BA1 K11
Abstract: ba1d1a PD48576118FF-E24-DW1-A
Text: Preliminary Datasheet PD48576109-A μPD48576118-A R10DS0064EJ0001 Rev.0.01 Nov 08, 2010 576M- Low Latency DRAM Separate I/O Description The μPD48576109-A is a 67,108,864-word by 9 bit and the μPD48576118-A is a 33,554,432 word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48576109-A
PD48576118-A
R10DS0064EJ0001
PD48576109-A
864-word
PD48576118-A
BA1 K11
ba1d1a
PD48576118FF-E24-DW1-A
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PD48576109,
Abstract: No abstract text available
Text: Datasheet PD48576109 μPD48576118 R10DS0064EJ0100 Rev.1.00 September 27, 2011 576M-BIT Low Latency DRAM Separate I/O Description The μPD48576109 is a 67,108,864-word by 9 bit and the μPD48576118 is a 33,554,432 word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48576109
PD48576118
576M-BIT
864-word
PD48576118
R10DS0064EJ0100
PD48576109,
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Untitled
Abstract: No abstract text available
Text: Datasheet PD48576109 μPD48576118 R10DS0064EJ0200 Rev.2.00 May 10, 2012 576M-BIT Low Latency DRAM Separate I/O Description The μPD48576109 is a 67,108,864-word by 9 bit and the μPD48576118 is a 33,554,432 word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48576109
PD48576118
576M-BIT
864-word
PD48576118
R10DS0064EJ0200
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Untitled
Abstract: No abstract text available
Text: Preliminary Datasheet PD48288109A μPD48288118A R10DS0098EJ0001 Rev.0.01 August 2, 2011 288M-BIT Low Latency DRAM Separate I/O Description The μPD48288109A is a 33,554,432-word by 9 bit and the μPD48288118A is a 16,777,216-word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48288109A
PD48288118A
R10DS0098EJ0001
288M-BIT
PD48288109A
432-word
PD48288118A
216-word
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Untitled
Abstract: No abstract text available
Text: Datasheet PD48288109A μPD48288118A R10DS0098EJ0100 Rev.1.00 February 28, 2012 288M-BIT Low Latency DRAM Separate I/O Description The μPD48288109A is a 33,554,432-word by 9 bit and the μPD48288118A is a 16,777,216-word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48288109A
PD48288118A
288M-BIT
432-word
PD48288118A
216-word
R10DS0098EJ0100
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Untitled
Abstract: No abstract text available
Text: Datasheet PD48288118-A 288M-BIT Low Latency DRAM Separate I/O R10DS0157EJ0100 Rev.1.00 Feb 01, 2013 Description The μPD48288118-A is a 16,777,216 word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48288118-A
288M-BIT
R10DS0157EJ0100
PD48288118-A
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Untitled
Abstract: No abstract text available
Text: DATA SHEET MOS INTEGRATED CIRCUIT PD48288118 288M-BIT Low Latency DRAM Separate I/O Description The μPD48288118 is a 16,777,216 word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48288118
288M-BIT
PD48288118
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p144f
Abstract: TDK EF25 BAP36 PD482
Text: DATA SHEET MOS INTEGRATED CIRCUIT PD48288118-A 288M-BIT Low Latency DRAM Separate I/O Description The μPD48288118-A is a 16,777,216 word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48288118-A
288M-BIT
PD48288118-A
M8E0904E
p144f
TDK EF25
BAP36
PD482
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Untitled
Abstract: No abstract text available
Text: Datasheet PD48288109A μPD48288118A R10DS0098EJ0200 Rev.2.00 May 10, 2012 288M-BIT Low Latency DRAM Separate I/O Description The μPD48288109A is a 33,554,432-word by 9 bit and the μPD48288118A is a 16,777,216-word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48288109A
PD48288118A
288M-BIT
432-word
PD48288118A
216-word
R10DS0098EJ0200
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Untitled
Abstract: No abstract text available
Text: Datasheet PD48288109A μPD48288118A R10DS0098EJ0300 Rev.3.00 Oct 01, 2012 288M-BIT Low Latency DRAM Separate I/O Description The μPD48288109A is a 33,554,432-word by 9 bit and the μPD48288118A is a 16,777,216-word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48288109A
PD48288118A
288M-BIT
432-word
PD48288118A
216-word
R10DS0098EJ0300
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Untitled
Abstract: No abstract text available
Text: Datasheet PD48576109 μPD48576118 R10DS0064EJ0300 Rev.3.00 Oct 01, 2012 576M-BIT Low Latency DRAM Separate I/O Description The μPD48576109 is a 67,108,864-word by 9 bit and the μPD48576118 is a 33,554,432 word by 18 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell.
