BGA 686 FOOTPRINT Search Results

Contextual Info: New High Density SMT B2B Board to Board Connectors Superior Features Designed-In For Long Term Reliability and Robust Handling Shrouded Design – protects exposed male pins during handling and provides positive polarization to aid in blind mating applications

b13193

Abstract: XCR3256XL 614E-13 CS280 DS012 DS013 PQ208 TQ144 208pin T1648
Contextual Info: R DS013 v1.2 May 3, 2000 XCR3256XL 256 Macrocell CPLD 14 Preliminary Product Specification Features Description • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,000 usable gates • Available in small footprint packages

Contextual Info: Cyclone V Device Overview 2013.05.06 CV-51001 Subscribe Feedback The Cyclone V devices are designed to simultaneously accommodate the shrinking power consumption, cost, and time-to-market requirements; and the increasing bandwidth requirements for high-volume and

Contextual Info: Cyclone V Device Overview 2013.12.26 CV-51001 Subscribe Send Feedback The Cyclone V devices are designed to simultaneously accommodate the shrinking power consumption, cost, and time-to-market requirements; and the increasing bandwidth requirements for high-volume and

footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5

footprint jedec MS-026 TQFP

Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

atmel 0328

Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
Contextual Info: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

7F7F7F0B00000000

Abstract: PC2-5300 PC2-6400 NT512T64UH8B0FN NT1GT64U8HB0BN-3C 32MX16
Contextual Info: NT256T64UH4B0FN / NT512T64UH8B0FN NT1GT64U8HB0BN 256MB: 32M x 64 / 512MB: 64M x 64 / 1GB: 128M x 64 PC2-4200 / PC2-5300 / PC-6400 Unbuffered DDR2 SO-DIMM 200 pin Unbuffered DDR2 SO-DIMM Based on DDR2-533/667/800 32Mx16/64Mx8 SDRAM B-Die Features • Performance:

Contextual Info: DLP5500 www.ti.com DLPS013D – APRIL 2010 – REVISED OCTOBER 2012 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors XGA Resolution

DAP11

Abstract: 450-2.700-L-13.25-149 420nm DAp15 DAN7 DLPS014 DLPR200 amphenol usb connector E2G3 micromirror
Contextual Info: DLP5500 www.ti.com DLPS013C – APRIL 2010 – REVISED JUNE 2012 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors XGA Resolution

Contextual Info: DLP5500 www.ti.com DLPS013E – APRIL 2010 – REVISED SEPTEMBER 2013 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors

DAP11

Abstract: 45027
Contextual Info: DLP5500 www.ti.com DLPS013C – APRIL 2010 – REVISED JUNE 2012 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors XGA Resolution

Contextual Info: DLP5500 www.ti.com DLPS013E – APRIL 2010 – REVISED SEPTEMBER 2013 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors

450-2.700-L-13.25-149

Abstract: micromirror digital micromirror
Contextual Info: DLP5500 www.ti.com DLPS013D – APRIL 2010 – REVISED OCTOBER 2012 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors XGA Resolution

Contextual Info: DLP5500 www.ti.com DLPS013E – APRIL 2010 – REVISED SEPTEMBER 2013 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors

NT1GT64U8HB0BN-3C

Abstract: PC2-5300 NT512T64UH8B0FN-37B
Contextual Info: NT256T64UH4B0FN / NT512T64UH8B0FN / NT1GT64U8HB0BN NT256T64UH4B0CN / NT512T64UH8B0CN / NT1GT64U8HB0AN 256MB: 32M x 64 / 512MB: 64M x 64 / 1GB: 128M x 64 PC2-4200 / PC2-5300 / PC-6400 Unbuffered DDR2 SO-DIMM 200 pin Unbuffered DDR2 SO-DIMM Based on DDR2-533/667/800 32Mx16/64Mx8 SDRAM B-Die

d151811

Abstract: 226 20K 340 A23 851 diode ep20k400 esab compact 125 bga 529 EPF20K100 AM2 Processor Functional Data Sheet resistor PC 817 data sheet BGA and QFP Package
Contextual Info: APEX 20K Programmable Logic Device Family November 1999, ver. 2.05 Features. Data Sheet • Preliminary Information ■ Industry’s first programmable logic device PLD incorporating System-on-a-Programmable-ChipTM integration – MultiCoreTM architecture integrating look-up table (LUT) logic,

am3 938 pinout

Abstract: MA 573 U18 524 BN 672 M3
Contextual Info: APEX 20K Programmable Logic Device Family March 2000, ver. 2.06 Data Sheet Features. • Preliminary Information ■ Industry’s first programmable logic device PLD incorporating system-on-a-programmable-chip integration – MultiCoreTM architecture integrating look-up table (LUT) logic,

TI 35X35 BGA 368 BGA

Abstract: EPF20K
Contextual Info: APEX 20K Programmable Logic Device Family November 1999. ver. 2.05 FeatU r6S D atasheet P re lim in a r y In fo rm a tio n • Industry's first program m able logic device PLD incorporating System -on-a-Program m able-Chip integration M ultiCore™ architecture integrating look-up table (LUT) logic,

maxim 8770

Abstract: ds3600 DS3640 DS3645 rtc tamper detection sensors ds3605 dallas semiconductor ds3655 DS3641 military switch DS1375
Contextual Info: Real-Time Clocks 1st Edition June 2009 A real-time clock for every need No matter what your system requires of a real-time clock, the variety of choices at Maxim will help you find the ideal RTC for your application. We offer more interface options and more value-added features, such

Contextual Info: SN74CBT16214 12-BIT 1-OF-3 FET MULTIPLEXER/DEMULTIPLEXER SCDS008L – MAY 1993 – REVISED NOVEMBER 2001 D D D DGG OR DL PACKAGE TOP VIEW Member of the Texas Instruments Widebus Family 5-Ω Switch Connection Between Two Ports TTL-Compatible Input Levels

BC 100NK 400V

Abstract: capacitor da 102m capacitor 100nk 100v capacitor 100nk 63v 200nf 200v ceramic capacitors capacitor, 2200 microfarad 25v BH film CAPACITORS skycap 100nk smd transistor marking x5t
Contextual Info: AVX Periodic Tables Periodic Tables www.avx.com Version 8.1 – Spring 2008 THE PERIODIC TABLES The Latest CV Tables from the Leader in Capacitor Technology If you would like to receive a mailed copy of this document each time it is printed, e-mail us at lit@avxus.com with your mailing address.

M2S4G64CB

Contextual Info: M2S2G64CB88D5N / M2S4G64CB8HD5N 2GB: 256M x 64 / 4GB: 512M x 64 PC3-8500 / PC3-10600 Unbuffered DDR3 SO-DIMM Based on DDR3-1066/1333 256Mx8 SDRAM D-Die Features •Performance: Speed Sort PC3-8500 PC3-10600 -BE -CG Unit DIMM CAS Latency 7 9 fck – Clock Freqency

NT4GC64B8HD0NS

Contextual Info: NT2GC64B88D0NS / NT4GC64B8HD0NS 2GB: 256M x 64 / 4GB: 512M x 64 PC3-8500 / PC3-10600 Unbuffered DDR3 SO-DIMM Based on DDR3-1066/1333 256Mx8 SDRAM D-Die Features •Performance: Speed Sort PC3-8500 PC3-10600 -BE -CG Unit DIMM CAS Latency 7 9 fck – Clock Freqency