BGA 323 Search Results

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

337 BGA

Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –

bga 323

Abstract: MS-034 AAG-1 MS-034-AAG-1 MS-034AAG-1 FFG323
Contextual Info: R Flip-Chip BGA FF323/FFG323 Package PK236 (v1.1) March 24, 2008 323-BALL FLIP-CHIP BGA (FF323/FFG323) 2007, 2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

EP20K100E

Abstract: t25 4 j5
Contextual Info: Pin Information for the APEX EP20K100E Device Version 1.5 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin FineLine BGA FineLine BGA 356-Pin BGA 8 8 8 — 8 — 8 8 8 8 8 — 8 8

AE23

Abstract: EP20K100E
Contextual Info: EP20K100E I/O Pins ver. 1.1 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin 208-Pin 240-Pin 144-Pin TQFP PQFP PQFP FineLine 1 (1) (1) BGA 324-Pin FineLine BGA 356-Pin BGA 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8

AE23

Abstract: EP20K100E AF-1
Contextual Info: EP20K100E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – – – – 8 8 8 Pad Number Orientation Pin/Pad Function 144-Pin 208-Pin 240-Pin 144-Pin 324-Pin 356-Pin TQFP 1 PQFP (1) PQFP (1) FineLine BGA FineLine BGA BGA

AH35

Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
Contextual Info: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8

AA10

Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
Contextual Info: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8

Altera Flip Chip BGA warpage

Abstract: thick bga die size crack flip chip ajinomoto Flip Chip Substrate DSASW0010612 ansys BGA cte underfill with or without underfill
Contextual Info: Accurate Predictions of Flip Chip BGA Warpage Yuan Li Altera Corporation 101 Innovation Dr, M/S 4202 San Jose, CA 95134 ysli@altera.com, 408 544-7508 Abstract Organic flip chip BGA has been quickly adopted as the mainstream package solution for high speed, high density and

RC28F256P33BF

Abstract: JS28F256P33 PC28F256P33 pc28F256P33T RC28F256P33TF JS28F256P33BF PC28F256P33TF pc28f256p33b PC28F256P33BF PC48F4400P0TB0E
Contextual Info: Numonyx Flash Memory P33-65nm 256-Mbit, 512-Mbit (256M/256M) Datasheet Product Features „ „ „ High performance: — 95ns initial access time for Easy BGA — 105ns initial access time for TSOP — 25ns 16-word asynchronous-page read mode — 52MHz (Easy BGA) with zero wait states,

JS28F256P33

Abstract: PC28F256P33 PC28F256P33BF RC28F256P33 RC28F256P33BF JS28F256P33BF JS28F256P33TF PC48F4400P0TB0E PC28F256P33B PC28F256P33TF
Contextual Info: Numonyx AxcellTM Flash Memory P3365nm 256-Mbit, 512-Mbit (256M/256M) Datasheet Product Features „ „ „ High performance: — 95ns initial access time for Easy BGA — 105ns initial access time for TSOP — 25ns 16-word asynchronous-page read mode — 52MHz (Easy BGA) with zero wait states,

AG10

Abstract: AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528
Contextual Info: EPXA4 I/O Pins ver. 1.20 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7

B8530

Abstract: OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 672-pin
Contextual Info: EPXA4 I/O Pins ver. 1.21 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7

AA23

Abstract: AC25 EP20K160E
Contextual Info: EP20K160E I/O Pins ver. 1.4 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8

AA23

Abstract: AC25 EP20K160E
Contextual Info: EP20K160E I/O Pins ver. 1.3 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8

AA10

Abstract: AA23 EP20K200E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EP20K200E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – Pad Number Orientation Pin/Pad Function 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA

F33 1067

Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
Contextual Info: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6

337 BGA

Abstract: 547 B34 an17 c33 AM11 AM13 AN10 AN11 EP20K400C
Contextual Info: EP20K400C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 1 2 3 4 5 6 7 8 9 10

reballing

Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA BGA PROFILING BGA Ball Crack Alpha WS609 reball
Contextual Info: BGA REBALLING INSTRUCTIONS Notice Mention of third-party products is for informational purposes only and constitutes neither an endorsement nor a recommendation. Emulation Techology assumes no responsibility with regard to the performance of these products.

AM29DL32XD

Abstract: d323db 324D S29JL032 DL322 DL323 DL324 S29JL032H S29PL032J AM29DL322DB120
Contextual Info: Am29DL322D/323D/324D Data Sheet For new designs involving TSOP packages, S29JL032H supersedes Am29DL32xD and is the factory-recommended migration path. Please refer to the S29JL032H Datasheet for specifications and ordering information. For new designs involving Fine-pitch BGA FBGA packages, S29PL032J supersedes Am29DL32xD and is the

292 MAPBGA

Abstract: cluster stepper motor pp e MC9S12XHZ256 MC9S12XHZ512 HCS12X MC9S12XHZ384 S12XE S12XEETX4KV2 BA 508 C0 S12XMMCV3
Contextual Info: Data Sheet Covers MC9S12XHZ384, MC9S12XHZ256 HCS12X Microcontrollers MC9S12XHZ512 Rev. 1.05 11/2008 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not

IPC-9702

Abstract: ipc 9702 Strain gage report bga dye pry black pad strain gage strain gage test IPC9702 4 MUD FR4 1.6mm substrate
Contextual Info: FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev Altera Corporation, San Jose, CA, USA abansal@altera.com ABSTRACT PCB assembly and handling operations involving excessive

MCF52236CAF50

Abstract: MC52233 Bosch HFM 8 Bosch hfm 6 MCF52235 Bosch hfm integr MCF52230 MCF52232 MCF52233
Contextual Info: Devices Supported: MCF52230 MCF52231 MCF52232 MCF52233 MCF52234 MCF52235 MCF52236 Document Number: MCF52235RM Rev. 6 07/2010 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not