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    DPS3232V Price and Stock

    Twilight Technology, Inc DPS3232V-35B

    SRAM MODULE, 128KX8, 35NS, CMOS, CPGA66
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components DPS3232V-35B 20
    • 1 $750
    • 10 $600
    • 100 $600
    • 1000 $600
    • 10000 $600
    		Buy Now

    Integrated Device Technology Inc DPS3232V-35M

    SRAM MODULE, 128KX8, 35NS, CMOS, CPGA66
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components DPS3232V-35M 5
    • 1 $600
    • 10 $520
    • 100 $520
    • 1000 $520
    • 10000 $520
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    Paradigm Technology Inc DPS3232V-20C

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components DPS3232V-20C 1
    • 1 $12.2454
    • 10 $12.2454
    • 100 $12.2454
    • 1000 $12.2454
    • 10000 $12.2454
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    Others DPS3232V-70C

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components DPS3232V-70C 1
    • 1 $20.9396
    • 10 $20.9396
    • 100 $20.9396
    • 1000 $20.9396
    • 10000 $20.9396
    		Buy Now

    DPS3232V Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit CMOS SRAM D EN SE-PA C DPS3232V M I C R O S Y S Ï li M S DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs are


    OCR Scan     		PDF DPS3232V 66-pin 128Kx32 256Kx32, DPS3232V 12SKX8, 64KX16

    twilight

    Abstract: No abstract text available
    Text: □PM Dense-Pac Microsystems, Inc. DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE O DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 3 2 K X8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceram ic substrate w ith m atching thermal


    OCR Scan     		PDF DPS3232V DPS3232V 66-pin 128KX32 256KX32 S3232 100ns 120ns 150ns twilight

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs


    OCR Scan     		PDF DPS3232V DPS3232V 66-pin 128Kx32 256Kx32, 128KX8, 64KX16 32KX32 30A014-10 275T415

    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit CMOS SRAM D EN SEFAC M I C R O S Y S ï If MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs


    OCR Scan     		PDF DPS3232V-35I-TI DPS3232V-35I-TI 66-pin 64KX32

    Untitled

    Abstract: No abstract text available
    Text: DPS3232V Dense-Pac Microsystems, Inc. ^ 32K X 32 CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceramic LCC packages surface m o u n te d on a co-fired c e ra m ic s u b s tra te w ith m a tc h in g th e rm a l


    OCR Scan     		PDF DPS3232V DPS3232V 66-pin 128KX32 256KX32 30A014-10

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V D E SC R IP T IO N : The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs


    OCR Scan     		PDF DPS3232V 66-pin 128Kx32 256Kx32, DPS3232V 12SKX8. 64KX16 30A014-10

    DPS3232V

    Abstract: No abstract text available
    Text: 1 Megabit CM O S SRAM D EN SE-PA C M ÍC R O S Y SÏ \r, MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs


    OCR Scan     		PDF DPS3232V-35I-TI DPS3232V-35I-TI 66-pin 128KX8, 64KX32 32KX32 A014-1 DPS3232V

    Untitled

    Abstract: No abstract text available
    Text: □PM DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE Dense-Pac Microsystems, Inc. ^ DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceram ic LCC packages surface m o u n te d on a co-fired c e r a m ic s u b s tra te w ith m a tc h in g th e rm a l


    OCR Scan     		PDF DPS3232V DPS3232V 66-pin 128KX32 256KX32

    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit CMOS SRAM DENSE-PAC DPS3232V-35I-TI MÍCRü S Y ST hMS DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs


    OCR Scan     		PDF DPS3232V-35I-TI DPS3232V-35I-TI 66-pin 128KX8, 30A014-15

    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit CMOS SRAM PENSE-PAC MICROSYSTEMS DPS3232V D E SC R IP TIO N : The D PS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic L C C packages surface mounted on a co-fired ceramic substratewith matching thermal coefficients. The LCCs


    OCR Scan     		PDF DPS3232V 66-pin 128Kx32 256Kx32, 30A014-10 DD0121fl

    Untitled

    Abstract: No abstract text available
    Text: □PM •C Dense-Pac Microsystems, Inc ^ DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired c eram ic substrate w ith m atching thermal


    OCR Scan     		PDF DPS3232V DPS3232V 66-pin 128KX32 256KX32 120ns 125-C 30A0I4-10