BGA48 Search Results

BGA480B

Abstract: LS-BGA480B-11
Contextual Info: BGA480B Tooling hole X2 0.64mm [0.025"] Ø 0.40mm hole [Ø 0.016"] 0.89mm [0.035"] See BGA pattern code to the right for actual pattern layout Y 1.27mm typ. [0.050"] 35.56mm [1.400"] Top View (reference only) X Ø 0.62mm [Ø 0.025"] pad 0.64mm [0.025"] 1

land pattern 484 BGA

Abstract: 0.4mm pitch BGA pitch 0.4mm BGA 22X22 SF-BGA484C-B-11
Contextual Info: C Package Code: BGA484C D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 21.00mm [0.827"] 1.00mm pitch typ. X Top View (reference only) 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]

Contextual Info: T-BGA480-3535-1.27C6 Uniti m Dec.2003

BGA48

Abstract: DIP-40
Contextual Info: AE-B48-8SP1 Page 1 of 2 AE-B48-8SP1 DIP40/BGA48 specialized adapter for FLASH memory. Device package dimensions: 10.0 x 6.0 x 1.0 mm, 0.8 mm pitch Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z ChipProg+

Contextual Info: Package outline BGA485: plastic ball grid array package; 485 balls SOT1047-1 B D D1 A ball A1 index area E1 E A2 A A1 detail X e1 e AF AD AB Y V T P M K H F D B 1/2 e ∅v ∅w b M M C C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 shape 2 optional 4x

Contextual Info: Adapters - Phyton, Inc. Page 1 of 2 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Downloads All Programmers Products E-Shop Support Contact News Site Map AE-B48-NM1 DIP48/BGA48 specialized adapter for FLASH memory.

Contextual Info: Adapters - Phyton, Inc. Page 1 of 2 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Downloads All Programmers Products E-Shop Support Contact News Site Map AE-B48-16NM1 DIP40/BGA48 specialized adapter for FLASH memory.

bga48

Abstract: BOX21151 LS-BGA48N-61 pitch 0.75mm BGA
Contextual Info: Tooling hole X2 BGA48N 5.25mm [0.207"] See BGA pattern code to the right for actual pattern layout Y 3.75mm [0.148"] 0.75mm typ. Top View (reference only) X Ø 0.41mm [Ø 0.016"] 3.52mm [0.139"] BGA pad 1.93mm [0.076"] 1 0.20mm [0.008"] dia. Top View of Land Pattern

bga48

Abstract: SF-BGA48M-B-11 0.4mm pitch BGA
Contextual Info: C Package Code: BGA48M D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 6.00mm [0.236"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.50mm [0.020"] 1.00mm pitch typ. 0.508 mm [0.020"]

SF-BGA480B-B-11

Abstract: BGA480B
Contextual Info: D Package Code: BGA480B C 35.56mm [1.400"] 4.14mm [0.163"] See BGA pattern code to the right for actual pattern layout Y 4.19mm [0.165"] X 1.27 mm [0.050"] 29X29X5 array 35.56mm [1.400"] Top View (reference only) 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

BGA48

Abstract: 74HC573 DIP-40 c418
Contextual Info: AE-B48-16SP1 Page 1 of 2 AE-B48-16SP1 DIP40/BGA48 specialized adapter for FLASH memory. Device package dimensions: 10.0 x 6.0 x 1.0 mm, 0.8 mm pitch Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z ChipProg+

DIP48

Abstract: BGA48 BGA 48 "8 x 8" memory AE-B48-SP2 A219 G1E2 BGA-481 adapter bga48
Contextual Info: AE-B48-SP2 Page 1 of 2 AE-B48-SP2 DIP48/BGA48 specialized adapter for FLASH memory. Device package dimensions: 8.15 x 6.15 x 1.0 mm, 0.8 mm pitch Click the programmer model below to get an appropriate list of the devices supported by the adapter: z ChipProg-48, ChipProg-G4

