Senju
Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
|
Original
|
PDF
|
SPT-70-OF-2063
Senju
H60A
senju h63a
Senju Sn Pb 60 40 solder
senju solder paste
H63A
Senju metal solder paste
Ultrasonic flow
|
Senju
Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
|
Original
|
PDF
|
SPT-70-OF-2063
Senju
senju h63a
senju solder paste
Senju flux
solder paste
H63A
Senju metal solder paste
H60A
|
senju solder paste
Abstract: Senju
Text: !Solder and Flux 1 Solder Paste Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%) For your reference, we are using 'SPT-70-0F-2063', manufactured by SENJU METAL INDUSTRY CO.,
|
Original
|
PDF
|
SPT-70-0F-2063'
senju solder paste
Senju
|
M705-GRN360-MZ
Abstract: M705-GRN360 M705-GRN360-M-Z NC257 senju solder bar WLCSP stencil design
Text: AN11046 DSN0603-2 SOD962 soldering requirements Rev. 1 — 1 June 2012 Application note Document information Info Content Keywords DSN0603-2 (SOD962), 0201 package size, reflow soldering, surface mount, solder paste, solder mask opening, Printed-Circuit Board (PCB),
|
Original
|
PDF
|
AN11046
DSN0603-2
OD962)
M705-GRN360-MZ
M705-GRN360
M705-GRN360-M-Z
NC257
senju solder bar
WLCSP stencil design
|
senju m705 solder paste
Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
|
Original
|
PDF
|
LD-E7-5-14-A
senju m705 solder paste
Solder bar of Senju M705
M705-221BM5-42-11
|
Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4E *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
|
Original
|
PDF
|
LD-E7-7-14-A
|
Senju M705-GRN360-K2-V
Abstract: Senju M705-GRN360-K2-V solder paste solder paste M705-GRN360-K2-V Senju oz 221 pcb warpage after reflow M705-GRN360 senju M705-GRN360-K2 fh4219
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.3 mm Pitch, 0.65 mm above the board, Top Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors
|
Original
|
PDF
|
31pos.
Senju M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
solder paste M705-GRN360-K2-V
Senju oz 221
pcb warpage after reflow
M705-GRN360
senju
M705-GRN360-K2
fh4219
|
Front Flip Lock Actuator
Abstract: No abstract text available
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
|
Original
|
PDF
|
FH29B
Front Flip Lock Actuator
|
Senju M705
Abstract: M705 solder paste senju m705 solder paste
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
|
Original
|
PDF
|
|
CL580-3700-8-00
Abstract: M705-221CM5
Text: 0.5 mm Pitch, 1.5 mm Above-the-Board, High-Speed Transmission FPC Connector FH55 Series FH55 Differential Impedance 70ps rise time 20-80% 100+15%[ø] 100[ø] 100-15%[ø] Dimensional Diagram: 40 pins •Characteristics 4 mm (mounting area) 23.4mm 1.FPC Connector for High-Speed Transmission
|
Original
|
PDF
|
|
pap7501
Abstract: PAP7501V pas6311 FUSB200 LFM-48W almit lfm 48w Almit LFM-48W 25F512A M705-GRN360 PAS6311LT
Text: PAP7501V PAP7501V USB2.0 PC Camera Controller General Description The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0
|
Original
|
PDF
|
PAP7501V
PAP7501V
30fps
pap7501
pas6311
FUSB200
LFM-48W
almit lfm 48w
Almit LFM-48W
25F512A
M705-GRN360
PAS6311LT
|
94v-0 lcd display
Abstract: UM-25 lcd display 94V0
Text: Low Profile 0.3mm Pitch Connectors For FPC FH18 Series 1.8mm 1.8mm height above the mounting surface •Features LIF terminal contacts 1. Low profile 0.3mm pitch FPC connectors In response to continuous miniturization of products, the demand for smaller contact spacing on connectors is increasing. Flexible printed
|
Original
|
PDF
|
|
Senju M705-GRN360-K2-V
Abstract: Senju M705-GRN360-K2-V solder paste Senju M705-GRN360-K2-V datasheet
Text: www.fairchildsemi.com AN-9078 Surface Mount Guidelines for Motion SPM 7 Series Introduction Soldering Condition This application note provides assembly guidelines for the PQFN package of the Motion SPM® 7 series. This document focuses on the design of stencil, which plays a
|
Original
|
PDF
|
AN-9078
Senju M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
Senju M705-GRN360-K2-V datasheet
|
Untitled
Abstract: No abstract text available
Text: 㩷 Doc. No. DG-097016C ISSUED March 05, 2010 SYSTEM DEVICE DIVISION Υ ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION ᭽ᦠ SPECIFICATIONS ຠฬ 㕙ታⵝဳ LED Product name Surface Mount LED ᒻฬ GM2BB40BM0C Model No. 㪩㪼㪽㪼 㔚ሶ࠺ࡃࠗࠬᬺᧄㇱ
|
Original
|
PDF
|
DG-097016C
GM2BB40BM0C
DG-097016C
|
|
|
Senju
Abstract: senju m705 solder paste M705 solder paste
Text: 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors FH 23 Series ●Staggered termination configuration. Only 1.25 mm above the board. Leadless type Completely enclosed bottom surface Lead type 1.25mm •Features 1. FPC low insertion force and high holding force
|
Original
|
PDF
|
|
Senju paste 7100
Abstract: M705-221CM5 40 pin zif connector 1mm FPC LCD 40 pin zif connector 1mm FPC Senju 7100 reflow profile 1mm 30 pin fpc connector Senju 1mm 40 pin fpc connector 32 PIN FPC CONNECTOR FH26-13S-0.3SHW
Text: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.
