99043
Abstract: bga 388 140C JESD22 ASE BGA
Text: Cypress Semiconductor Qualification Report QTP# 99043 VERSION 1.0 May, 1999 388 Ld BGA Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor Assembly: ASE, Taiwan
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388Ld
30C/60
CY37512P352-BG
99043
bga 388
140C
JESD22
ASE BGA
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130C
Abstract: JESD22 Ablebond 8355
Text: Cypress Semiconductor Qualification Report QTP# 98193 VERSION 1.0 December, 1998 292-Pin BGA Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor Assembly: ASE, Taiwan
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292-Pin
30C/60
CY37256P256-BGC
7C37652AF-GBGC
130C
JESD22
Ablebond 8355
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99045
Abstract: CY37512P208-NC JESD22 ASE Cypress copper bond wire
Text: Cypress Semiconductor Qualification Report QTP# 99045 VERSION 1.0 September, 1999 208 Lead PQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7068 Cypress Semiconductor Assembly: ASE Taiwan Package: 208 Lead PQFP
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30C/60
CY37512P208-NC
150C/-55C
99045
CY37512P208-NC
JESD22
ASE Cypress
copper bond wire
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cel-9200
Abstract: 140C 8361H A112-A CEL9200 JESD22
Text: Cypress Semiconductor Qualification Report QTP# 97302 VERSION 1.0 October, 1997 100 Pins TQFP Package 14x20x1.4mm ASE, Taiwan Assembly Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP QTP# 97302, V. 1.0 Page 2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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14x20x1
CEL9200
8361H
JESD22-A112
CY7C1329-AC
619703196LA
619703196LB
cel-9200
140C
8361H
A112-A
CEL9200
JESD22
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CY7C1048-SC
Abstract: 140C 8361H CEL9200 JESD22 cel-9200
Text: Cypress Semiconductor Qualification Report QTP# 97184 VERSION 1.0 August, 1997 32 Ld, 450-mil SOIC Package ASE - Taiwan Assembly Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOIC QTP# 97184, V. 1.0 Page 2 of 4 August, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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450-mil
CEL9200
8361H
JESD22-A112
30C/60
CY7C1048-SC
CY7C1048-SC
140C
8361H
CEL9200
JESD22
cel-9200
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SUMITOMO EME6600
Abstract: EME6600 Compound 6600cs 3818 MIL-STD-883c-method 1010 6600CS
Text: Cypress Semiconductor Package Qualification Report QTP# 99234 VERSION 1.1 September 2000 52-208-pin Plastic Quad Flatpack Package PQFP Sumitomo 6600CS molding Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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52-208-pin
6600CS
52-208-Lead
N52D/N208L
52/208-pin
CY82C693-NC
619909669B
SUMITOMO EME6600
EME6600
Compound 6600cs
3818
MIL-STD-883c-method 1010
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MP-8000
Abstract: Nitto MP 8000 cel-9200u mp8000 140C JESD22 8361A
Text: Cypress Semiconductor Qualification Report QTP# 97255 VERSION 1.0 October, 1997 Backgrind Wafer Elimination up to 29 mils for 32 lds, 300 mils SOJ package Cypress Semiconductor Backgrind Wafer Elimination Package: SOJ/ Assembly: Cypress Bangkok/ASE Taiwan
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32-pins,
300-mils
Sumitomo-7351
MP-8000
CEL-9200U
CY7C199-VC
30C/60
CY7C1009-VC
MP-8000
Nitto MP 8000
cel-9200u
mp8000
140C
JESD22
8361A
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EME 7320
Abstract: Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
Text: Cypress Semiconductor Mold Compound Qualification Report QTP# 002403 VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound, MSL3 for DCD-Thin Quad Flat Pack, TQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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160-lead
