BGA 7X7 Search Results

sn63pb37 solder wire

Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Contextual Info: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen

BG329

Abstract: BGA 27X27 pitch
Contextual Info: EIA Standard Layout of Solder Pad for BGA Devices Figure 1: Suggested Board Layout of Soldered pads for BGA Packages Tabel 1 contains the recommended board layout soldered pad dimension for Actel CS and GA BGA packages only. Table 1: Recommended PCB Design Guidelines

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

DIN 13715

Abstract: 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP
Contextual Info: Ultra-Low Power SRAMs Density Mb Organization Voltage Range Speed (ns) Features Package N08L6182A Part Number 8 512 Kb x 16 1.65 - 2.2 70 Dual CE 48-BGA N08L63W2A 8 512 Kb x 16 2.3 - 3.6 70 Dual CE 48-BGA N04L63W2A 4 256 Kb x 16 2.3 - 3.6 55 Dual CE 44-TSOP2, 48-BGA

ADV0505

Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Contextual Info: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The

132-ball

Abstract: via antipad pitch micro pitch BGA LC4256ZE MN64 4000ZE drill market LC4256ZEMN144 UMN64 stackup
Contextual Info: LOW COST BOARD LAYOUT TECHNIQUES FOR DESIGNING WITH PLDS IN BGA PACKAGES A Lattice Semiconductor White Paper July 2010 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Low Cost Board Layout Techniques for Designing with PLDs in BGA Packages

SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Contextual Info: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.

Recommended land pattern smd-0.5

Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
Contextual Info: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout

NEC VR4300

Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
Contextual Info: High Performance! Contents 目次 1. BGA とは？ ―――――――――――――― 3 2. NEC の BGA は？ ―――――――――――― 3 3. 特徴 ―――――――――――――――――― 4 4. パッケージ写真 ――――――――――――― 6

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

NP351

Abstract: NP351-064-148 NP351-180-139 212207 NP351-21653 NP351-064-227 X3640 np351-532 AC-28179 ac14425
Contextual Info: Series NP351 BGA / CSP 0.80mm Pitch TH - Open Top Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Contact Force: Mating Cycles: 1,000MΩ min. at 100V DC 100V AC for 1 minute

SG-BGA-6018

Abstract: PCB Layout
Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer

SF-PLCC84-J-01

Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
Contextual Info: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.

SG-BGA-6100

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer

A3232

Abstract: bga 7x7 CSP2 BGA thermal resistance 6x8 bga 6x8 Package BGA 48 PACKAGE thermal resistance
Contextual Info: FBGA Chip Scale BGA Encapsulant Au Wire Die Mold Resin Die Au Wire Polyimide Tape Substrate Solder Laminate Substrate Solder Ball Die Attach Super CSP Si Al SON BCC™ Leadless Redistribution Line Cu Leadframe Metal post (Cu/Barrier) Polyimide Layer SiN

12x12 bga thermal resistance

Abstract: PC13892VL IMX51 application notes PC13892 supercap balance
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892 in 139, 186 MAPBGA packages.

bga48

Abstract: SF-BGA48M-B-11 0.4mm pitch BGA
Contextual Info: C Package Code: BGA48M D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 6.00mm [0.236"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.50mm [0.020"] 1.00mm pitch typ. 0.508 mm [0.020"]

MC13892VL

Abstract: M13892 MC13892 PC13892VL i.mx51 FC135 MC13892 registers MICRO CRYSTAL CC7V-T1A 32,768Khz VLS252012 MC13892VK
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892VK and MC13892VL in 139, 186 MAPBGA packages.

Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892VK and MC13892VL in 139, 186 MAPBGA packages.

circuit diagram for Coin based mobile battery charger

Abstract: 12x12mm BGA package thermal resistance SW2800
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892VK and MC13892VL in 139, 186 MAPBGA packages.

circuit diagram for Coin based mobile battery charger

Abstract: coin box mobile charger circuit diagram MC13892AJVK Coin based mobile battery charger circuit diagram MC13892J coin operated battery charger data CS 20A SW2800
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892*VK and MC13892*VL in 139, 186 MAPBGA packages.

MC13892 registers

Abstract: SW-228
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892*VK and MC13892*VL in 139, 186 MAPBGA packages.

circuit diagram for Coin based mobile battery charger

Abstract: xtal2 32.768
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892*VK and MC13892*VL in 139, 186 MAPBGA packages.

Contextual Info: MX23L3212 32M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 4M x 8 byte mode - 2M x 16 (word mode) • Fast access time - Random access:90ns(max.) • Current - Operating:16mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (7.0mm x 7.0mm, ball pitch