensor hall

    Abstract: DS33014 DS70605 three phase induction motor control schematics di schematic diagram inverter 24V to 3 PHASE bldc dsPICDEM MCHV DEVELOPMENT BOARD DS70316 4000w smps MC6024 u18 sensor hall
    Text: dsPICDEM MCHV Development System User’s Guide  2009 Microchip Technology Inc. DS70605A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.


    Original     		PDF DS70605A DS70605A-page u18 202 sensor hall DS33014 DS70605 three phase induction motor control schematics di schematic diagram inverter 24V to 3 PHASE bldc dsPICDEM MCHV DEVELOPMENT BOARD DS70316 4000w smps MC6024 u18 sensor hall

    pic16f87a

    Abstract: DS39582 pic16f877a full instruction set pic16f877a manual PIC16F877A ARCHITECTURE PIC16F87A7 PIC16F876A programmer circuit diagram PIC16F877AP PIC16f873a example code to config spi PIC16F877a SAMPLE C pwm program
    Text: M PIC16F87XA Data Sheet 28/40-pin Enhanced FLASH Microcontrollers  2001 Microchip Technology Inc. Advance Information DS39582A Note the following details of the code protection feature on PICmicro MCUs. • • • • • • The PICmicro family meets the specifications contained in the Microchip Data Sheet.


    Original     		PDF PIC16F87XA 28/40-pin DS39582A PIC16F877A-I/L PIC16F877AI/ML PIC16F877AI/P PIC16F877AI/PT PIC16F877AT44 pic16f87a DS39582 pic16f877a full instruction set pic16f877a manual PIC16F877A ARCHITECTURE PIC16F87A7 PIC16F876A programmer circuit diagram PIC16F877AP PIC16f873a example code to config spi PIC16F877a SAMPLE C pwm program

    Untitled

    Abstract: No abstract text available
    Text: PIC16 L F1717/8/9 Cost Effective 8-Bit Intelligent Analog Flash Microcontrollers Description: PIC16(L)F1717/8/9 microcontrollers combine Intelligent Analog integration with low cost and extreme low power (XLP) to suit a variety of general purpose applications. These 28-pin and 40-pin devices deliver on-chip op amps, Core


    Original     		PDF PIC16 F1717/8/9 F1717/8/9 28-pin 40-pin 16-Level

    MICROWAVE ASSOCIATES ISOLATOR

    Abstract: AS218 transistor
    Text: Semiconductor Discretes for RF-Microwave Applications Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high-performance analog and mixed-signal semiconductors enabling mobile connectivity. The company’s power amplifiers, front-end modules and


    Original     		PDF CAT501-09A MICROWAVE ASSOCIATES ISOLATOR AS218 transistor

    41291G

    Abstract: PIC16F887 Free Projects PIC16F887 Free Projects of lcd hi-tech c PIC16f887 interfacing with graphical lcd PIC16F887 example codes SPI PIC16f887 example codes PIC16F887 PWM c programming PIC16F887 SPECIFICATIONS 40 pins 16F886 PIC16F886 Free Projects
    Text: PIC16F882/883/884/886/887 28/40/44-Pin Flash-Based, 8-Bit CMOS Microcontrollers High-Performance RISC CPU: Peripheral Features: • Only 35 Instructions to Learn: - All single-cycle instructions except branches • Operating Speed: - DC – 20 MHz oscillator/clock input


    Original     		PDF PIC16F882/883/884/886/887 28/40/44-Pin r78-366 DS41291G-page 41291G PIC16F887 Free Projects PIC16F887 Free Projects of lcd hi-tech c PIC16f887 interfacing with graphical lcd PIC16F887 example codes SPI PIC16f887 example codes PIC16F887 PWM c programming PIC16F887 SPECIFICATIONS 40 pins 16F886 PIC16F886 Free Projects