Contextual Info: Diodes SMD Type 350mW Surface Mount Zener Diode MMBZ5242B SOT-23 Unit: mm +0.1 2.9-0.1 +0.1 0.4-0.1 Features 0.4 3 Ideally Suited for Automated Assembly Processes 1 0.55 General Purpose, Medium Current +0.1 1.3-0.1 +0.1 2.4-0.1 Planar Die Construction 2 +0.1
Contextual Info: Diodes SMD Type 200mW Surface Mount Zener Diode MMBZ5242BW Features Planar Die Construction General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Absolute Maximum Ratings Ta = 25 Parameter Forward Voltage Symbol Rating Unit VF 0.9
Contextual Info: Product specification MMBZ5242BW Features Planar Die Construction General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Absolute Maximum Ratings Ta = 25 Parameter Symbol Rating Unit VF 0.9 V Pd 200 mW 625 /W @ IF = 10mA Forward Voltage
Contextual Info: Product specification MMBZ5242B SOT-23 Unit: mm +0.1 2.9-0.1 +0.1 0.4-0.1 Features 0.4 3 Ideally Suited for Automated Assembly Processes 1 0.55 General Purpose, Medium Current +0.1 1.3-0.1 +0.1 2.4-0.1 Planar Die Construction 2 +0.1 0.95-0.1 +0.1 1.9-0.1 1.Base
Abstract: MMBZ52 MMBZ5227-V
Contextual Info: MMBZ5225-V to MMBZ5267-V www.vishay.com Vishay Semiconductors Small Signal Zener Diodes FEATURES • Silicon planar power Zener diodes 3 1 • Standard Zener voltage tolerance is ± 5 % with a “B” suffix e.g.: MMBZ5225B-V , suffix “C” is ± 2 % tolerance.
Abstract: MMBZ5221BS MMBZ5223BS MMBZ5225BS MMBZ5234BS-7 MMBZ5234BS-7-F MMBZ5259BS
Contextual Info: MMBZ5221BS - MMBZ5259BS200mW SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction Dual Isolated Zeners in Ultra-Small Surface Mount Package Ideally Suited for Automated Assembly Processes Also Available in Lead Free Version B C G H Mechanical Data
Abstract: xcm916x1cth16 transistor marking code 12W SOT-23 sg379 MC68B54P XC68HC805P18CDW mc68b50cp MC2830 NE555N CHN NE555N
Contextual Info: SG379/D REV 7 Semiconductor Products Sector NORTH AMERICA SALES AND DISTRIBUTION PRICE LIST THIS BOOK IS IN COMPUTER SORT PRODUCT CLASSIFICATION – Please see General Information Section 1.3 EFFECTIVE DATE: JANUARY 10, 1998 General Information 1 Cross References
