745B Search Results

2SD745

Abstract: 2SB705 2SB705A 2SD745A 705B 745B
Contextual Info: 2SB705.705A,705B 2SI>745.745A,745B 2SB705,705A,705B/2SD745,745A,745B P N P NPN P N P N PN SILICO N T R IP L E D IFFU SED TR A N SIST O R Audio Frequency Pow er Amplifier • tt FEATURES • 2 . 4 8 « t - n . V '* -r 'r — > ~ ? h b . - Mo Id pow er I r a a n s to r m ounted by m o b o lts.

745B

Abstract: SS-738855-NF
Contextual Info: DATE REV ECN APP'D. BY 2/3/06 A2 745B JM ,350 [B.59] .100 [2 5 4 ] .050 [1,27] TYP TQL NON-ACCUM l j T V è- -é - TYPICAL HOLE LAYOUT 0 .035 [.0.39] B -.100 [2.54] TYP TOL NON-ACCUM B (Id POSITIONS) 2.853 [72.47] MAX. -H O Û1 pH NOTES: 1. CONNECTOR MATERIALS:

Contextual Info: b cn 4- A B< > C ® t 1 110 .083 .055 1 A © FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE 48 TERMINAL LEADLESS CHIP CARRIER PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ASH98006A REV: B CASE NUMBER: 745B-02 14 SEP 2005 STANDARD: NON-JEDEC

hanna hi-1285

Contextual Info: DATE REV ECN APP'D. BY 2/2/06 A2 745B JM -4-.554 [115.67] MAX • B .550 [13.97] REF TYP n jT E Œ H ~T - 4-.3DQ [109.22] NOTES: L 1. CONNECTOR MATERIALS: a HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: DATE REV ECN APP'D. BY 2/3/06 A2 745B JM .□50 [1.Z7] TYP TOL NON-ACCUM * .D35 [.D.B9] B -.100 [2.54] TYP TOL NON-ACCUM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: DATE REV ECN APP'D. BY 2/3/06 B1 745B JM .350 [0.69] .100 [2.54] .050 [1.27] TYP i j T TOL NON-ACCUM - -f - -f- t> .035 [.0.B9] 8 -é- -è- •.1OD [2 .5 + ] TYP TOL N O N -A C C U M TYPICAL HOLE LAYOUT O S © 0 .035 [0,89] B4- HOLES 0 .062 [1.57] 9 HOLES

Contextual Info: DATE REV ECN APP'D. BY 2/2/06 A1 745B JM B - -.050 [21.59] M A X - ^ X ja 1 X rO o o NOTES: C3> LT> L-O 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: DATE REV ECN APP'D. BY 2/3/06 A4 745B JM .350 [as9] .100 [1 5 4 ] .050 [1.27] TYP TOL NON-ACCUM 11 B D ,D35 [.D.S9] B T -.1 0 0 [2 5 4 ] TYP TYPICAL HOLE LAYOUT TOL NON-ACCUM (4 POSITIONS) NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0

Contextual Info: DATE REV ECN APP'D . B Y 2/2/06 A2 745B JM B .850 [21.59] MAX ~ \_ /I ¡3 ci £ •^5 o NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: .04D [1.02]- COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

939B

Contextual Info: .350 DATE REV ECN 11/3/00 BO 3903 TRM 6/Z7/01 B1 5104 TRM 2/3/06 B2 745B JM APP'D. BY [&89] .1 DO [2.54] .050 [1.27] TYP TOL NON-ACCUM I j T líXICTCTÍ e © Q © Id Q -é- -é - -$ - TYPICAL HOLE LAYOUT g <t .D35 [.D.89] a -.100 [2.54] TYP TOL NON-ACCUM

2SB705

Abstract: 120w audio power amplifier 2SD745 705A 2SB705A 2SB705B
Contextual Info: Inchange Semiconductor Product Specification 2SB705/705A/705B Silicon PNP Power Transistors ・ DESCRIPTION ・With MT-200 package ・Complement to type 2SD745/745A/745B APPLICATIONS ・Audio frequency power amplifier ・Suitable for output stages of 60~120W audio

