ANTIMONY TRIOXIDE EPOXY MOLDING Search Results

antimony trioxide epoxy molding

Abstract: material declaration semiconductor package Material declaration organic materials oxygen material declaration amd 104 c1k
Contextual Info: ‹ Chapter 4 Package Materials Material Declaration Data Sheets. AMD has created material data sheets for some of its more popular package designs. These data sheets are organized as follows: • Suface-Mount Array Packages Š PBGA, page 6-19 • Surface-Mount Leaded Packages

D2863-70

Contextual Info: Product Safety Information Sheet This should be read in conjunction with the Product Data Sheet. Failure to observe the ratings and the information on this sheet may result in a safety hazard. 1. Material Content Solid tantalum capacitors do not contain liquid hazardous

AVX taa

Abstract: avx taj D2863-70 AVX tantalum MSL
Contextual Info: Product Safety Information Datasheet Material Data and Handling This should be read in conjunction with the Product Datasheet. Failure to observe the ratings and the information on this sheet may result in a safety hazard. 1. Material Content Solid Tantalum and OxiCap capacitors do not contain

AVX tantalum MSL

Abstract: avx taj AVX taa D2863-70
Contextual Info: Product Safety Information Datasheet Material Data and Handling This should be read in conjunction with the Product Datasheet. Failure to observe the ratings and the information on this sheet may result in a safety hazard. 1. Material Content Solid Tantalum and OxiCap capacitors do not contain

antimony trioxide epoxy molding

Abstract: avx capacitors
Contextual Info: Product Safety Information Sheet Material Data and Handling This should be read in conjunction with the Product Data Sheet. Failure to observe the ratings and the information on this sheet may result in a safety hazard. 1. Material Content Solid tantalum capacitors do not contain liquid hazardous

D2863-70

Abstract: AVX Tantalum AND Niobium OXIDE DIODES
Contextual Info: Product Safety Information Datasheet Material Data and Handling This should be read in conjunction with the Product Datasheet. Failure to observe the ratings and the information on this sheet may result in a safety hazard. 1. Material Content Solid Tantalum and OxiCap capacitors do not contain

CD0603

Contextual Info: MATERIAL DECLARATION SHEET Material Number CD0603 Series Product Line Diode Products Compliance Date 1 Jan 2005 RoHS Compliant Yes No. 1 2 3 4 5 Construction Element subpart FR-5 BOARD Wafer Al Wire Silver paste Molding Compound Headquarters Riverside CA

CD1005

Abstract: material declaration sheet Diode PT 520 diode 1436
Contextual Info: MATERIAL DECLARATION SHEET Material Number CD1005 Series Product Line Diode Products Compliance Date 1 Jan 2005 RoHS Compliant Yes No. 1 2 3 4 5 Construction Element subpart FR-5 BOARD Wafer Al Wire Silver paste Molding Compound Headquarters Riverside CA

silver epoxy

Contextual Info: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the life span of their products comes to an end by scrutinizing the materials incorporated and their

Si3N4

Abstract: antimony trioxide epoxy molding TELEFUNKEN catalog
Contextual Info: Vishay Telefunken The Constituents of Semiconductor Components Document Number 82601 05.01 www.vishay.com 1 Vishay Telefunken Table of Contents The Constituents of Semiconductor Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

cd photo diode

Abstract: class H epoxy resin gold detector IC material composition of chip capacitors ic 555 use with metal detector epoxy resin lead frame resin compound copper bond wire CNY64
Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future

Contextual Info: SOT23 Diodes Material Content Declaration Material name Substance name e.g. Copper Cu , Gold (Au) Lead Frame Copper (Cu) 30.94% CAS no., if known Iron (Fe) 7439-89-6 Cobalt (Co) 7440-48-4 Silver (Ag) 7440-22-4 7440-02-0 Total 7440-21-3 Gold (Au) 7440-57-5

Titanium dioxide

Abstract: carbon ink
Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR263020XXX Product Line Power Resistor Compliance Date RoHS Compliant No. 1 2 3 4 5 yes Construction Element subpart Housing Back Plate Terminal Solder Substrate Headquarters Riverside CA MSL Homogeneous Material

80110

Abstract: TCST1000 CNY70 TCPT1200 TCST1030 TCST1210 TCST1230 TCST5123 TCST5250 TCUT1200
Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future

40039

Abstract: SOD-523 DO-219AB Germanium DO-35 DIODE 89901 cd 4553 material declaration vishay asbestos DO-219AB germanium diode SOD323
Contextual Info: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their

material declaration semiconductor package

Abstract: asbestos safety material declaration vishay 89901 DO-219AB 58018
Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their

Contextual Info: Product Safety Information Datasheet Material Data and Handling This should be read in conjunction with the Product Datasheet. Failure to observe the ratings and the information on this sheet may result in a safety hazard. 1. Material Content Solid Tantalum and OxiCap capacitors do not contain

material declaration vishay

Abstract: asbestos safety TbA 8220 m CAS No. 28064-14-4 DO-214 diode 84084 material declaration semiconductor package sot-363 Package material 28064-14-4 40039
Contextual Info: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their

Contextual Info: RF2436 RF2436Transmit/Receive Switch TRANSMIT/RECEIVE SWITCH Package Style: SOT-5 Features      Single Positive Power Supply Low Current Consumption 1dB Insertion Loss at 900MHz 24dB Crosstalk Isolation at 900MHz +27dBm Output P1dB RX OUT 1

HALON 2402

Abstract: HSOP-30 CFC-217 CFC2-15
Contextual Info: Product Chemical Content Brochure BRD8022/D Rev. 1, Feb–2002  SCILLC, 2002 Previous Edition  2001 “All Rights Reserved” Introduction Dear Customer: ON Semiconductor is proud to introduce its first Product Chemical Content brochure for its products. This information

Ta2O5 phase diagram

Abstract: EIA-535 Ta2O5
Contextual Info: TBJ Series Including CWR11 and COTS-Plus The TBJ Series encompasses five case sizes, A through E, corresponding to EIA535BAAC, the commercial industry standard. This series also offers molded body/compliant termination construction, polarity and capacitance marking. The

Contextual Info: NBB-312 Cascadable Broadband GaAs MMIC Amplifier DC to 12GHz Package: MPGA, Bowtie, 3 x 3, Ceramic Features      Pin 1 Indicator Reliable, Low-Cost HBT Design 12.5dB Gain High P1dB of +15.8dBm at 6GHz Single Power Supply Operation 50 I/O Matched for High

rfmd mmic

Contextual Info: NBB-312 CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz Package: MPGA, Bowtie, 3 x 3, Ceramic Features      Pin 1 Indicator Reliable, Low-Cost HBT Design 12.5dB Gain High P1dB of +15.8dBm at 6GHz Single Power Supply Operation 50 I/O Matched for High

CFC-211

Contextual Info: Product Chemical Content Brochure BRD8022/D Rev. 2, Jun–2002  SCILLC, 2002 Previous Edition  2002 “All Rights Reserved” http://onsemi.com Introduction Dear Customer: ON Semiconductor is proud to introduce its first Product Chemical Content brochure for its products. This information