CY7C375I-AC
EME 7320
Ablestik
Ablestik 8361
7320
a144g
SUMITOMO EME G
A100A
CY7C09579V-AC
JESD22
ASE Cypress
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8355F
Abstract: CY7C37128 JESD22 plaskon
Text: Cypress Semiconductor Package Qualification Report QTP# 000473 VERSION 1.0 April, 2000 100/256 Lead Fine Pitch Ball Grid Array FBGA ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Cypress Semiconductor
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CY37256VP256-BB
JEDDEC22
CY7C37128VP100-
619937560L
619937561L
8355F
CY7C37128
JESD22
plaskon
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sumitomo epoxy
Abstract: EME 7320 7320 8361H CY7C375-AC JESD22
Text: Cypress Semiconductor Package Qualification Report QTP# 000303 VERSION 1.1 March, 2000 Up to160 Lead Thin Quad Flat Pack Sumitomo EME 7320 Mold Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069
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to160
CY7C375-AC
sumitomo epoxy
EME 7320
7320
8361H
CY7C375-AC
JESD22
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8355F
Abstract: 130C JESD22
Text: Cypress Semiconductor Package Qualification Report QTP# 99331 VERSION 2.0 December, 2000 48 Lead Fine Pitch Ball Grid Array FBGA 7mm x 8.5mm ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Kim-Ngan Nguyen
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BA48G
48-ball
O925255
CY62146VLL-BAIB
150C/-55)
8355F
130C
JESD22
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8361H
Abstract: EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344
Text: Cypress Semiconductor Reflow Qualification Report QTP# 99344 VERSION 2.0 November, 2000 235°°C Solder Reflow Profile TSOP Package Family All assembly sites for these packages CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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ZS444N
44-lead
619919886Q
CY7C199-ZC
30C/60
CY7C1021-ZSC
CY62128-ZC
8361H
EME-7351
Ablestik
JESD22
hitachi mold cel
copper bond wire
tsop package
99344
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ASE BGA
Abstract: tsmc mos 45 7C37655B CY37256
Text: Cypress Semiconductor Product Qualification Report QTP# 99457 Revision 1.3 September 2000 High-Performance CPLDs Family CY37192P CY37192VP UltraLogic 192 Macrocell ISR™ CPLDs CY37256P CY37256VP UltraLogic™ 256 Macrocell ISR™ CPLDs CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
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CY37192P
CY37192VP
CY37256P
CY37256VP
CY37192
/CY37256*
CY37256P160-AC
ASE BGA
tsmc mos 45
7C37655B
CY37256
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CY37512VP208-UMB
Abstract: diagram PRESSURE cooker tsmc mos 45 CY37512 CY37384
Text: Cypress Semiconductor Product Qualification Report QTP# 000605 VERSION 1.0 September, 2000 High-Performance CPLDs Family CY37384P208/ CY37384VP208 UltraLogic 384-Macrocell ISR™ CPLDs CY37512P208/ CY37512VP208 UltraLogic™ 512-Macrocell ISR™ CPLDs CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
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CY37384P208/
CY37384VP208
384-Macrocell
CY37512P208/
CY37512VP208
512-Macrocell
CY37384
/CY37512*
CY37256P160-AC
CY37512VP208-UMB
diagram PRESSURE cooker
tsmc mos 45
CY37512
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CY7C954DX
Abstract: CY7C924DX CY7C924DX-AC CY7C9689 cypress part marking
Text: Cypress Semiconductor Qualification Report QTP# 99041 VERSION 1.0 November, 1999 HOTLINK DX FAMILY CY7C924DX 200 Mbaud HOTLink Transmitter CY7C954DX UTOPIA HOTLink™ Transceiver CY7C9689 TAXI™ Compatible HOTLink™ Transceiver HOTLink is a trademark of Cypress Semiconductor, Inc.
