TFBGA100 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA100 package SOT598-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: U n it nn Feb,2005

TFBGA100

Abstract: MO-216
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A2 A E A1 detail X C e1 e 1/2 e ∅v M C A B b y1 C y ∅w M C K J e H G F e2

Contextual Info: P-TFBGA100-1415-0.80AZ Unii:» nn Feb.2005

Contextual Info: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm D SOT777-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C K J H e G F e2 E 1/2 e D C B A ball A1 index area 1 2

Contextual Info: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls A B D SOT1329-1 ball A1 index area A E A2 A1 detail X e1 e C 1/2 e C A B C Øv Øw b y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 5 mm scale

Contextual Info: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls B D SOT1012-1 A ball A1 index area E A2 A A1 detail X e1 1/2 e e ∅v ∅w b M M C C A B C y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X

Contextual Info: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm B D SOT926-1 A ball A1 index area A2 E A A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2

Contextual Info: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y1 C ∅v M C A B b y ∅w M C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M y y1 C v M A K J e H G F e1 E D C B

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA100 package SOT777-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

TFBGA100

Abstract: MO-195 sot777
Contextual Info: PDF: 2002 Jun 21 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm D SOT777-1 A B ball A1 index area A A2 E A1 detail X C e1 e 1/2 ∅v M e b ∅w M y y1 C C A B C K J H e G F e2

MO-216

Abstract: TFBGA100 sot598
Contextual Info: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M y y1 C v M A K J e H G F e1 E D C B

lpc1769

Abstract: ARM LPC1769 instruction set LPC1768 bootloader lpc1768 gpio lpc1768fbd LPC236 LPC17XX LPC1766 NXP bootloader LPC1768 spi Crystal oscillator 12 MHz
Contextual Info: LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN Rev. 9 — 10 August 2012 Product data sheet 1. General description The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for

TFBGA180

Abstract: 12MHz oscillator LPC2364 LPC2368 LPC2458 LPC2468 TFBGA100 TFBGA208 Future Designs
Contextual Info: SAB-TFBGAxxx SAB-TFBGAxxx Socket Adapter Boards for USB-ICP-LPC2K The SAB-TFBGAxxx Socket Adapter Boards extend the capability of our popular USB In-Circuit Programmer for NXP Semiconductors LPC2xx devices to allow the user to program and test these devices outside of their

LPC1768 NXP bootloader

Abstract: LPC1769 fly wheel design detail for motor cycle LPC1768 LPC1768 ADC code example LPC1769FBD100 ARM LPC1769 instruction set ARM processor lpc1768 LPC17X LPC1767FBD100
Contextual Info: D D R R R R R D D D A A A A A FT FT FT FT FT D D R R A A FT FT FT FT A A R R D D LPC1769/68/67/66/65/64/63 D R R A FT R R R D D D F FT FT A A Product data sheet A Rev. 6.01 — 11 March 2011 D D FT FT A A R R D 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and

LPC9221

Abstract: embedded c code to interface lpc2148 with sensor P89V51RD2 microcontroller LPC2148 i2c with sensor LPC925 p89v51rd2 LPC700 LPC2148 p89v51rd2 development board lpc1754
Contextual Info: April 2009 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from

vic lpc2378

Abstract: lpc23xx LPC2378 LPC2378 uart LPC2388 16C550 LQFP100 LQFP144 TFBGA100 isp iap
Contextual Info: LPC23xx˖ ෎Ѣ ARM7TDMI-S ‫ݙ‬Ḍⱘ72MHzǃ32ԡ ᖂ᥻ࠊ఼㋏߫ ᏺ᳝ҹ໾㔥ǃUSB੠CAN໪䆒ⱘARM7 ᖂ᥻ࠊ఼ 䖭㉏ࡳ㛑ᔎ໻ǃ㒣⌢催ᬜⱘᖂ᥻ࠊ఼ϧЎ䖲᥹ᑨ⫼䆒䅵ˈᬃᣕ10/100ҹ໾㔥ǃܼ䗳 12 Mbps USB 2.0᥹ষ੠CAN 2.0B᥹ষDŽ‫ݙ‬㕂᳔໻512 KB ISP/IAP䮾ᄬǃ᳔໻98 KB SRAMǃϔϾ10-ԡA/Dǃ

tray lqfp

Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
Contextual Info: ARM-based Flash MCU SAM4S Series SUMMARY DATASHEET Description The Atmel SAM4S series is a member of a family of Flash microcontrollers based on the high-performance 32-bit ARM Cortex ® -M4 RISC processor. It operates at a maximum speed of 120 MHz and features up to 2048 Kbytes of Flash, with optional

LPC2148 i2c

Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
Contextual Info: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media  At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.

2704B

Contextual Info: Features • • • • • • • • • • Low Drop Out Voltage Regulator 4.5V Fixed Output Voltage 4.75V to 5.5V Supply Operation 30 mA Maximum Load Current Less Than 162 µA max Quiescent Current Power-down Mode Consumption Less Than 1 µA More Than 50 dB (Typical) PSRR at 1 kHz

RE025

Abstract: RE031 TFBGA100
Contextual Info: Features • • • • • • • • • • Low-noise Low Drop Out Voltage Regulator Programmable at 2.8V or 2.9V Output Voltages 3V to 5.5V Supply Operation 30 mA Maximum Load Current Power-down Mode Consumption Less Than 1 µA Macrocell for Integration into System-on-chip Products

0.35 um CMOS technology

Abstract: 2705B
Contextual Info: Features • • • • • • • • • • Dual Mode Low Drop Out Voltage Regulator 1.8V Fixed Output Voltage 3V to 5.5V Supply Operation 80 mA Maximum Load Current in Full Power Mode Maximum Current Consumption 36 µA in Full Power Mode and 14 µA in Low Power Mode

VFBGA100

Abstract: ATSAM4SD32BA-MU atsam4s-ek backup mode sam4s ATSAM4SD32CA QFN-64 ATSAM4* Series ATSAM4SD32C
Contextual Info: Atmel SAM4S Series Scalable Performance and Memory Density, Power Efficiency Based on the powerful ARM Cortex -M4 processor, the Atmel® SAM4S series extends the Atmel Cortex-M portfolio to offer: • Increased performance and power efficiency • Higher memory densities up to 2MB of Flash and 160KB of SRAM