BD82HM Search Results

U3405

Contextual Info: w .c ong COM Express Basic Module ate c.co m conga-BE57 Maximum Computing Performance Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout Processor Intel® Core™ i7-610E, 2.53 GHz (32 nm process, 4MB cache, 1066 MHz, TDP 25 W, BGA package)

ASM1442

Abstract: bd82hm55 SMSC mec1308 mec1308 Intel hm55 JLCD500 HM55 CRB smsc mec1308-nu LTST-C193TBKT-AC N11X-GE1
Contextual Info: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 8. Block Diagram and Schematic D C B A 4 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL

BD82HM76

Contextual Info: Platform brief Intel Core i7 and Core™ i5 Processors with Mobile Intel® HM76 and QM77 Express Chipsets Intelligent Systems 3rd Generation Intel® Core™ i7 and Intel® Core™ i5 Processor-based Platforms for Intelligent Systems Ideal for Intelligent Systems—context-aware, securely managed embedded devices that connect seamlessly

Contextual Info: w .c ong COM Express Basic Type 6 Module ate c.co m conga-TM67 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout COM Express Type 6 CPU Intel® Core™ i7-2710QE, (4 x 2.1GHz, 8 Threads, 6 MB cache, 1600 MT/s, TDP 45 W, PGA package)

Contextual Info: ate c.co m conga-BS67 High Performance COM Express Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-2655LE, 2.20 GHz, (32 nm process, 4MB cache, 1333 MHz, TDP 25 W) Intel® Core™ i7-2610UE, 1.50 GHz, (32 nm process, 4MB cache, TDP 17 W)

Contextual Info: w .c ong COM Express Basic Type 6 Module ate c.co m conga-TS67 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout COM Express Type 6 CPU I I I I I I I Based on 2nd Generation Intel® Core™ lowpower processors Soldered CPUs for higher shock resistance

BD82HM55

Contextual Info: COM Express Basic Module c.co m conga-BM57 Maximum Computing Performance Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-620M, 2.66 GHz (32 nm process, 4MB cache, 1066 MHz, TDP 35 W, PGA package) Intel® Core™ i5-520M, 2.4 GHz (32 nm process, 3MB cache, 1066 MHz, TDP 35 W, PGA package)

FCBGA989

Abstract: FCBGA1023 BD82HM65 FCPGA988 CPU Intel Core i5-6500TE FCBGA-989
Contextual Info: Platform brief Intel Core i7, Core™ i5, and Core™ i3 processors with Intel® QM67 Express and Intel® HM65 Express Chipsets Embedded Computing 2nd Generation Intel® Core™ i7 2710QE, 2715QE, 2655LE, 2610UE , Intel® Core™ i5 (2510E, 2515E), and Intel® Core™ i3 (2310E) Processor-based

Contextual Info: ww w .c ong ate High Performance COM Express c.co m Dramatically Increased Graphics Performance Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-2710QE (SV), 2,1 GHz (32 nm process, 6MB cache, 1333 MHz, TDP 45 W, 989 rPGA package)

Contextual Info: ong COM Express Basic Type 6 Module ate c.co m conga-TS77 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout CPU Intel® Core™ i7-3615QE (4x 2.3 GHz, 6MB Cache, TDP 45W) Intel® Core™ i7-3612QE (4x 2.1 GHz, 6MB Cache, TDP 35W)