2N7626

Abstract: 2N7626UB IRHLUB7970Z4 MOSFET cross-reference 2N7626UBN 3PAD jan,tx series semiconductors um 031 diode
Contextual Info: The documentation and process conversion measures necessary to comply with this revision shall be completed by 18 June 2010. INCH-POUND MIL-PRF-19500/745B 18 March 2010 SUPERSEDING MIL-PRF-19500/745A 26 February 2009 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, FIELD EFFECT TRANSISTOR, P-CHANNEL,

Contextual Info: DATE REV ECN APP'D. BY 2/2/06 A1 745B JM B -1.203 [3D.5B] MAX.io CNI Ö NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER

Contextual Info: DATE REV ECN APP'D. BY 2/2/06 A1 745B JM B • x : U m ün ~T NOTES: 1. CONNECTOR MATERIALS: o o HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: NÌ S S - CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER

Contextual Info: DATE REV ECN APP'D. BY 2/2/06 A2 745B JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.

Contextual Info: DATE REV ECN APP'D. BY 2/3/06 A2 745B JM 1 ÿ s 'evi' cd CM e ro - i I \ a ,— n . i B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: DATE REV ECN APP'D. BY 2/2/06 A2 745B JM .350 .100 [154] il [4 8 9 ] T S cd TYPICAL HOLE LAYOUT 4 POSITIONS .D5D [1.Z7] TYP TOL NON-ACCUM 0 .D35 [.D.S9] (B) -.100 [2 5 4 ] TYP TOL NON-ACCUM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0

ROW96

Contextual Info: DATE REV ECN APP'D. BY 2/3/06 A2 745B JM ,35D [a.B9] .1 OD [2 .5 4 ] .05D [127] TYP ì j T - - r i* - TOL NON-ACCUM I /-S t -è- -è- .035 [.0.89] 8 - .1DO [2.54-] TYP TYPICAL HOLE LAYOUT TOL NON-ACCUM (12 POSITIONS) B SUGGESTED PANEL OPENING (N T S J NOTES:

Contextual Info: DATE REV ECN APP'D. BY 2/3/06 A3 745B JM .350 .100 [254] u [B.S9] .050 [1.27] TYP TOL N O N -A C CU M -ç - 0 .035 [.0.B9] a ¿- 1 5 T S e s 5 e Ï - .1OD [2.54] TYP TYPICAL HOLE LAYOUT S. TOL N O N -A C C U M (12 POSITIONS) 1 1 B •3 .4 2 9 [B7.1Q] M A X .-

BB9 connector

Contextual Info: DATE REV ECN APP'D. BY 2/3/06 B2 745B JM .350 .100 [2.54] Ij T [B.B9] .050 [1,27] TYP TOL NON-ACCUM -f- t> .035 [,0.89] 5 è- -0- - .10D [2.54] TYP TOL NON-ACCUM TYPICAL HOLE LAYOUT (16 POSTIONS) B 4-.5D4- [114.40] MAX, p L r n id T NOTES: 1, CONNECTOR MATERIALS:

Contextual Info: DATE REV ECN APP'D. BY 2/3/06 A2 745B JM B SUGGESTED PANEL OPENING NJ.S. NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER

Contextual Info: DATE REV ECN APP'D. BY 2/3/06 A2 745B JM 1 ^Nj o e © 5 5 © 3 | Q 5. T B -2.329 [59.16] MAX.- NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: DATE REV ECN APP'D. BY 2/2/06 A2 745B JM mr inmii nim m minim i i m n iim 11in i i l i irL-|_ j-iani 1 1 1 u_i_ j-u 1 1 1 1 itii |_ j i i i inirTiri □ - -*2.354 [5 9.79] MAX- B .550 [13.97] REF TYP .455 [11.5B] NOTES: 1. CONNECTOR MATERIALS:

2SD745

Abstract: 2SD745A 2SD745B 120W AUDIO audio power amplifiers with transistors
Contextual Info: SavantIC Semiconductor Product Specification 2SD745/745A/745B Silicon NPN Power Transistors DESCRIPTION •With MT-200 package ·Complement to type 2SB705/705A/705B APPLICATIONS ·Audio frequency power amplifier ·Suitable for output stages of 60~120W audio