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PD48576109
PD48576118
576M-BIT
864-word
PD48576118
R10DS0064EJ0300
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Untitled
Abstract: No abstract text available
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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M8E0904E
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DDR2 Hynix 2Gb x 8
Abstract: HYMP351
Text: 240pin DDR2 VLP Registerd DIMMs based on 1Gb C version This Hynix DDR2 VLP Very Low Profile registered Dual In-Line Memory Module (DIMM) series consists of 1Gb C version DDR2 SDRAMs in Fine Ball Grid Array(FBGA) packages on a 240pin glass-epoxy substrate. This Hynix 1Gb C version based VLP Registered DIMM series provide a high performance 8 byte interface in 133.35mm width form factor of
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240pin
HYMP112P72CP8L-C4/Y5/S6
HYMP125P72CP4L-C4/Y5/S6
HYMP351P72CMP4L-C4/Y5/S6
HYMP41GP72CNP4L-C4/Y5
128Mbx72
256Mbx72
512Mbx72
1Gbx72
DDR2 Hynix 2Gb x 8
HYMP351
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Untitled
Abstract: No abstract text available
Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR264M72PBG
64Mx72
AS4DDR264M72PBG
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AS4DDR264M72PBG
Abstract: DDR2 16 meg x16 industrial
Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR264M72PBG
64Mx72
AS4DDR264M72PBG
DDR2 16 meg x16 industrial
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smd dk qk
Abstract: SMD MARKING CODE ACY smd marking codes BA5 smd marking codes BA2 RLDRAM MT49H16M18C
Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
clo68-3900
MT49H16M18C
smd dk qk
SMD MARKING CODE ACY
smd marking codes BA5
smd marking codes BA2
RLDRAM
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MT49H16M18C
Abstract: No abstract text available
Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball µBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
clo68-3900
MT49H16M18C
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smd marking codes BA5
Abstract: MT49H16M18C
Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
MT49H16M18C
smd marking codes BA5
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H5PS1G
Abstract: DDR2-533 DDR2-667 DDR2-800 RA13 256M DRAM
Text: 240pin DDR2 VLP Registerd DIMMs based on 1Gb E version This Hynix DDR2 VLP Very Low Profile registered Dual In-Line Memory Module (DIMM) series consists of 1Gb E version DDR2 SDRAMs in Fine Ball Grid Array(FBGA) packages on a 240pin glass-epoxy substrate. This Hynix 1Gb E version based VLP Registered DIMM series provide a high performance 8 byte interface in 133.35mm width form factor of
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240pin
HMP112V7EFR8C-C4/Y5/S6
128Mbx72
HMP125V7EFR4C-C4/Y5/S6
256Mbx72
HMP351V7EMR4C-C4/Y5/S6
256Mx72
HMP41GV7EHR4C
1240pin
H5PS1G
DDR2-533
DDR2-667
DDR2-800
RA13
256M DRAM
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23/HMP125U7EFR8C-C4/Y5/S6/S5
Abstract: No abstract text available
Text: 240pin Registered DDR2 SDRAM DIMMs based on 1Gb version C This Hynix Registered Dual In-Line Memory Module DIMM series consists of 1Gb version C DDR2 SDRAMs in Fine Ball Grid Array (FBGA) packages on a 240pin glass-epoxy substrate. This Hynix 1Gb version C based Registered DDR2 DIMM series provide a high performance 8 byte interface in 5.25" width
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240pin
55max
1240pin
HYMP31GP72CMP4,
HYMP151P72CP8,
HYMP125P72CP8
23/HMP125U7EFR8C-C4/Y5/S6/S5
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HYMP125P72CP8
Abstract: HYMP151P72CP4 DDR2-400 DDR2-533 HYMP31G
Text: 240pin Registered DDR2 SDRAM DIMMs based on 1Gb version C This Hynix Registered Dual In-Line Memory Module DIMM series consists of 1Gb version C DDR2 SDRAMs in Fine Ball Grid Array(FBGA) packages on a 240pin glass-epoxy substrate. This Hynix 1Gb version C based Registered DDR2 DIMM series provide a high performance 8 byte interface in 5.25" width
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240pin
55max
1240pin
HYMP31GP72CMP4,
HYMP151P72CP8,
HYMP125P72CP8
HYMP125P72CP8
HYMP151P72CP4
DDR2-400
DDR2-533
HYMP31G
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SMD d1c
Abstract: SMD MARKING CODE ACY qkx capacitor smd codes marking A21 MT49H16M18C
Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
clo68-3900
MT49H16M18C
SMD d1c
SMD MARKING CODE ACY
qkx capacitor
smd codes marking A21
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MT49H16M18C
Abstract: No abstract text available
Text: 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C Features Figure 1: 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization • 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
09005aef80a41b59/zip:
09005aef811ba111
MT49H8M18C
MT49H16M18C
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4GB 2Rx8 DDR2 SDRAM MODULE
Abstract: HYMP151
Text: 240pin Registered DDR2 SDRAM DIMMs based on 1Gb version E This Hynix Registered Dual In-Line Memory Module DIMM series consists of 1Gb version E DDR2 SDRAMs in Fine Ball Grid Array (FBGA) packages on a 240pin glass-epoxy substrate. This Hynix 1Gb version E based Registered DDR2 DIMM series provide a high performance 8 byte interface in 5.25" width
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240pin
HMP31GP7EMR4C
00MIN
55max
1240pin
4GB 2Rx8 DDR2 SDRAM MODULE
HYMP151
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