BD82QM67 Search Results

Contextual Info: w .c ong COM Express Basic Type 6 Module ate c.co m conga-TM67 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout COM Express Type 6 CPU Intel® Core™ i7-2710QE, (4 x 2.1GHz, 8 Threads, 6 MB cache, 1600 MT/s, TDP 45 W, PGA package)

Contextual Info: ate c.co m conga-BS67 High Performance COM Express Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-2655LE, 2.20 GHz, (32 nm process, 4MB cache, 1333 MHz, TDP 25 W) Intel® Core™ i7-2610UE, 1.50 GHz, (32 nm process, 4MB cache, TDP 17 W)

Contextual Info: w .c ong COM Express Basic Type 6 Module ate c.co m conga-TS67 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout COM Express Type 6 CPU I I I I I I I Based on 2nd Generation Intel® Core™ lowpower processors Soldered CPUs for higher shock resistance

FCBGA989

Abstract: FCBGA1023 BD82HM65 FCPGA988 CPU Intel Core i5-6500TE FCBGA-989
Contextual Info: Platform brief Intel Core i7, Core™ i5, and Core™ i3 processors with Intel® QM67 Express and Intel® HM65 Express Chipsets Embedded Computing 2nd Generation Intel® Core™ i7 2710QE, 2715QE, 2655LE, 2610UE , Intel® Core™ i5 (2510E, 2515E), and Intel® Core™ i3 (2310E) Processor-based

Contextual Info: ww w .c ong ate High Performance COM Express c.co m Dramatically Increased Graphics Performance Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-2710QE (SV), 2,1 GHz (32 nm process, 6MB cache, 1333 MHz, TDP 45 W, 989 rPGA package)