A7547 Search Results

Contextual Info: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold

Contextual Info: Low Profile SIP Sockets E L E C T R O N I C S fflOK McKenzie Socket Division Features LOWEST PROFILE OPTIONS ULTRA LOW PROFILE OPTIONS • Profiles as low as .016" 0 ,4 1 ab ove P C B • X and Y stackable • Single and Dual R ow available Specify Contact/Shell

McKenzie socket division

Contextual Info: ZIP Sockets E L E C T R O N I C S MK McKenzie Socket Division Features LOW PROFILE • For high density m em ory using vertical •lOO (4,19 J TYP. zig -zag in-line patterns _L n r X .125 T (3,17) -.020 (0,51) TYP. Specify Contact/Shell 001B • Available in 16, 18, 2 0 , 2 4 , and 2 8 positions

MA75451

Abstract: MA75452 A75452 TA75450 a7547 MA75450 JUA75450 MA75461 MA75461TC ma75472
Contextual Info: F A I R C H juA75450/60/70 Series Dual Peripheral Drivers I L D A Schlum berger Com pany .¡near Division Interface Products The juA75400 series offers flexibility in designing high speed logic buffers, power drivers, lamp drivers, line driv­ ers, MOS drivers, clock drivers, and m em ory drivers.

Contextual Info: Elevated SIP Sockets ELECTRONICS mac M cKenzie S ocket D ivisio n Features • Elevated Sockets allow for greater package density • Allows stacking of PCB • Maximizes airfow • Available in Hi-Temp P P S Insulator material STANDARD TEMPERATURE — UL 94V-0 THERMOPLASTIC

Contextual Info: fUKC M cKenzie Socket Division — r .585 ' 14,86 •250 V (6,35) G .180 .018— (0,46) (4.57) TYP Specify Specify Plating/Material Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10p" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003

McKenzie socket division

Contextual Info: Specialty DIP Sockets ELECTRONICS MK McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environm ents • Designed to fit M cKenzie Technology's standard open or closed fram e DIP sockets DIP INSULATOR CENTERS THICKNESS

McKenzie socket division

Contextual Info: fflSX McKenzie Socket Division Insulator Options 3 LEVEL W IRE W RAP 2 LEVEL W IRE W RAP OPEN FRAME Standard Insertion Force Standard Insertion Force Specify Contact/Shell 400B 30p" Gold/200 j" Tin Specify Contact/Shell 41 OB 30p" Gold/200|j" Tin 30p" Gold/10p" Gold

ASP-105884-01

Abstract: 13002 hj B1 PA66-GF13 5mm ldr ASP-105885-01 mj 13003 IRF 3055 DIN 16901 130 plastic PCI x1 express PCB dimensions artwork Training TV repair
Contextual Info: CONTENTS Board-to-Board Applications Fin al Inch P C B D esign T o o ls . 10-11 High S p eed Board-to-Board S y s te m s .12-27 M icro Pitch Board-to-Board S y s t e m s .28-37

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UA317

Abstract: Fairchild dtl catalog free transistor equivalent book 2sc lm741 MA339PC MA725HM MA7805KM UA759 gi 9640 diod MA4136PC
Contextual Info: $9.9! •— r c m m pq, F A IR C H IL D A S chlum berger C om pany Linear Data Book Linear Division Introduction The Linear Data Book includes the standard linear product line plus our new W inchester Disk Drive circuits and CLASIC standard cells. For ease o f reference linear

Contextual Info: Mal@4 -MaSe DIP Headers E L E C T R O N I C S fflex M cKenzie Socket Division Insulator Options Low Profile Options ,. 020- .050 1.27 I I T (0 .51 ) _ L .335 ,.085, I (2.]6) 1 (8,51) TYP I I £ 1 .104 (2,64) I-.070 (1,78) .299 (7.60) r TTT25 (3.18) .020 '