FBGA73 Search Results

Contextual Info: P-FBGA73-091E-0.80AZ Uniti nn Jan,2004

Contextual Info: P—FBGA73—0912—0.80AZ Unit' nn 0 — 1. 40MAX rp rg o i 0. 33±0. 05 C II ^ nrroi, . ID. 8 0 I oooicboo DOOOOOOCD 0000|000 0 o_o_o o_oio o_o_o : o o o o o jo o o o 'o oooooooo OOOO'OOOO Q OOolo OO o\ I ©0 \lN D E X I a. 1 2 3 4 5 6 7 8 9 1 0 a J Jan.2004

Contextual Info: P—FBGA73—0912—0.80BZ

NAND FLASH BGA

Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
Contextual Info: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction

Contextual Info: P—FBGA73—101E—0.80AZ Uniti nn Jan,2004

Contextual Info: P—FBGA73—091E—0.80DZ Uniti nn Feb.2004

Contextual Info: P—FBGA73—0912—0.80BZ Unit' nn m— ^ 1. 40MAX ID. 80 I n rw i,. 0. 33±0. 05 o II oooicboo CD DOOOOOOCD 0000|000 0 o_o_o o_oio o_o_o : o o o o o jo o o o 'o oooooooo OOOO'OOOO Q O O olo O O o \\ l N D E X II ©0 a. 1 2 3 4 5 J 6 7 8 9 1 0 a Jan.2004

M02142

Abstract: CSOP-48 BGA672 CS36 J-STD-020A ultrasonic full bridge cleaning S02-1 FD-FBGA-60 FBGA-304 tsop-48 flash
Contextual Info: Package Mounting Methods Mounting Methods/Reliability/Storage 1. Mounting Methods 2. Surface Mounted Plastic Package Reliability 3. Storage DB81-10004-2E 1 Package Mounting Methods (Mounting Methods/Reliability/Storage) 1. Mounting Methods PACKAGE 1. Mounting Methods

Contextual Info: P—FBGA73—091E—0.80BZ Uniti nn Jan,2004

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and