881EXXC Search Results
881EXXC Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation |
Original |
GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC | |
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Contextual Info: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation |
Original |
GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC | |
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Contextual Info: GS881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 100-lead | |
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Contextual Info: GS881E18/32/36C T/D -xxx 100-Pin TQFP & 165-bump BGA Commercial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation |
Original |
GS881E18/32/36C 100-Pin 165-bump supply881E18C 100-lead 881E18C | |
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Contextual Info: GS881E18/32/36C T/D -xxxIV 100-Pin TQFP & 165-bump BGA Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan |
Original |
GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC | |
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Contextual Info: GS881E18/32/36C T/D -xxxI 100-Pin TQFP & 165-bump BGA Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation |
Original |
GS881E18/32/36C 100-Pin 165-bump supply881E18C 100-lead 881E18C | |
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Contextual Info: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation |
Original |
GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC | |
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Contextual Info: GS881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 881E18C | |
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Contextual Info: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan |
Original |
GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC | |
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Contextual Info: Preliminary GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC |