SENJU Search Results

Senju

Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

Senju

Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

senju solder paste

Abstract: Senju
Contextual Info: !Solder and Flux 1 Solder Paste Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%) For your reference, we are using 'SPT-70-0F-2063', manufactured by SENJU METAL INDUSTRY CO.,

M705-GRN360-MZ

Abstract: M705-GRN360 M705-GRN360-M-Z NC257 senju solder bar WLCSP stencil design
Contextual Info: AN11046 DSN0603-2 SOD962 soldering requirements Rev. 1 — 1 June 2012 Application note Document information Info Content Keywords DSN0603-2 (SOD962), 0201 package size, reflow soldering, surface mount, solder paste, solder mask opening, Printed-Circuit Board (PCB),

senju m705 solder paste

Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4E *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Senju M705-GRN360-K2-V

Abstract: Senju M705-GRN360-K2-V solder paste solder paste M705-GRN360-K2-V Senju oz 221 pcb warpage after reflow M705-GRN360 senju M705-GRN360-K2 fh4219
Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.3 mm Pitch, 0.65 mm above the board, Top Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors

Front Flip Lock Actuator

Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

Senju M705

Abstract: M705 solder paste senju m705 solder paste
Contextual Info: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices

CL580-3700-8-00

Abstract: M705-221CM5
Contextual Info: 0.5 mm Pitch, 1.5 mm Above-the-Board, High-Speed Transmission FPC Connector FH55 Series FH55 Differential Impedance 70ps rise time 20-80% 100+15%[ø] 100[ø] 100-15%[ø] Dimensional Diagram: 40 pins •Characteristics 4 mm (mounting area) 23.4mm 1.FPC Connector for High-Speed Transmission

pap7501

Abstract: PAP7501V pas6311 FUSB200 LFM-48W almit lfm 48w Almit LFM-48W 25F512A M705-GRN360 PAS6311LT
Contextual Info: PAP7501V PAP7501V USB2.0 PC Camera Controller General Description The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0

94v-0 lcd display

Abstract: UM-25 lcd display 94V0
Contextual Info: Low Profile 0.3mm Pitch Connectors For FPC FH18 Series 1.8mm 1.8mm height above the mounting surface •Features LIF terminal contacts 1. Low profile 0.3mm pitch FPC connectors In response to continuous miniturization of products, the demand for smaller contact spacing on connectors is increasing. Flexible printed

Senju M705-GRN360-K2-V

Abstract: Senju M705-GRN360-K2-V solder paste Senju M705-GRN360-K2-V datasheet
Contextual Info: www.fairchildsemi.com AN-9078 Surface Mount Guidelines for Motion SPM 7 Series Introduction Soldering Condition This application note provides assembly guidelines for the PQFN package of the Motion SPM® 7 series. This document focuses on the design of stencil, which plays a

Contextual Info: 㩷 Doc. No. DG-097016C ISSUED March 05, 2010 SYSTEM DEVICE DIVISION Υ ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION ઀᭽ᦠ SPECIFICATIONS ຠฬ ⴫㕙ታⵝဳ LED Product name Surface Mount LED ᒻฬ GM2BB40BM0C Model No. 㪩㪼㪽㪼 㔚ሶ࠺ࡃࠗࠬ੐ᬺᧄㇱ

Senju

Abstract: senju m705 solder paste M705 solder paste
Contextual Info: 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors FH 23 Series ●Staggered termination configuration. Only 1.25 mm above the board. Leadless type Completely enclosed bottom surface Lead type 1.25mm •Features 1. FPC low insertion force and high holding force

Senju paste 7100

Abstract: M705-221CM5 40 pin zif connector 1mm FPC LCD 40 pin zif connector 1mm FPC Senju 7100 reflow profile 1mm 30 pin fpc connector Senju 1mm 40 pin fpc connector 32 PIN FPC CONNECTOR FH26-13S-0.3SHW
Contextual Info: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.

MCPD-2000

Abstract: GM5SAE27P0A 357 opto Sharp
Contextual Info: Technical Document LED Specification EC/Opto Group GM5SAE27P0A LED for Lighting Applications Product Specification September 2010 1900 mcd, PLCC2 SMD packaged Warm White 2700K , High CRI (85) LED. Full Specifications Listing. Model No. GM5SAE27P0A Doc Do

NCP18XH103D0SRB

Abstract: heraeus pc 3000 NCG18XH103 NCP15XH103D0SRC NCP18WF104D0SRB NCG18XH103F0SRB Senju M705-grn360-k2-v NXFS15XH103 PRF18BE471QS5RB BC 5609
Contextual Info: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

Solder bar of Senju M705

Abstract: Senju M705 solder bar Senju ESR-250 Senju M705 safety senju M705-221BM5-42-11 senju m705 solder wire solder paste m705 EIAJ C-3 Senju M705 material safety senju m705 solder wire 0.5 mm
Contextual Info: Technical Document LED Specification EC/Opto Group GM2BB50BM0C LED for Lighting Applications Product Specification December 2010 “Double Dome” Module: High-output, 5000 K LED Module 52 lm High Color Rendering (85 CRI) suited for lighting applications

WLCSP stencil design

Abstract: ja 16201 WLCSP smt Texas SBVA017 wcsp wcsp reliability A104B IPC-7525 JESD22 S2062
Contextual Info: Application Report SBVA017 - February 2004 NanoStart & NanoFreet 300mm Solder Bump Wafer Chip-Scale Package Application Jim Rosson High Performance Analog—MAKE Packaging ABSTRACT The NanoStartWafer Chip-Scale Package WCSP is a family of bare die packages

Senju M705-GRN360-K1

Abstract: senju solder paste m705-grn360-k1 v Senju M705-GRN360-K1 15Z202-1H1L5 M705-GRN360-K
Contextual Info: TECHNICAL DATA SHEET DRAFT 15 15C102-40ML-NM PCB HOUSING RF_35/06.07/5.0 All dimensions are in mm; tolerances according to ISO 2768 m-H Rosenberger Hochfrequenztechnik GmbH & Co. KG P.O.Box 1260 D-84526 Tittmoning Germany www.rosenberger.de Tel.: +49 8684 18-0

15K101-40ME4

Abstract: Senju M705-GRN360-K1 rosenberger
Contextual Info: TECHNICAL DATA SHEET 15 15K101-40ME4 RF TEST SWITCH Circuit Antenna RF_35/05.04/2.0 All dimensions are in mm; tolerances according to ISO 2768 m-H Rosenberger Hochfrequenztechnik GmbH & Co. KG P.O.Box 1260 D-84526 Tittmoning Germany www.rosenberger.de Tel.: +49 8684 18-0

Senju M705-GRN360-K1

Abstract: 15K101-40M M705-GRN360 senju solder paste m705-grn360-k1 v 15K101-40MB1-NM M705-GRN360-K1
Contextual Info: TECHNICAL DATA SHEET 15 15K101-40MB1-NM RF TEST SWITCH Circuit Antenna All dimensions are in mm; tolerances according to ISO 2768 m-H Material and plating RF_35/05.04/2.0 Non-magnetic version Connector parts Housing Switching spring Stationary spring Spring carrier

Contextual Info: CURRENT SENSING BLR EU RoHS 角形セメント面実装抵抗器 Ceramic Case Surface Mount Resistors •構造図 Construction 3L W L ③ ④ H t ① ● ● ● ● ● ● ● ● ● セラミックケース 電極 抵抗体 封入剤 放熱板 ⑤ W1