BGA 6X8 PACKAGE Search Results

intel 28f160

Abstract: bga 6x8 Package 48440 bga 6x8 28F160
Contextual Info: M4226 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: REPLACEMENT SOCKET: 484401BG6YAM8/16 AS-48-44-01BG-6YAM-8/16 S-BGA-6X8-048-A CONNECTION TABLE: Call Emulation Technology for a replacement socket price and delivery quote.

bga 6x8 Package

Abstract: DIP40 package 28F008 DIP40 DIP30 a5 gnd 700
Contextual Info: M4229 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: 404001BG6YAM AS-40-40-01BG-6YAM-8/16 REPLACEMENT SOCKET: S-BGA-6X8-048-A Call Emulation Technology for a replacement socket price and delivery quote. CONNECTION TABLE:

intel C4 package

Abstract: F4334 DIP40 a5 gnd 700
Contextual Info: M4334 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: 484001BG6YAMNS AS-48-40-01BG-6YAM-8/16 REPLACEMENT SOCKET: S-BGA-6X8-48-A Call Emulation Technology for a replacement socket price and delivery quote. CONNECTION TABLE:

S25FL256

Abstract: S25FL512 S98GL064 S25FL256* spansion S98GL064NB S98GL064NB0 S25FL204 s25fl128s S25FL129 S25FL032K
Contextual Info: Spansion Product Selector Guide April 2012 Spansion ® Products Portfolio Spansion offers a wide range of NOR Flash memory solutions in multiple voltages, densities and packages expressly designed and optimized for embedded and mobile applications, including:

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

PF38F4050L0YBQ0

Abstract: R2528 PF38F4050 RD48F4400 RD48F4400L0 Intel SCSP GE28F256K18C PF48F4400L NP378 PF48F4400L0
Contextual Info: Listing of Tools US Home | Intel Worldwide Where to Buy | Training & Events | Contact Us | About Intel Search Developer site Enter keywords Electronic Tools Catalog: Intel Flash Memory Components Intel® Flash Memory Programmer Intel Corp. FPG Architecture: Flash Memory Components

CABGA 6x6

Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
Contextual Info: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is

LP62S1664CU-55LLTF

Contextual Info: LP62S1664C Series 64K X 16 BIT LOW VOLTAGE CMOS SRAM Document Title 64K X 16 BIT LOW VOLTAGE CMOS SRAM Revision History History Issue Date Remark 0.0 Initial issue February 19, 2002 Preliminary 1.0 Final version release July 16, 2003 Final 1.1 Add Pb-Free package type

Contextual Info: IS25CQ256 256 Megabit Single Operating Voltage Serial Flash Memory with 4Kbyte Uniform Sector FEATURES • Single power supply operation - Full voltage range: 2.70-3.60V • 256 M-bit Serial Flash - 256 M-bit/32,768 K-byte/131,072 pages - 256 bytes per programmable page

Contextual Info: IS25CQ064 64 Megabit Single Operating Voltage Serial Flash Memory with 4Kbyte Uniform Sector FEATURES • Single power supply operation - Full voltage range: 2.70-3.60V • 64 M-bit Serial Flash - 64 M-bit/8192 K-byte/32768 pages - 256 bytes per programmable page

Contextual Info: LP62S1664C Series 64K X 16 BIT LOW VOLTAGE CMOS SRAM Document Title 64K X 16 BIT LOW VOLTAGE CMOS SRAM Revision History History Issue Date Remark 0.0 Initial issue February 19, 2002 Preliminary 1.0 Final version release July 16, 2003 Final 1.1 Add Pb-Free package type

Contextual Info: IS25CQ128 128 Megabit Single Operating Voltage Serial Flash Memory with 4Kbyte Uniform Sector FEATURES • Single power supply operation - Full voltage range: 2.70-3.60V • 128 M-bit Serial Flash - 128 M-bit/16,384 K-byte/65,536 pages - 256 bytes per programmable page

EM564161

Contextual Info: EtronTech EM564161 256K x 16 Low Power SRAM Rev 3.1 Features Pin Configuration • Single power supply voltage of 2.3V to 3.6V • Power down features using CE1# and CE2 48-Ball BGA CSP , Top View • Low power dissipation • Data retention supply voltage: 1.0V to 3.6V

SF-PLCC84-J-01

Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
Contextual Info: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.