Contextual Info: P-BGA48-10 1 2 -1 .00AZ Unit mm P-BGA48-10 1 2 -1 .00AZ Unit 10.0010.1 ^ 0 . 1 5 | s | b] -4 ^ 0 .1 5 15 1A~| 4X \n\o.2\ ¡1 / / 10 . 3 5 1S | U U U ITZ7- I£7| 0.11S | | [5 .0 0 [ o75o1 rrooi O <p IO 0 - & O O o o o o IO o o|o o-eo o io o o O Ol°_o o o o |o o-eO OiO o o

Contextual Info: P-BGA48-1014-1 .OOAZ U nit : mm P-BGA48-1014-1 .OOAZ U nit : mm

pitch 0.4mm BGA

Abstract: 1299b 34X34 SF-BGA480E-B-11
Contextual Info: C Package Code: BGA480E D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 1.00mm pitch typ. 33.00mm [1.299"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.50mm [0.020"] 2 0.508 mm

AE-B48-16SP2

Abstract: 74HC573 DIP-40
Contextual Info: AE-B48-16SP2 Page 1 of 2 AE-B48-16SP2 DIP40/BGA48 specialized adapter for FLASH memory. Device package dimensions: 8.15 x 6.15 x 1.0 mm, 0.8 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z

DIP48

Abstract: BGA48 phyton ChipProg-G4 BGA-48
Contextual Info: AE-B48-MX3 Page 1 of 2 AE-B48-MX3 DIP48/BGA48 specialized adapter for FLASH memory. Device package dimensions: 8.0x 6.0 x 1.3 mm, 0.8 mm pitch Click the programmer model below to get an appropriate list of the devices supported by the adapter: z ChipProg-48, ChipProg-G4

AE-B48-SP1

Abstract: DIP48
Contextual Info: AE-B48-SP1 Page 1 of 2 AE-B48-SP1 DIP48/BGA48 specialized adapter for FLASH memory. Device package dimensions: 10.0 x 6.0 x 1.0 mm, 0.8 mm pitch Click the programmer model below to get an appropriate list of the devices supported by the adapter: z ChipProg-48, ChipProg-G4

LA-BGA-8260-S-B-01

Contextual Info: 3.175" E D 1.035" C A 3.050" JTAG 2 1 0.415" 10 9 Top View 0.810" 0.765" LS-BGA480B-02 1 Substrate: 0.102"±0.008" FR4/G10 or equivalent high temp material. 0.301" 0.345" Fully Seated 0.480" 1 0.155" 0.297" 2 0.095" FullyPlugged Side View SF-BGA480B-B-01 3

dip40 package

Abstract: 74HC573 DIP-40
Contextual Info: AE-B48-16SST1 Page 1 of 2 AE-B48-16SST1 DIP40/BGA48 specialized adapter for FLASH memory. Device package dimensions: 8.0 x 6.0 x 1.1 mm, 0.8 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z

74HC573 DATASHEET

Abstract: 74HC573 DIP-40 D412
Contextual Info: AE-B48-16MX3 Page 1 of 2 AE-B48-16MX3 DIP40/BGA48 specialized adapter for FLASH memory. Device package dimensions: 8.0x 6.0 x 1.3 mm, 0.8 mm pitch Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z ChipProg+

SF-BGA480C-B-11

Contextual Info: D Package Code: BGA480C C .0225" dia. tooling holes X2 non plated (optional) 0.624mm See BGA pattern code to the right for actual pattern layout Y 0.878mm 0.025" dia. pad X 31.75mm Top View (reference only) 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.635mm

bga 484 0.8mm pitch

Abstract: land pattern 484 BGA SF-BGA484B-B-11 BGA484B
Contextual Info: D Package Code: BGA484B C .0225" dia. tooling holes X2 non plated (optional) 0.624mm See BGA pattern code to the right for actual pattern layout Y 0.878mm 0.025" dia. pad X 31.75mm Top View (reference only) 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 0.635mm

Contextual Info: Very Low Power CMOS SRAM 2M X 8 bit BS62LV1600 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 46mA Max. at 55ns