IDT7M7004 Search Results

7m7004s

Contextual Info: y §jl'v\ SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 32 CMOS EEPROM MODULE IDT7M7004 Integrated D ev ic e T ech n o lo g y , In c. DESCRIPTION: FEATURES: H igh-density 1 m eg ab it C M O S E E P R O M m odule M e m b e r of th e S u b s y s te m s " F le x i-P a k ” F a m ily of

Contextual Info: S ix SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 32 CMOS EEPROM MODULE dt) IDT7M7004 Integrated Device Technology, Inc. DESCRIPTION: FEATURES: T h e ID T 7 M 7 0 0 4 is a hig h -s p e e d , high-density 1 m eg ab it • H igh-density 1 m eg ab it C M O S E E P R O M

Contextual Info: SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 32 CMOS EEPROM MODULE IDT7M7004 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 1 megabit CMOS EEPROM module • M em ber of the Subsystem s "F le xi-P a k" Fam ily of interchangeable modules with equivalent pin-outs

CMOS EEPROM

Contextual Info: 1dt Integrated D n ic e Technology, Inc. SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K X 32 PRELIMINARY IDT7M7004 CMOS EEPROM MODULE FEATURES: DESCRIPTION: • High-density 1 megabit CMOS EEPROM modules • Mem ber of the Subsystem s “ Flexi-Pak” Family of

128k x 8 eeprom

Abstract: 64k x 8 64k x 8 sram
Contextual Info: GENERAL INFORMATION THE SUBSYSTEM'S “FLEXI-PAK ” CMOS MODULE FAMILY Integrated Device Technology, Inc. SRAM, EPROM, & EEPROM MODULES FEATURES: DESCRIPTION: • High-density modules using high-speed CMOS SRAM, EPROM, and EEPROM components. • Inter-changeable modules, with equivalent footprints,

Contextual Info: I N T E G R A T E » DE VI CE 3ÔE D • M Ö 2 S 7 7 1 O D G S I S M 1 ■ IDT THE SU B SY ST EM 'S “FLEXI-PAK ” CM O S MODULE FAMILY Integrated Device Technology, Inc. GENERAL INFORMATION SRAM, EPROM, & EEPROM MODULES \ Ol FEATURES: DESCRIPTION: • High-density modules using high-speed C M O S SRAM,