IDT7M7002 Search Results

128k x 8 eeprom

Abstract: 64k x 8 64k x 8 sram
Contextual Info: GENERAL INFORMATION THE SUBSYSTEM'S “FLEXI-PAK ” CMOS MODULE FAMILY Integrated Device Technology, Inc. SRAM, EPROM, & EEPROM MODULES FEATURES: DESCRIPTION: • High-density modules using high-speed CMOS SRAM, EPROM, and EEPROM components. • Inter-changeable modules, with equivalent footprints,

Contextual Info: I N T E G R A T E » DE VI CE 3ÔE D • M Ö 2 S 7 7 1 O D G S I S M 1 ■ IDT THE SU B SY ST EM 'S “FLEXI-PAK ” CM O S MODULE FAMILY Integrated Device Technology, Inc. GENERAL INFORMATION SRAM, EPROM, & EEPROM MODULES \ Ol FEATURES: DESCRIPTION: • High-density modules using high-speed C M O S SRAM,