QFP12 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP128 package SOT320-3 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

AF200 microcontroller programmer

Abstract: SKwizard AF200 fujitsu STARTERkit mb90f MB90F520 minato 1890A J6 marking code MB90523 MB90570 QFP120
Contextual Info: QFP120 Flash-Test-Board Documentation  Fujitsu Mikroelektronik GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag, Germany Revision: Date: 3.0 20/07/1998 Documentation Flash Test Board Contents Hardware description of QFP120 Flash-Test-Board _ 3

Contextual Info: QFP120—P—2828—0.80B Uniti nn 32, 0±0, 4 28, 0±0, 2 90 61 91 □60 CU o•H O 120 A O•H O 31 mm rami •¡¡¡¡mi 30 2. 4TYP una 0, 35±0, 1 m o . i s m Jon.2007

MO-112

Abstract: QFP120
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP120: plastic quad flat package; 120 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT349-1 c y X A 61 90 ZE 60 91 e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X

QFP-128

Abstract: QFP128 sot320
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-2 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X

Contextual Info: QFP128-P-1420-0.50-K Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 1.19 TYP. 4 版/96.11.28

QFP128-P-2828-0

Abstract: QFP128 QFP-128 128P6
Contextual Info: 128P6-C Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D b2 ME 97 128 1 96 I2 Symbol HE E Recommended Mount Pad 65 32 33 64 A c A2 L1 y F b A1 e L Detail F A A1 A2 b c D E

PQFP128

Abstract: PQFP-128 P-QFP-128-1 ZD 103 QFP128 PRQP0128KB-A
Contextual Info: JEITA Package Code P-QFP128-14x20-0.50 RENESAS Code PRQP0128KB-A Previous Code FP-128B/FP-128BV MASS[Typ.] 1.7g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 102 65 103 64 HE b1 Reference Symbol

QFP128-P-2828-0

Contextual Info: QFP128-P-2828-0.80-DK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.95 TYP. 4/Nov. 28, 1996

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP120 package SOT349-2 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

FLASH-CAN2-100P-M06

Abstract: socket Yamaichi IC149 064 FPT-120P-M13 IC149-100-114-B5 IC149-100-KS11113-1 MB2132-457 QFP100 QFP120 100RB179
Contextual Info: Probe cables and sockets ELECTRONIC DEVICES EUROPE QFP120 package: FPT-120P-M13 MB2132-448 Probe cable old (Evaluation Board: Flash-EVA-120P-M13) Socket for emulator only, from Yamaichi TQPACK 120/144SD (it is not possible to mount a µC in this) MB2132-468 Probe cable (new) (Evaluation board: Flash-EVA2-120P-M13)

128P6

Abstract: QFP128 QFP128-P-2828-0
Contextual Info: 128P6-A Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D ME 97 b2 128 1 96 I2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 65 32 33 64 A c A2 L1 y F b

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

QFP120

Contextual Info: QFP120 LSI Assembly Units : mm • QFP120 90 31.2 28.0 61 60 31.2 28.0 91 120 31 1 H=3.5Max. The contents described herein are subject to change without notice. 30 Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any

sot349

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP120: plastic quad flat package; 120 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT349-2 c y X A 61 90 60 91 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X

QFP120

Abstract: QFP-120
Contextual Info: QFP120 LSI Assembly Units : mm • QFP120 31.2±0.3 28.0±0.2 61 91 60 120 31 1 0.8 28.0±0.2 30 0.15±0.1 0.1 3.3±0.1 31.2±0.3 90 0.8 0.35±0.1 ∗ The contents described herein are subject to change without notice. 0.15

Contextual Info: 120P6N-C Plastic 120pin 28✕28mm body QFP EIAJ Package Code QFP120-P-2828-0.80 Weight g 4.49 Lead Material Alloy 42 MD e JEDEC Code – HD 91 b2 120 ME D 1 90 I2 30 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 61 31 60 A c A2 L1 y b F

QFP128

Abstract: PA-QFE128SB-P-Z-03 QFP-128
Contextual Info: Top View Bottom View PCB only 1.733" 1.500" 2.488" 2.000" Side View 31.9mm sqr. -03W version (3 level, 0.025" Sqr. WW pin) 28.0mm sqr. 0.814" 1 0.187" 0.018" dia. typ. Description: Prototyping adaptor QFP128 position (0.8mm. pitch) ZIF socket to PGA male base pattern.

Contextual Info: QFP128-P-2828-0.80-BK Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ(≥5µm) 5.58 TYP. 3 版/96.11.28

sot349

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP120: plastic quad flat package; 120 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT349-1 c y X A 61 90 60 91 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X

QFP128-P-1420-0

Abstract: qfp128p
Contextual Info: QFP128-P-1420-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.19 TYP. 4/Nov. 28, 1996

AF200 microcontroller programmer

Abstract: SKwizard AF200 fujitsu STARTERkit mb90f FFA000 MB90523 MB90570 QFP120 Yokogawa MB90F570
Contextual Info: Documentation Flash Test Board QFP120 Flash-Test-Board Documentation  Fujitsu Mikroelektronik GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag, Germany Revision: Date: 3.2 30/07/1999 Page 1 Documentation Flash Test Board Warranty and Disclaimer To the maximum extent permitted by applicable law, Fujitsu Mikroelektronik GmbH restricts its

MO-112

Abstract: QFP128 INDEX33 sot320
Contextual Info: PDF: 2003 Feb 19 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; lead angle 60o SOT320-3 c y X A 96 65 97 64 ZE e A E HE A2 (A 3) A1 θ θ1 wM Lp bp L detail X pin 1 index 33

QFP128

Abstract: QFP128-P-2828-0
Contextual Info: QFP128-P-2828-0.80-DK Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.