BGA 37X37 Search Results

D1065

Abstract: Chomerics* T-405 BERGQUIST softface Chomerics* T405 Chomerics T710 tape BGA 21x21 ARCLAD 8223 Chomerics T710 D10650-40 D10650-40 datasheet
Contextual Info: Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX BGA Sizes Foot Print mm Heat Sink Height (inches) Series # Solution Page # Attachment Method 21mm 21mm 25mm 27mm 35mm 35mm 37mm 37mm 40mm 40mm 40mm 40mm 45mm 45mm 45mm 45mm 45mm 45mm 21x21

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

Contextual Info: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]

16X16

Abstract: bga 576 socket bga 24x24 576
Contextual Info: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00

Contextual Info: 6 M 2:1 37 1,8 37 M (1:1)  Schutzvermerk gemäß DIN ISO 16016 beachten Fischer Elektronik GmbH & Co. KG 2006 Freimasstoleranz Oberfläche DIN ISO 2768m SA Datum Erst. 28.09.2006 Bearb. 28.09.2006 Werkstoff / Material AlMgSi0,5 F22 (EN AW 6060 T66) Z. Änderungen

Contextual Info: 10 M 2:1 37 1,8 37 M (1:1)  Schutzvermerk gemäß DIN ISO 16016 beachten Fischer Elektronik GmbH & Co. KG 2006 Freimasstoleranz Oberfläche DIN ISO 2768m SA Datum Erst. 29.09.2006 Bearb. 29.09.2006 Werkstoff / Material AlMgSi0,5 F22 (EN AW 6060 T66) Z. Änderungen

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

TSTI01

Contextual Info: Data Sheet October 1993 microelectronics group Lucent Technologies Bell Labs Innovations ATT2X01 Twisted-Pair Transceiver Chip Flying Dutchman Features Applications • 100 Mblts/s ■ High-speed local area networks ■ Single +5 V supply ■ The ATT2X01 can be used in all 100Base-VG net­

ATT2MD12

Abstract: att2x02
Contextual Info: Data Sheet August 1996 m ic ro e le c tro n ic s group Lucent Technologies Bell Labs Innovations ATT2X02 100VG-AnyLAN Twisted-Pair Transceiver Chip Features Description and Applications • Supports the IEEE" 802.12 100VG-AnyLAN speci­ fication. The ATT2X02 is a CMOS Integrated Circuit imple­

44-PIN

Abstract: ATT2X01 DD22 BGA 37X37 ic cd 4060 pin diagram
Contextual Info: Data Sheet October 1993 microelectronics group Lucent Technologies Bell Labs Innovations ATT2X01 Twisted-Pair Transceiver Chip Flying Dutchman Features Applications • 100 Mblts/s ■ High-speed local area networks ■ Single +5 V supply ■ The ATT2X01 can be used in all 100Base-VG net­

PLESSEY CLA

Abstract: gh160 FG48
Contextual Info: FEBRUARY 1996 PRELIMINARY INFORMATION DS4375-1.1 CLA90000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION BENEFITS The CLA90000 series is the latest family of gate arrays from GEC Plessey Semiconductors GPS . It consists of 14 fixedsize arrays with the option of building larger optimized arrays

net eN8

Abstract: BQFP-84
Contextual Info: Data Sheet January 1994 m ic r o e l e c t r o n i c s group Lucent Technologies Bell Labs Innovations Description • Twelve 10Base-T transmitters The T7241A Multiple Ethernet Transmitter METRX is intended for use with theT7202 Smart Hub Con­ troller as part of a two-chip solution to IE E E ' 802.3

3776a

Abstract: TXC10 TXC10 M 60 4085bc ATT1S04 CRS11 A87L 54871 att1rx04
Contextual Info: Data Sheet August 1996 m i c r o e l e c t r o n i c s group Lucent Technologies Bell Labs Innovations Features and Benefits Description • A circuit switch supporting 12 ports and providing independent connection to 1 of 4 segmented Ethernet environments:

