FBGA69 Search Results

Contextual Info: P-FBGA69-091E-0.80A3 Uniti nn Jul.2003

Contextual Info: P —FBGA69—1209—0.80A3 1. 4M AX • 4-► 3 3 ± 0 , 05 •*O,- ö J [S] ^ Q Uniti nn 1 - 4 1 mm 5 , [UT501 60 [UT5D1 fo r m i - ► o o o o m Li") O r^ 3Q <c DO 3 3 SL 3 ru PO o 00 OOOOOO ZZO O O 0 | 0 o o o —

Contextual Info: P—FBGA69—0912—0.80D3 Unit' nn Feb.2005

NAND FLASH BGA

Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
Contextual Info: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction

Contextual Info: P—FBGA69—091E—0.80B3 Uniti nn Jan,2004

Contextual Info: P—FBGA69—1209—0.80A3 Uniti m Apr.2001

kj 004

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Contextual Info: P—FBGA69—1E09—0.80B3 Uniti nn □ e t,2002

Contextual Info: P—FBGA69—0710—0.80AZ Uniti nn Jul.2003

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

Contextual Info: P—FBGA69—101E—0.80B3 Uniti nn Jan,2004