DS544 Search Results

MP04TT500

Abstract: MP04TT500-25 MP04TT500-26 MP04TT500-27 MP04TT500-28 water cooled thyristor assembly
Contextual Info: MP04TT500 MP04TT500 Dual Thyristor Water Cooled Module DS5446-1.2 May 2001 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint ■ Alumina Non Toxic Isolation Medium ■

AN4502

Abstract: AN4503 GP200MKS12 GP200MLS12 IGBT 200A 1200V application induction heating DIODE 10V 10mA AN5190
Contextual Info: GP200MLK12 GP200MKS12 IGBT Chopper Module Preliminary Information DS5448-1.2 April 2001 FEATURES • Internally Configured With Upper Arm Controlled ■ Non Punch Through Silicon ■ Isolated Copper Baseplate ■ Low Inductance Internal Construction KEY PARAMETERS

Contextual Info: DIM800FSS17-A000 DIM800FSS17-A000 Single Switch IGBT Module Preliminary Information Replaces May 2001 version DS5445-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon DS5445-3.0 October 2001 KEY PARAMETERS

Contextual Info: MDS105AL CosMOS 5-Port 10/100 Mbps Ethernet Switch 1. Features DS5441 ISSUE 2.0 October 2002 Ordering Information • • • • • • • • • • • 4 10/100Mbps auto-negotiating RMII ports 1 10/100Mbps auto-negotiating MII/serial port port 4 that can be used as a WAN uplink or as

MBCR 10M

Contextual Info: MDS105AL CosMOS 5-Port 10/100 Mbps Ethernet Switch 1 Features • • • • • • • • • • • DS5441 4 10/100Mbps auto-negotiating RMII ports 1 10/100Mbps auto-negotiating MII/serial port port 4 that can be used as a WAN uplink or as a 5th port

0x0000020C

Abstract: 0x00000158 0x0000014C 0x00000154 0x00000210 asynchronous fifo vhdl xilinx slot machine block diagram vhdl 0x00000060 0x00000048 0x00000218
Contextual Info: FlexRay v1.1 DS544 May 17, 2007 Product Specification Introduction LogiCORE Facts The LogiCORE FlexRay™ controller implements the FlexRay communication protocol as defined in the FlexRay Protocol Specification v2.1 Rev A. The FlexRay controller implementation supports a single communication channel. This document defines the architecture

MP04TT500

Abstract: MP04TT500-25 MP04TT500-26 MP04TT500-27 MP04TT500-28 av506
Contextual Info: MP04TT500 MP04TT500 Dual Thyristor Water Cooled Module Advance Information DS5446-1.2 May 2001 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint ■ Alumina Non Toxic Isolation Medium

MDS108AL

Abstract: new cosmos MBCR 10M
Contextual Info: MDS108AL CosMOS 9-Port 10/100 Mbps Ethernet Switch 1 Features ISSUE 3 DS5442 November 2002 Ordering Information • • • • • • • • 8 10/100 Mbps auto-negotiating RMII ports Operates stand-alone or can be cascaded with a second MDS108AL to reach 16 ports

DIM2400ESM17-A000

Contextual Info: DIM2400ESM17-A000 Single Switch IGBT Module Replaces DS54447-4.1 DS5447-5 October 2010 LN27617 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)

Contextual Info: DIM800DCM17-A000 IGBT Chopper Module Replaces DS5444-4.2 DS5444-5 April 2011 LN26752 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max) 

Contextual Info: DIM2400ESM17-A000 Single Switch IGBT Module Replaces DS54447-5 DS5447-6 June 2012 LN29603 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

BUSBAR calculation datasheet

Abstract: MP04TT500 MP04TT500-25 MP04TT500-26 MP04TT500-27 MP04TT500-28 11200A water cooled thyristor assembly
Contextual Info: MP04TT500 MP04TT500 Dual Thyristor Water Cooled Module Advance Information DS5446-1.2 May 2001 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint ■ Alumina Non Toxic Isolation Medium

