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    WTS001 Price and Stock

    OMRON Industrial Automation CP1W-TS001

    INPUT MODULE 2 ANALOG
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CP1W-TS001 Box 1 1
    • 1 $652.78
    • 10 $504.167
    • 100 $504.167
    • 1000 $504.167
    • 10000 $504.167
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    Newark CP1W-TS001 Bulk 9 1
    • 1 $718.39
    • 10 $646.56
    • 100 $589.84
    • 1000 $589.84
    • 10000 $589.84
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    OMRON Corporation CP1W-TS001

    2 PT J,K THERMOCOUPLE EXPANSIO - Bulk (Alt: CP1WTS001)
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    Avnet Americas CP1W-TS001 Bulk 1
    • 1 -
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    Mouser Electronics CP1W-TS001 2
    • 1 $552.97
    • 10 $504.16
    • 100 $504.16
    • 1000 $504.16
    • 10000 $504.16
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    TME CP1W-TS001 1
    • 1 $461.74
    • 10 $461.74
    • 100 $461.74
    • 1000 $461.74
    • 10000 $461.74
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    OMRON Industrial Automation CP1W-TS001 (ALTERNATE: CP1WTS001)

    PLC Expansion Module Input 2 Input, 24 V dc 90 x 86 x 50 mm | Omron Automation CP1W-TS001
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS CP1W-TS001 (ALTERNATE: CP1WTS001) Bulk 1 1
    • 1 $659.31
    • 10 $613.16
    • 100 $593.38
    • 1000 $593.38
    • 10000 $593.38
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    OMRON Industrial Automation CP1WTS001

    Expansion I/O Units Of Comprehensive Programmable Controller
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Master Electronics CP1WTS001 4
    • 1 $479.55
    • 10 $441.01
    • 100 $441.01
    • 1000 $441.01
    • 10000 $441.01
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    OMRON Americas CP1W-TS001

    Controller Accessories 2 Pt J K Thermocoupl e Expansio
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Sager CP1W-TS001
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    WTS001 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ebonol

    Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
    Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF WTS001 p1-25 O-220, OT-223, SOL-20 ebonol 637-10ABEP MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions

    Untitled

    Abstract: No abstract text available
    Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF WTS001 p1-25 O-220, OT-223, SOL-20

    Untitled

    Abstract: No abstract text available
    Text: WTS001_p26-49 6/14/07 10:56 AM Page 45 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621/623 SERIES Footprint Dimensions in. mm Height in. (mm) Mounting Hole Pattern 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 3.000 (76.2)


    Original     		PDF WTS001 p26-49 392-120AB 392-120AG 392-180AB 392-180AG 392-300AB 392-300AG

    deltabond

    Abstract: Wakefield 120-320 152-1B thermal conductivity 175-6-220-P
    Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of


    Original     		PDF WTS001 p50-68 173-7-220P 173-7-230P 173-7-240P 173-7-1212P 73-7-240A 173-9-210P 173-9-230P 173-9-240P deltabond Wakefield 120-320 152-1B thermal conductivity 175-6-220-P

    Untitled

    Abstract: No abstract text available
    Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of


    Original     		PDF WTS001 p50-68 175-6-210P 173-9-210P 173-7-220P 175-6-220P 173-7-230P 173-9-230P 175-6-230P 173-7-240P

    T405R

    Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
    Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink


    Original     		PDF WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG T405R Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412