TSSOP20 Search Results

TSSOP20

Abstract: TSSOP20J
Contextual Info: SANYO Semiconductor Thin Shrink Small Outline Package 20Pin Plastic TSSOP20J 225mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: Reliability Tests Report Product Name: TC74VHC273FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHCT573AFT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VCXR2245FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74LVX374FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHCV245FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC244FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VCX245FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74LVX244FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74ACT244FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHCV540FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74ACT540FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC541FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Package information - TSSOP20 Surface mounted, 20 pin package Package outline D E1 E L c A2 A b DIM A A1 A2 D E L e b c e A1 Millimeters Min Max 1.20 0.05 0.15 0.80 1.05 6.40 6.60 6.40 BSC 0.45 0.75 0.65 BSC 0.19 0.30 0.09 0.20 Inches Min Max 0.047 0.002 0.006

Contextual Info: Thin Shrink Small Outline Package 20pin TSSOP20 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 単位 : mm 4.0 ±0.1 Y X’ 6.9 ±0.1 7.5 ±0.1 Y φ1.6 ±0.1 X 0.3 ±0.05 16.0 ±0.3 8.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1

74HCXXX

Abstract: 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW
Contextual Info: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Cross reference guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm)

Contextual Info: Reliability Tests Report Product Name: TC74VHC573FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC245FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC240FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74LCX541FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74LCX574FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC9541FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHCV244FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHCV541FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s