DS5445-4

Abstract: DIM800FSS17-A000
Contextual Info: DIM800FSS17-A000 DIM800FSS17-A000 Single Switch IGBT Module Replaces October 2001 version DS5445-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon DS5445-4.0 March 2002 KEY PARAMETERS VCES typ

flexray PROTOCOL

Abstract: 0x0000020C slot machine block diagram vhdl 0x00000204 0x00000158 Spartan 3E VHDL code 0x00000338 0x0000014C 0x00000210
Contextual Info: - DISCONTINUED PRODUCT 0 FlexRay v1.1 DS544 May 17, 2007 Product Specification Introduction LogiCORE Facts The LogiCORE FlexRay™ controller implements the FlexRay communication protocol as defined in the FlexRay Protocol Specification v2.1 Rev A. The FlexRay

Contextual Info: MDS105AL CosMOS 5-Port 10/100 Mbps Ethernet Switch 1. Features DS5441 ISSUE 2.0 October 2002 Ordering Information • • • • • • • • • • • 4 10/100Mbps auto-negotiating RMII ports 1 10/100Mbps auto-negotiating MII/serial port port 4 that can be used as a WAN uplink or as

12v to 1000v inverters circuit diagrams

Abstract: bi-directional switches IGBT ups circuit diagram using igbt DIM2400ESM17-A000
Contextual Info: DIM2400ESM17-A000 DIM2400ESM17-A000 Single Switch IGBT Module Replaces March 2002, version DS5447-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5447-4.1 July 2002

bi-directional switches IGBT

Abstract: DIM800DCM17-A000 25675
Contextual Info: DIM800DCM17-A000 DIM800DCM17-A000 IGBT Chopper Module Replaces issue March 2002, version DS5444-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5444-4.1 July 2002

DIM2400ESM17-A000

Abstract: DIM2400ESM17-A
Contextual Info: DIM2400ESM17-A000 Single Switch IGBT Module Replaces DS54447-5 DS5447-6 June 2012 LN29603 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

DFM900FXM18-A000

Contextual Info: DFM900FXM18-A000 DFM900FXM18-A000 Fast Recovery Diode Module Preliminary Information DS5441-1.3 April 2001 FEATURES • Low Reverse Recovery Charge ■ High Switching Speed ■ Low Forward Voltage Drop KEY PARAMETERS VRRM VF typ (max) IF (max) IFM 1800V

DIM800DCM17-A000

Contextual Info: DIM800DCM17-A000 IGBT Chopper Module DS5444- 4.2 May 2006 LN24610 FEATURES • 10µs Short Circuit Withstand • High Thermal Cycling Capability • Non Punch Through Silicon • Isolated MMC Base with AIN Substrate KEY PARAMETERS VCES VCE (sat)* (typ) IC

DFM900FXM18-A000

Contextual Info: DFM900FXM18-A000 DFM900FXM18-A000 Fast Recovery Diode Module DS5441-1.3 April 2001 FEATURES • Low Reverse Recovery Charge ■ High Switching Speed ■ Low Forward Voltage Drop KEY PARAMETERS VRRM VF typ (max) IF (max) IFM 1800V 2.0V 900A 1800A ■ Isolated Base

Contextual Info: MGCM03 CDMA Baseband Interface Advanced Information DS5448 ISSUE 1.1 Features • • • • • • • • • • • IS95 CDMA Compatible. Compatible with Zarlink RF Cellular Products. 3 Volt / Low Power operation, with flexible power saving modes. Standard Baseband I and Q Interface.

DFM900FXM18-A000

Contextual Info: DFM900FXM18-A000 DFM900FXM18-A000 Fast Recovery Diode Module Preliminary Information DS5441-1.3 April 2001 FEATURES • Low Reverse Recovery Charge ■ High Switching Speed ■ Low Forward Voltage Drop KEY PARAMETERS VRRM VF typ (max) IF (max) IFM 1800V

DIM400DDM17-A000

Contextual Info: DIM400DDM17-A000 DIM400DDM17-A000 Dual Switch IGBT Module Replaces September 2001, version DS5449-2.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5449-3.0 March 2002