TSSOP48 Search Results

Contextual Info: Reliability Tests Report Product Name: TC74LCX164245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74LCX16244FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT

74HCXXX

Abstract: 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW
Contextual Info: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Cross reference guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm)

TSSOP48

Abstract: TSSOP48 outline JEDEC MO-153 jedec MO-153 48-led
Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

TSSOP48

Contextual Info: TSSOP48 Adapter thin shrink small outline package RE933-09 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 48 - hole dia 1.00 mm - size 27.00 x 34.50 mm

Contextual Info: Reliability Tests Report Product Name: TC74LCXR164245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A2 A 3 A1 pin 1 index A θ Lp L detail X 1 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Reliability Tests Report Product Name: TC74VCXR162245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

sot362

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

TSSOP48

Abstract: SOT480-1
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5

TSSOP48

Abstract: TSSOP48 outline
Contextual Info: 48-Pin Thin Shrink Small Outline Package Embossed EL Tape for the TSSOP48 Package Tape Dimensions Unit: mm 4.0 ±0.1 Y 11.5 ±0.1 X’ 13.1 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1 2.0 ±0.1 Y’ Y’ 8.6 ±0.1 X 1.65 ±0.1

TSSOP48

Abstract: TSSOP48 outline TSSOP-48
Contextual Info: Thin Shrink Small Outline Package 48pin TSSOP48 パッケージ 外形図 パッケージ形状および寸法 単位 : mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 25 6.1 ±0.1 48 0 ～10゜ 0.5 1 0.5 typ. 24 0.5 0.2 +0.07 –0.06 0.45 ～ 0.75 0.1 M 12.8 max

TSSOP48

Abstract: TSSOP48 outline
Contextual Info: 48-Pin Thin Shrink Small Outline Package TSSOP48 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 25 6.1 ±0.1 48 0 ～10゜ 0.5 1 0.5 typ. 24 0.5 0.2 +0.07 –0.06 0.45 ～ 0.75 0.1 M 12.8 max 0.1 ±0.05 1.0 ±0.05

TSSOP48

Contextual Info: PDF: 2003 Apr 14 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

sot480

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5

TSSOP48

Abstract: TSSOP64 SPDT SPI STP08CL596M TSSOP24 5V SPST RELAY 74V1G66CTR 74V1G66STR 74V1T384CTR 74V1T384STR
Contextual Info: Surface mounting packages Advanced Logic ICs SOT23-8L SOT23-5L SOT323-5L Selection guide TSSOP16 TSSOP20 LFBGA96 TSSOP24 TFBGA54 SO-16 SO-20 TSSOP24 exposed-pad TSSOP48 µTFBGA42 QFN16 SO-24 TSSOP64 Flip-Chip5 SSOP24 Flip-Chip11 H (inch) W (tape width mm)

TSSOP48

Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5

TSSOP48

Abstract: TSSOP48 outline TSSOP-48
Contextual Info: Thin Shrink Small Outline Package 48pin TSSOP48 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 単位 : mm 4.0 ±0.1 Y 11.5 ±0.1 X’ 13.1 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0

Contextual Info: TS SO P4 8 SOT362-1 TSSOP48; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 5 — 15 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

Contextual Info: Reliability Tests Report Product Name: TC74VCX16245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74LCX16245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

4001 4011 cmos

Abstract: 4049 DIP14 4013 datasheet hct lcx 574 CMOS 4541 str 4512 C3245 4017 14 pin package CMOS4000 hcf 4541 be
Contextual Info: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Selection guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm) SO-8, TFBGA42

Contextual Info: TOSHIBA TC74VCX16373FT TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC74VCX16373FT LOW-VOLTAGE 16-BIT D-TYPE LATCH WITH 3.6V TOLERANT INPUTS AND OUTPUTS The TC74VCX16373FT is a high performance CMOS 16-bit D-TYPE LATCH. Designed for use in 1.8, 2.5 or 3.3 Volt