QFP128 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP128 package SOT320-3 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

QFP-128

Abstract: QFP128 sot320
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-2 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X

Contextual Info: QFP128-P-1420-0.50-K Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 1.19 TYP. 4 版/96.11.28

QFP128-P-2828-0

Abstract: QFP128 QFP-128 128P6
Contextual Info: 128P6-C Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D b2 ME 97 128 1 96 I2 Symbol HE E Recommended Mount Pad 65 32 33 64 A c A2 L1 y F b A1 e L Detail F A A1 A2 b c D E

PQFP128

Abstract: PQFP-128 P-QFP-128-1 ZD 103 QFP128 PRQP0128KB-A
Contextual Info: JEITA Package Code P-QFP128-14x20-0.50 RENESAS Code PRQP0128KB-A Previous Code FP-128B/FP-128BV MASS[Typ.] 1.7g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 102 65 103 64 HE b1 Reference Symbol

QFP128-P-2828-0

Contextual Info: QFP128-P-2828-0.80-DK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.95 TYP. 4/Nov. 28, 1996

128P6

Abstract: QFP128 QFP128-P-2828-0
Contextual Info: 128P6-A Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D ME 97 b2 128 1 96 I2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 65 32 33 64 A c A2 L1 y F b

QFP128

Abstract: PA-QFE128SB-P-Z-03 QFP-128
Contextual Info: Top View Bottom View PCB only 1.733" 1.500" 2.488" 2.000" Side View 31.9mm sqr. -03W version (3 level, 0.025" Sqr. WW pin) 28.0mm sqr. 0.814" 1 0.187" 0.018" dia. typ. Description: Prototyping adaptor QFP128 position (0.8mm. pitch) ZIF socket to PGA male base pattern.

Contextual Info: QFP128-P-2828-0.80-BK Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ(≥5µm) 5.58 TYP. 3 版/96.11.28

QFP128-P-1420-0

Abstract: qfp128p
Contextual Info: QFP128-P-1420-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.19 TYP. 4/Nov. 28, 1996

MO-112

Abstract: QFP128 INDEX33 sot320
Contextual Info: PDF: 2003 Feb 19 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; lead angle 60o SOT320-3 c y X A 96 65 97 64 ZE e A E HE A2 (A 3) A1 θ θ1 wM Lp bp L detail X pin 1 index 33

QFP128

Abstract: QFP128-P-2828-0
Contextual Info: QFP128-P-2828-0.80-DK Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

QFP-128

Abstract: 331B-P 97 bp
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-1 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X

MS022

Abstract: QFP128 MS-022
Contextual Info: PDF: 2000 Jan 20 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-2 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X

QFP128

Abstract: MS-022
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-2 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X

QFP128

Abstract: QFP128-P-2828-0
Contextual Info: QFP128-P-2828-0.80-BK Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

QFP128

Abstract: QFP128-P-1420-0 qfp128p
Contextual Info: QFP128-P-1420-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

Contextual Info: QFP128-P-2828-0.80-DK Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 5.95 TYP. 4 版/96.11.28

sdc 603

Abstract: SDC-602 plcc 52 SOCKET sdc603 MX-500P-21 sdc 606 sdc606 STTC-136 132 qfp extraction tool METCAL SP200
Contextual Info: soldering desoldering & rework systems contents and preface Contents 1 Introducing the QX2 2 QX2 system elements and functions 3 QX2 system elements and functions 4 Part numbers for the QX2 5 The power of SmartHeat 6 The power of SmartHeat 7 MX rework systems

12 line ccd scanner

Abstract: toshiba 2400 dpi cis sensor nec CCD LINEAR IMAGE SENSOR flatbed scanner controller CCD LINEAR SENSOR 512 linear ccd ST L6219 application note block diagram of paper scanner CCD linear 10 ccd sony
Contextual Info: Ru.4 Xu062 f Genesys Logic, Inc. GL848 High Speed USB 2.0 2-in-1 Scanner Controller With Fast ADF & Bus Power Datasheet Revision 1.00 December 17, 2007 GL848 High Speed USB2.0 2-in-1 Scanner Controller With Fast ADF Copyright: Copyright 2006 Genesys Logic Incorporated. All rights reserved. No part of the materials may be

EASE63180

Abstract: ML63187 ML63189B ML63193 SASM63K AC power tool variable speed control circuit melody circuit
Contextual Info: ¡ ML63187/189B/193 User's Manual Please ignore data of ML63187 herein. The product is unavailable. FIRST EDITION ISSUE DATE: Mar. 2000 FEUL63193-01 E2Y0002-2X-13 NOTICE 1. The information contained herein can change without notice owing to product and/or

pj 69 SMD diode

Abstract: RX-2B RX2C RX2b bs3-1000 Monitor VD58 smd diode pj 72 c8051f320-gq VD58 ISL54100
Contextual Info: ISL54100AHDMI-EVALZ, ISL54105ACRZ-EVALZ Operation Manual for Intersil’s 4:1 and 1:1 TMDS HDMI Regenerator Evaluation Kits Application Note April 1, 2009 AN1453.2 Thank you for requesting Intersil’s high-performance TMDS signal multiplexor/regenerator/retimer evaluation kit. This

MSM6665-01

Abstract: MSM6665-01GS-K QFP128-1420 QFP128-P-1420-0 sp 1088 1803 dfh
Contextual Info: E2B0036-27-Y2 ¡ Semiconductor MSM6665-xx ¡ Semiconductor This version:MSM6665-xx Nov. 1997 Previous version: Mar. 1996 DOT MATRIX LCD CONTROLLER WITH 17-DOT COMMON DRIVER AND 80-DOT SEGMENT DRIVER GENERAL DESCRIPTION The MSM6665-xx is a dot-matrix LCD control driver which has functions of displaying characters, cursor and arbitrators.

MSM6665C-XX

Abstract: QFP128-1420 QFP128-P-1420-0 abb variable frequency drive wiring diagram
Contextual Info: E2B0037-27-Y2 O K I Semiconductor Previous version: Mar. 1996 MSM6665C-XX DOT MATRIX LCD CONTROLLER WITH 17-DOT COMMON DRIVER AND 8O-DOT SEGMENT DRIVER GENERAL DESCRIPTION The M SM 6665C-xx is a dot-matrix LCD control driver which has functions of displaying