TXC10 M 60

Abstract: TXC10
Contextual Info: Data Sheet August 1996 m i c r o e l e c t r o n i c s group Lucent Technologies Bell Labs Innovations Features and Benefits Description • A circuit switch supporting 12 ports and providing independent connection to 1 of 4 segmented Ethernet environments:

TXC10 M 60

Abstract: TXC10 A87L 3776a TXC10 m ATT1S04 CRS11 ATT1RX04
Contextual Info: Data Sheet August 1996 m i c r o e l e c t r o n i c s group Lucent Technologies Bell Labs Innovations Features and Benefits Description • A circuit switch supporting 12 ports and providing independent connection to 1 of 4 segmented Ethernet environments:

"84 pin qfp"

Abstract: S002B advantages for ic 7473 Lucent 2623
Contextual Info: Data Sheet November 1995 microelectronics group Lucent Technologies Bell Labs Innovations ATT2M01 100VG-AnyLAN Media Access Controller MAC Features and Benefits Description • Supports the proposed IEEE' 802.12 100VGAnyLAN specification (as ot January 1994).

t7351

Abstract: DD231 T7352 T7351B-FC
Contextual Info: Data Sheet January 1994 microelectronics group Lucent Technologies Bell Labs innovations T7351B/T7352 FDDI/TPDDI Physical Layer Devices Features Description • Single-chip FDDI physical layer PHY solution The T7351B FDDI/T7352 TPDDI Physical Layer Devices are single VLSI components that implement

mac 226

Abstract: ATT2M01 ATT2MD01 ATT2MD11 ATT2X01 "84 pin qfp" MAC layer sequence number algorithmic cam
Contextual Info: Data Sheet November 1995 m i c r o e l e c t r o n i c s group Lucent Technologies Bell Labs Innovations ATT2M01 100VG-AnyLAN Media Access Controller MAC Features and Benefits Description • Supports the proposed IEEE' 802.12 100VGAnyLAN specification (as ot January 1994).

Contextual Info: Preliminary Data Sheet August 1996 m icroelectronics Lucent Technologies Bell Labs Innovations group o LUC3X01 100Base-T4 Physical Layer Device Features and Benefits Description • VLSI CMOS Physical Layer Device supports the IEEE' 802.3u, 100Base-T4 CSMA/CD specifica­

LUC3X01

Abstract: sv 3747 isolation transformer TX15 Ternary CAM
Contextual Info: Preliminary Data Sheet August 1996 m i c r o e l e c t r o n i c s group Lucent Technologies Bell Labs Innovations o Description • VLSI CMOS Physical Layer Device supports the IEEE' 802.3u, 100Base-T4 CSMA/CD specifica­ tion. The LUC3X01 device implements the physical layer

DD221

Abstract: IS002 att2md01 BD 535H T7213 EC T7213
Contextual Info: Data Sheet January 1995 m ic ro e le c tro n ic s group Lucent Technologies Bell Labs Innovations ATT2MD01 100VG/10Base-T MAC and EISA/ISA System Interface Features and Benefits ISA bus compatibility addresses the embedded base. — 8 Mbytes/s transfer rate.

Contextual Info: Data Sheet September 1995 microelectronics group Lucent Technologies Bell Labs Innovations Features • A highly integrated four-repeater architecture will sim­ plify the design of a wide range of N-port by M-segment circuit-switched hubs. The ATT1RX04 places no restrictions on the values of N and M mak­

relay lad1

Abstract: lad1 relay CNT17 OVF20 2451B LA01 sia to sms ATT1S04 LS259 54-057
Contextual Info: Data Sheet September 1995 m ic r o e le c t r o n ic s group Lucent Technologies Bell Labs Innovations Features • A highly integrated four-repeater architecture will sim­ plify the design of a wide range of N-port by M-segment circuit-switched hubs. The ATT1RX04

Bulk Decoupling 430TX

Abstract: Socket-7 296 430TX Configuration 273232 SL Enhanced GC80503CSM66166 FV80503
Contextual Info: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)