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CY7C924DX
CY7C954DX
CY7C9689
R42LHDHA,
CY7C924DX/954DX/9689
100-pin
CY7C924DX
CY7C954DX
30C/60
CY7C924DX-AC
CY7C924DX-AC
CY7C9689
cypress part marking
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MP7100
Abstract: 84-1MISR4 JESD22
Text: Cypress Semiconductor Qualification Report QTP# 97114, VERSION 1.0 August, 1997 Peripheral Controller with USB Support CY82C693U in 208 Pins PQFP Cypress Semiconductor Peripheral Controller with USB Support Devices:CY82693U Package: 208 pins PQFP QTP# 97114/97135, V1.0
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CY82C693U
CY82693U
208-pin
RE93U-NC
CY82C693U-NC
MP7100
84-1MISR4
JESD22
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Untitled
Abstract: No abstract text available
Text: Cypress Semiconductor Product Qualification Report QTP# 99256 VERSION 1.0 September, 2000 Robo Clock II High-Speed Multi-Phase PLL Buffer Clock B53D-3 Technology, Fab 1 CY7B993V CY7B994V 12 – 100 MHZ Output Frequency operation 24 – 185 MHZ Output Frequency operation
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B53D-3
CY7B993V
CY7B994V
CY7B993/CY7B994
N1942384
CY7B994V-AC
30C/60%
CY7B993V-AC
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TSOP Type II
Abstract: 9749 cel 9200 140C 8361H JESD22 Cypress 44LD
Text: Cypress Semiconductor Qualification Report QTP# 97491, Version 1.0 March, 1998 44 Ld TSOP Type II OSE, Taiwan Assembly Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type II QTP# 97491, V. 1.0 2 of 4 March, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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8361H
JESD22-A112
CY7C1021-ZSC
619708844L
619708845L
TSOP Type II
9749
cel 9200
140C
8361H
JESD22
Cypress
44LD
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CY7C1512
Abstract: JESD22 7C1512 MIL-STD-883 Method 3015.7
Text: Qualification Report December 1996, QTP# 96227, Version 1.1 CY7C1512 64K x 8 Static RAM PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:
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CY7C1512
32-pin,
450-mil
7C1512A
CY7C1512-SC
85C/85
CY7C1512
JESD22
7C1512
MIL-STD-883 Method 3015.7
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CY82C691
Abstract: CY82C691-NC 110C 130C 140C 95441
Text: Qualification Report September 1996, QTP# 95431, Version 1.0 PentiumTM hyperCacheTM Chipset System Controller CY82C691, 208-Pin Plastic Quad Flatpack Pentium is a trademark of Intel Corporation hyperCache is a trademark of Cypress Semiconductor Corporation
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CY82C691,
208-Pin
CY82691
208-Pins
CY82C691-NC
CY82C691
CY82C691-NC
110C
130C
140C
95441
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MP7100
Abstract: 82c693 140C CY82C693 CY82C693-NC
Text: Qualification Report September 1996, QTP# 95432, Version 1.0 PentiumTM hyperCacheTM Chipset Peripheral Controller CY82C693, 208-Pin Plastic Quad Flatpack Pentium is a trademark of Intel Corporation hyperCache is a trademark of Cypress Semiconductor Corporation
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CY82C693,
208-Pin
CY82693
208-Pins
CY82C693-NC
MP7100
82c693
140C
CY82C693
CY82C693-NC
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CY7C1021V33
Abstract: A194 JESD22
Text: Cypress Semiconductor Qualification Report QTP# 97099 VERSION 1.0 September, 1997 64K x 16 Asynchronous Static RAM, 3.3V Operation CY7C1021V33 Cypress Semiconductor 64K x 16 Static RAM, 3.3V Operation Device:CY7C1021V33 Package: 44-pin, 400-mil SOJ QTP# 97099, V. 1.0
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CY7C1021V33
44-pin,
400-mil
CY7C1021V33-VC
619703242L1A
CY7C1021V33
A194
JESD22
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circuit diagram laptop motherboard
Abstract: No abstract text available
Text: CYPRESS Features • • Six clock ou tp u ts h an d le a ll clocking requirem ents for p erson al com puter m otherboards Ph ase-locked loop o scillator input derived from sin gle 14.31818 MHz crystal ICD2027 PC Motherboard Clock Generator • S oph isticated in ternal loop-filter
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OCR Scan
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PDF
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ICD2027
20-pin
circuit diagram laptop motherboard
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C-484
Abstract: 100A484 DA11 E484 CI 4096
Text: _ 2tE D • aSfilbba D D G M M ñ G 4 CY1E484 CY10E484 CY100E484 CYPRESS SEMICONDUCTOR 5£v ADVANCED INFORMATION :.M^ s x = s r W M cyp ress 'T^-Zb-O Z SEMICONDUCTOR 4096 x 4 ECL Static RAM • O pen e m itte r o u tp u t fo r e ase of m em o ry exp an sio n
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00G44Ã
CY1E484
CY10E484
CY100E484
10KH/10K
CY1E484,
CY100E484
1E484
C484-2
C-484
100A484
DA11
E484
CI 4096
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