MX29GL256

Abstract: 28F512P30 Numonyx M29W256G 28F00AP30 w25q128 MX25L6445 28F00AM29EW M29DW127G 28F128P30 PF38F3040M0Y3D
Contextual Info: Spansion NOR Flash Memory Competitive Cross Reference Guide December 2009 Parallel 1.8V Density Voltage Bus Mb (V) VIO (V) Type Bus Sector Width Type # Initial Access Burst Speed Banks Times (ns) (MHz) Packages Temp Range Recommended Pin Software Spansion OPN Compatible Compatible Notes

bga 6x8

Contextual Info: A62S7308 Series 128K X 8 BIT LOW VOLTAGE CMOS SRAM Document Title 128K X 8 BIT LOW VOLTAGE CMOS SRAM Revision History Rev. No. History Issue Date Remark Preliminary 0.0 Initial issue June 03, 1998 0.1 Modify sTSOP 32L type package LE symbol dimensions. June 16, 1998

bga 6x8

Abstract: EM564081 EM564081BA-70 EM564081BA-70E EM564081BA-85 EM564081BC-70 EM564081BC-70E EM564081BC-85 EM564081BC-85E
Contextual Info: EtronTech EM564081 512K x 8 Low Power SRAM Preliminary, Rev 0.7 01/2001 Features Pin Configuration • Single power supply voltage of 2.3V to 3.6V 36-Ball BGA CSP , Top View • Power down features using CE1# and CE2 • Low power dissipation • Data retention supply voltage: 1.0V to 3.6V

bga 6x8

Abstract: EM564166 EM564166BC-70 bga 6x8 Package
Contextual Info: EtronTech EM564166 256K x 16 Low Power SRAM Preliminary, Rev 1.0 Features Pin Configuration • Single power supply voltage of 2.3V to 3.6V • Power down features using CE# 48-Ball BGA CSP , Top View • Low power dissipation • Data retention supply voltage: 1.0V to 3.6V

Etron Technology

Abstract: EM562166BC-55 EM562166BC-70
Contextual Info: EtronTech EM562166 128K x 16 Low Power SRAM Rev 1.5 04/2007 48-Ball BGA CSP , Top View Features • Single power supply voltage of 2.7V to 3.6V • Power down features using CE • Low operating current : 30mA(max for 55 ns) • Maximum Standby current : 35µA at 3.6 V

led matrix circuits

Abstract: bga48 48-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.

9803

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M10 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M10 48-pin plastic BGA (BGA-48P-M10) Note: The actual shape of coners may differ from the dimension.

WSON 6x8 socket

Abstract: LEAPER-48 LP48-WSON8-5 ae001 leaper vQFP 128 pin Socket LP48-TSOP-56M-R bga TSOP 48 socket tSSOP 56 socket LP48-SDIP-42PIN
Contextual Info: 6F-4, N0. 4, Lane 609, Sec. 5, Chung Hsin Rd., San Chung City, Taipei Hsien, Taiwan, R. O. C. http: //www.leap.com.tw E-mail: service@leap.com.tw Tel: 886-2-2999-1860 Fax:886-2-2999-9873 Adaptor/Converter Price List PLCC PACKAGE Item No. Model Description

S25FL129

Abstract: S98GL064NB0 S98GL064 s29gl256p90 S70FL256 S98GL064NB s71vs128 S25FL129P WSON 6x8 S25FL032K
Contextual Info: Spansion Product Selector Guide Embedded and Mobile Applications Portfolio March 2011 Spansion ® Products Portfolio . Automotive . Consumer electronics . Gaming . Industrial equipment . Machine-to-Machine Spansion offers a wide range of NOR Flash memory solutions in multiple voltages,