|
Original
|
PDF
|
|
MCPD-2000
Abstract: GM5SAE27P0A 357 opto Sharp
Text: Technical Document LED Specification EC/Opto Group GM5SAE27P0A LED for Lighting Applications Product Specification September 2010 1900 mcd, PLCC2 SMD packaged Warm White 2700K , High CRI (85) LED. Full Specifications Listing. Model No. GM5SAE27P0A Doc Do
|
Original
|
PDF
|
GM5SAE27P0A
2700K)
DG-097018B
GM5SAE27P0A
MCPD-2000
357 opto Sharp
|
NCP18XH103D0SRB
Abstract: heraeus pc 3000 NCG18XH103 NCP15XH103D0SRC NCP18WF104D0SRB NCG18XH103F0SRB Senju M705-grn360-k2-v NXFS15XH103 PRF18BE471QS5RB BC 5609
Text: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
|
Original
|
PDF
|
R03E-6
NCP18XH103D0SRB
heraeus pc 3000
NCG18XH103
NCP15XH103D0SRC
NCP18WF104D0SRB
NCG18XH103F0SRB
Senju M705-grn360-k2-v
NXFS15XH103
PRF18BE471QS5RB
BC 5609
|
Solder bar of Senju M705
Abstract: Senju M705 solder bar Senju ESR-250 Senju M705 safety senju M705-221BM5-42-11 senju m705 solder wire solder paste m705 EIAJ C-3 Senju M705 material safety senju m705 solder wire 0.5 mm
Text: Technical Document LED Specification EC/Opto Group GM2BB50BM0C LED for Lighting Applications Product Specification December 2010 “Double Dome” Module: High-output, 5000 K LED Module 52 lm High Color Rendering (85 CRI) suited for lighting applications
|
Original
|
PDF
|
GM2BB50BM0C
rDG-097015D
GM2BB50BM0C
DG-097015D
Solder bar of Senju M705
Senju M705 solder bar
Senju ESR-250
Senju M705 safety
senju M705-221BM5-42-11
senju m705 solder wire
solder paste m705
EIAJ C-3
Senju M705 material safety
senju m705 solder wire 0.5 mm
|
WLCSP stencil design
Abstract: ja 16201 WLCSP smt Texas SBVA017 wcsp wcsp reliability A104B IPC-7525 JESD22 S2062
Text: Application Report SBVA017 - February 2004 NanoStart & NanoFreet 300mm Solder Bump Wafer Chip-Scale Package Application Jim Rosson High Performance Analog—MAKE Packaging ABSTRACT The NanoStartWafer Chip-Scale Package WCSP is a family of bare die packages
|
Original
|
PDF
|
SBVA017
300mm
MO-211
WLCSP stencil design
ja 16201
WLCSP smt Texas
wcsp
wcsp reliability
A104B
IPC-7525
JESD22
S2062
|
Senju M705-GRN360-K1
Abstract: senju solder paste m705-grn360-k1 v Senju M705-GRN360-K1 15Z202-1H1L5 M705-GRN360-K
Text: TECHNICAL DATA SHEET DRAFT 15 15C102-40ML-NM PCB HOUSING RF_35/06.07/5.0 All dimensions are in mm; tolerances according to ISO 2768 m-H Rosenberger Hochfrequenztechnik GmbH & Co. KG P.O.Box 1260 D-84526 Tittmoning Germany www.rosenberger.de Tel.: +49 8684 18-0
|
Original
|
PDF
|
15C102-40ML-NM
D-84526
15Z202-1H1L5,
M705-GRN360-K1
Senju M705-GRN360-K1
senju solder paste m705-grn360-k1 v
Senju
15Z202-1H1L5
M705-GRN360-K
|
15K101-40ME4
Abstract: Senju M705-GRN360-K1 rosenberger
Text: TECHNICAL DATA SHEET 15 15K101-40ME4 RF TEST SWITCH Circuit Antenna RF_35/05.04/2.0 All dimensions are in mm; tolerances according to ISO 2768 m-H Rosenberger Hochfrequenztechnik GmbH & Co. KG P.O.Box 1260 D-84526 Tittmoning Germany www.rosenberger.de Tel.: +49 8684 18-0
|
Original
|
PDF
|
15K101-40ME4
D-84526
15K101-40ME4
Senju M705-GRN360-K1
rosenberger
|
Senju M705-GRN360-K1
Abstract: 15K101-40M M705-GRN360 senju solder paste m705-grn360-k1 v 15K101-40MB1-NM M705-GRN360-K1
Text: TECHNICAL DATA SHEET 15 15K101-40MB1-NM RF TEST SWITCH Circuit Antenna All dimensions are in mm; tolerances according to ISO 2768 m-H Material and plating RF_35/05.04/2.0 Non-magnetic version Connector parts Housing Switching spring Stationary spring Spring carrier
|
Original
|
PDF
|
15K101-40MB1-NM
D-84526
Senju M705-GRN360-K1
15K101-40M
M705-GRN360
senju solder paste m705-grn360-k1 v
15K101-40MB1-NM
M705-GRN360-K1
|
Untitled
Abstract: No abstract text available
Text: CURRENT SENSING BLR EU RoHS 角形セメント面実装抵抗器 Ceramic Case Surface Mount Resistors •構造図 Construction 3L W L ③ ④ H t ① ● ● ● ● ● ● ● ● ● セラミックケース 電極 抵抗体 封入剤 放熱板 ⑤ W1
|
Original
|
PDF
|
|